WO2009157704A2

WO2009157704A2 - Led package and manufacturing method for same

Info

Publication number: WO2009157704A2
Application number: PCT/KR2009/003394
Authority: WO
Inventors: 이재영; 임현철; 정상동
Original assignee: 주식회사 에이엠오
Priority date: 2008-06-25
Filing date: 2009-06-24
Publication date: 2009-12-30
Also published as: KR101032414B1; WO2009157704A3; KR20100003326A

Abstract

The present invention relates to an LED package in which heat generated from LEDs for lighting is efficiently dissipated to maximize the light emitting characteristics and lifespan thereof, and to a manufacturing method for same. The LED package of the present invention includes a plurality of LEDs, a board, and a heat conduction unit. The board is formed into a polygonal shape, has one surface on which wiring is arranged to apply power to the plurality of LEDs, and is mounted with the plurality of LEDs. The heat conduction unit is tightly arranged on an inner surface of the board, and is in contact with ambient air.

Description

LED package and manufacturing method

The present invention relates to an LED package and a method of manufacturing the same, and more particularly, to an LED package and a method of manufacturing the same by maximizing the light emission characteristics and lifespan by efficiently dissipating heat generated from the lighting LED.

Generally, in order to use LED (Light Emitting Diode) as a white light source for lighting, red, green, and blue LEDs are packaged as one and emit white light by three-way light (in this case, The voltage and current applied to each LED must be precisely adjusted so that the illumination of each light is uniform.), And the light emitted from the blue or yellow LED passes through the yellow or blue phosphor so that the short wavelength is light of various wavelengths. By changing to, a pseudo white is obtained, or a near-ultraviolet ray passes through a phosphor and emits white like a fluorescent lamp.

Among them, a white light source combining a blue LED, an ultraviolet LED, and a fluorescent material is the mainstream.

The fluorescent material may be coated on a hemispherical cover of a lighting fixture, or a method of attaching a phosphor tape to the front surface, and in some cases, may be configured by coating a phosphor on the surface of the LED.

The white light source using the LED as described above has been in the spotlight as a new illumination light source because of its excellent luminous efficiency and high luminous intensity, high speed response and long lifespan.

That is, the illuminance of 40 to 60W incandescent light bulbs can be replaced with 5-10W power using about 80 LEDs, and the 100W incandescent light bulb can implement the same illuminance at about 13W power using 128 LEDs. Therefore, much less power is consumed to achieve the same illuminance environment than conventional "A" type incandescent bulbs and fluorescent lamps.

However, a lighting LED having the above characteristics generates a lot of heat in the process of converting electrical energy into light, and the heat acts as a factor that not only reduces the light emitting characteristics of the LED, but also shortens the lifetime of the LED. Have

Therefore, in order to use LED lighting efficiently, it is essential to have a temperature condition for LED to operate normally.

In order to solve the heat dissipation problem, there is also a method of reducing the amount of current supplied to the LED to emit light. However, since it directly lowers the brightness of the LED, it is a method of lowering the utility as a light source.

In order to solve this problem, conventionally, as shown in Fig. 1 and 2, the LED lighting device 100 is bonded to the PCB 113, the light source unit is installed a plurality of LEDs 111 on the PCB 113. Comprising a heat dissipation means 130 and the housing 150 for receiving and supporting the light source unit and the heat dissipation means 130, the power supply connecting portion 151 connecting the PCB 113 and power to the housing 150 Consists of including.

The heat dissipation means 130 is formed in a vertical cylindrical shape around the housing 150 and the heat dissipation fins 133 for expanding the heat dissipation area are protruded at regular intervals on the main surface, so that the heat dissipation fins 133 and the gap between the heat dissipation fins 133 are spaced. 131 is alternately arranged unevenly.

That is, the heat dissipation means 130 has a cylindrical shape in which the heat dissipation fins 133 and the gap space 131 are arranged at regular intervals, and such a configuration has a surface area by the heat dissipation fins 133 in a well-ventilated environment. Due to expansion, heat dissipation is achieved.

However, in an environment in which ventilation is not naturally achieved, such as when the lighting device having such a structure is inserted into a buried hole formed in the ceiling, the lower point 133a adjacent to the PCB 113 and the PCB 113 are most The temperature difference between the distant upper point 133b is less than 10% (see FIG. 1), and the temperature difference between the heat dissipation fin 133 and the clearance gap 131 is less than 10% (see FIG. 2).

Heat dissipation for heat dissipation increases efficiency as the temperature difference between the heat dissipation fin 133 and the gap space 131 increases, but when the temperature difference is less than 10% as described above, heat dissipation is not performed properly.

This is because the air staying in the gap space 131 of the heat dissipation fin 113 is stagnant in the state of absorbing heat, so that most of the space except the outermost part of the heat dissipation fin 113 does not have proper heat dissipation. have.

In order to solve the heat dissipation problem of the LED, the amount of current supplied to the LED is less than the amount of energetic current, but the illumination of each LED is lowered, so that more LEDs must be used to match the overall illumination. In addition to the increase in the size of the entire apparatus there is a problem that the manufacturing cost increases.

In addition, in some cases, a fan forcing convection of air for efficient heat dissipation is used, but the life of the fan is shorter than that of the LED, which causes the lifespan of the LED luminaire and the noise generated by the operation of the fan. There is this.

In order to solve the problems of the above-described technology, a luminaire having a structure as shown in FIG. 3 is disclosed in the fanless heat dissipation LED lighting fixture of Patent No. 10-0778235.

That is, by attaching a heat sink 230 having a lamp structure on the side end of the PCB 200 on which the LED 210 is mounted and having an uneven portion 231 formed on the surface thereof, the heat dissipation area is extended away from the luminaire body. It is a technique to expand the required convection space.

However, since the PCB 200 and the heat sink 230 are not integrated, the interface is formed on the heat transfer path, so that the heat transfer is poor due to the interface effect. In contrast, due to the limitations of heat transfer rate and heat dissipation area, there is an unsuitable problem.

In addition, the lighting fixture having a structure as shown in Figure 3 has a problem that can not be used as a fully embedded lighting fixture due to the structure of the heat sink 230, the LED is mounted on a flat structure PCB, but the direct portion is bright but side As it is relatively dark, the light distribution characteristics are bad, and in order to solve this problem, when a separate reflector is to be installed and used at the center, there is a problem in that the size of the lighting fixture is increased.

Meanwhile, there is an LED package having a structure in which a plurality of LEDs are mounted on a plurality of metal PCBs for high illumination and attached to a polygonal pipe serving as a heat sink, but this is the same as described above between the metal PCB and the pipes. The heat dissipation does not occur smoothly due to the transfer interface, there is a problem that is not suitable as a heat dissipation structure of the high illuminance (that is, high watt) LED lighting fixture.

In addition, the conventionally known "A" type LED bulb is equipped with a plurality of LEDs mounted on a circular substrate and having a heat dissipation structure on the upper side, it was possible to implement a LED bulb of 2 ~ 5.3W class in the case of AC drive method.

Accordingly, an object of the present invention is to mount a plurality of LEDs on the surface of the substrate and circulate through the inside of the metal substrate at the same time by using a metal PCB made of a polygonal pipe to implement an LED lighting fixture having high illumination and excellent light distribution characteristics. The present invention provides an LED package and a method of manufacturing the same having improved light emission characteristics by securing an efficient heat dissipation structure by employing an air-cooled structure of a convection method.

Another object of the present invention is to provide a LED package and a method of manufacturing the same that can be easily utilized as a recessed lighting fixture by implementing a high-illuminance LED lighting fixture in a compact size.

It is still another object of the present invention to provide an LED package and a method of manufacturing the same, which can easily manufacture an LED lighting device having high light intensity and excellent light distribution characteristics, which is highly assembleable and mass-produced, and which can reduce manufacturing costs. There is.

In order to achieve the above object, the present invention provides a plurality of LED; A metal substrate formed of a polygonal metal pipe and having wirings for supplying power to the plurality of LEDs formed on one surface thereof, wherein the plurality of LEDs are mounted; And a heat conduction unit installed in close contact with the inner surface of the metal substrate to be in contact with the atmosphere.

In addition, according to another aspect of the invention, the present invention is a metal substrate consisting of a polygonal metal pipe; An insulating film formed on the surface of the metal substrate; A conductive pattern formed on the insulating layer for wiring the LED; A plurality of LEDs mounted on the conductive pattern; And a heat conduction unit installed in close contact with the inner surface of the metal substrate to be in contact with the atmosphere.

The thermal pad further includes a thermal pad inserted between the substrate and the thermally conductive portion, and the thermal pad is made of carbide, and preferably, is made of carbide obtained by carbonizing a nonwoven fabric of PAN or rayon.

The substrate is made of any one of aluminum, copper, iron plate, the substrate further comprises an insulating film formed on the surface of the substrate, and a conductive pattern for wiring of the LED.

The insulating film is made of any one of a polyimide film, an Al ₂ O ₃ film, an epoxy coating film, and a ceramic coating film.

Each surface of the polygonal metal substrate may include an LED mounting unit on which the LED is mounted, and a connection line connected to a conductive pattern formed on the LED mounting unit, and a connection part extending through the heat radiating unit to an upper surface of the radiating unit. Can be.

In this case, the polygonal metal substrate is formed of a plurality of unit boards each having an LED mounting portion and a connection portion, it is preferable that a driving circuit portion for driving the LED is formed in one of the connection portion.

The apparatus may further include a substrate fixing part disposed on an upper surface of the heat dissipation part, and having upper ends of the plurality of connection parts fixedly coupled to the plurality of coupling holes corresponding to the plurality of connection parts, and interconnecting wires of the respective connection parts.

The heat conduction unit is made of a foam structure using any one of aluminum, copper, and graphite, and a hollow part is formed at the center thereof.

The heat dissipation unit is formed of a foam structure using any one of aluminum, copper, and graphite, and the heat dissipation unit further includes a casing coupled to an outer circumferential surface of the foam with a plurality of holes formed therein.

In addition, the heat dissipation portion is made of a laminated structure of a plurality of heat dissipating foams PPI (pore per inch) of the heat dissipation foam becomes smaller from the upper side to the upper direction, or the PPI (pore per inch) of the heat dissipation foam from the outside center It may be made of a structure in which a plurality of heat-dissipating foam is reduced in the direction.

In addition, the present invention (A) forming a plurality of unit substrates integrally formed at the width interval of each surface forming a polygon; (B) forming a bending notch between the plurality of unit substrates; (C) forming an insulating film and a wiring conductive pattern on each surface of the plurality of unit substrates; (D) mounting a plurality of LEDs on the wiring conductive pattern; And (E) bending the plurality of unit substrates at the positions where the notches are formed to form a polygonal substrate.

Moreover, according to another aspect of the present invention, the present invention comprises the steps of (A) preparing a metal substrate consisting of a polygonal metal pipe; (B) forming a conductive pattern for wiring on the upper surface of the flexible insulating substrate; (C) attaching an insulating substrate on which the conductive pattern is formed to each side of the metal substrate; And (D) mounting an LED on the wiring conductive pattern.

The manufacturing method may further include coupling a heat conduction unit to transfer heat to the inside of the polygonal substrate.

In addition, the manufacturing method may further comprise the step of connecting the heat dissipation portion made of a thermally conductive foam to the upper end of the LED package.

The heat conduction portion or the heat dissipation portion is formed of a foam structure using any one of aluminum, copper, and graphite, and the heat conduction portion has a hollow portion formed at the center thereof.

The present invention further includes inserting a thermal pad at a coupling site between the polygonal substrate of the LED package and the heat conduction portion.

The thermal pad is made of carbide, and preferably is made of carbide formed by carbonizing a PAN-based or rayon-based nonwoven fabric.

The substrate is made of any one of a metal plate of aluminum, copper, iron plate, each surface of the polygon forming the substrate is formed with an LED mounting portion and the wiring connected to the LED mounting portion and the LED mounting portion is fixed to another object It is formed of a fixed portion.

Preferably, the bending notches are formed on one surface or both surfaces of the substrate, and the bending notches formed on the inner surface of the polygonal substrate are formed at the same angle as each interior angle of the polygon to be formed on one surface of the substrate.

The insulating film is made of any one of polyimide, Al ₂ O ₃ film, epoxy coating film, ceramic coating film.

The step (E) of the present invention further includes the step of connecting the parts abutted after bending to the polygonal substrate.

The present invention uses a metal substrate made of polygonal pipe and mounts a plurality of LEDs on the surface of the substrate and adopts a convection type air-cooled structure that circulates through the inside of the metal substrate, thereby ensuring an efficient heat dissipation structure and high light distribution. LED packages with excellent characteristics can be implemented.

In addition, the LED package according to the present invention is made of a compact size can be applied as a versatile lighting fixture.

Moreover, the LED package according to the present invention can be manufactured through a simple structure and process while having an efficient heat dissipation structure to reduce the manufacturing cost.

1 is a front view for explaining the structure of a conventional LED lighting fixture.

2 is a cross-sectional view for explaining the structure of a conventional LED lighting fixture.

3 is a cross-sectional view for explaining the structure of another conventional LED lighting fixture.

Figure 4 is a perspective view for explaining the structure of the LED package according to the present invention.

5 is a cross-sectional view for explaining the structure of an LED lighting device including an LED package according to the present invention.

6 is a front view of a substrate portion in the present invention.

7 is a plan sectional view of a substrate portion in the present invention.

8 is a cross-sectional view illustrating a detailed structure of a substrate in the present invention.

9 is a plan view for explaining the expanded structure of the substrate in the present invention.

10 to 13 is a process chart for explaining the manufacturing process of the substrate in the present invention.

14 is a plan view for explaining the structure of the substrate fixing in the present invention.

15 is a perspective view for explaining the structure of an LED lighting device including an LED package according to the present invention.

Hereinafter, the present invention will be described in more detail with reference to specific embodiments of the present invention. The following examples are merely provided to explain the present invention in more detail, whereby the technical scope of the present invention is not limited.

The accompanying drawings, Figure 4 is a perspective view for explaining the structure of the LED package according to the present invention, Figure 5 is a cross-sectional view for explaining the structure of the LED lighting apparatus including the LED package according to the present invention, Figure 6 is in the present invention Front view of the substrate portion, Figure 7 is a plan sectional view of the substrate portion in the present invention, Figure 8 is a cross-sectional view for explaining the detailed structure of the substrate in the present invention, Figure 9 is a plan view for explaining the expanded structure of the substrate in the present invention, 10 to 13 is a process chart for explaining the manufacturing process of the substrate in the present invention, Figure 14 is a plan view for explaining the structure of the substrate fixing portion in the present invention, Figure 15 is an LED containing an LED package according to the present invention It is a perspective view for demonstrating the structure of a lighting fixture.

5 and 15, the LED lighting device 1 including the LED package according to the present invention includes an LED package 60 and a heat dissipation unit for dissipating heat generated from the LED package 60 ( 40, a screw 75 of a transparent body casing the LED package 60, and a screw coupled to an upper end of the heat dissipation part 40 and inserted into a socket and having positive and negative electrical contacts formed therein. The cap 70 is comprised.

As shown in FIGS. 4 and 5, the LED package 60 includes a metal substrate 20 formed of a polygonal (eg, octagonal) pipe made of a metal material, and mounted on an outer surface of the substrate 20. A plurality of LEDs 10, the heat conduction portion 30 coupled to the inside of the substrate 20, the heat dissipation portion is coupled to the top of the substrate 20 and the heat conduction portion 30 is interconnected to radiate heat It consists of 40.

The substrate 20 is preferably made of a plate material of excellent thermal conductivity (for example, aluminum, copper, iron or alloys thereof).

When the substrate 20 is formed of, for example, an octagon, the substrate 20 includes eight rectangular unit substrates 20-1 to 20-8, and each of the unit substrates 20-1 to 20-8 is plural, for example. For example, the LED mounting unit 20a in which eight LEDs 10 are mounted in two rows and the unit boards 20-1 to 20-8 are fixed, and at the same time, eight unit boards 20-1 to 20-8 are fixed. It includes a narrow connection portion 25 extending from the LED mounting portion 20a to interconnect a plurality of

wires

26a and 26b for electrical interconnection.

The preferred structure of the substrate 20 is that a plurality of LEDs 10 are directly mounted on the surface of the substrate 20 as shown in FIGS. 6 to 13 to remove the interface on the heat transfer path. As a result, the heat transfer property can be prevented from being lowered due to the interfacial effect. However, it is also possible to mount a plurality of LEDs 10 on a plurality of plate-shaped metal substrates and then fix them with screws on each side of the polygonal metal substrate.

In addition, similar to the structure of FIG. 8, a plurality of LEDs 10 are mounted on a flexible PCB on which a Cu conductive pattern 22 is printed on an insulating layer 21 made of a polymer film such as polyimide, and the polygonal metal substrate described above. It is also possible to join each surface of (20).

As shown in FIGS. 4, 5, and 7, the heat conduction part 30 is made of porous material, and heat radiating part 40 dissipates heat generated from the LED package 60 at the center corresponding to the metal substrate 20. The hollow part 33 which forms the flow path of air for heat dissipation through () is formed.

In other words, the heat conduction unit 30 is made of a material having excellent thermal conductivity (for example, aluminum, copper, graphite, etc.) and has a foam structure in which a plurality of heat dissipation holes 32 are formed.

In addition, in order to remove the heat transfer interface between the thermally conductive portion 30 and the substrate 20, the thermal conductivity between the inner surface of the substrate 20 and the contact surface between the thermally conductive portion 30 is as shown in FIG. 7. It is desirable to insert an excellent carbon thermal pad 35.

The thermal pad 35 may be one obtained by, for example, carbonizing a nonwoven fabric made of polyacrylonitrile (PAN) or rayon fibers.

When the thermal pad 35 is intimately coupled between the substrate 20 and the heat conduction unit 30 as described above, the line contact is made between the substrate 20 and the heat conduction unit 30 instead of point contact. In the heat transfer process between the substrate 20 and the heat conduction unit 30, a thermal interface phenomenon which acts as a disturbing factor may be effectively removed.

Meanwhile, as shown in FIG. 8, each surface of the substrate 20 forms an insulating film 21 on one surface of the aluminum substrate 20, and the LEDs 10 are formed on the surface of the insulating film 21. After the Cu (copper) conductive pattern 22 for forming wiring for power supply is formed, the LED 10 is mounted on the conductive pattern 22.

In this case, the exposed portions between the conductive patterns 22 and the LEDs 10 may be treated with the insulating film 23 using masking insulating paint.

In the present invention, the substrate 20 has, for example, an octagonal structure in the illustrated embodiment drawing, but a hexagonal, 10 or 12 polygonal pipe structure other than the octagon may be used. In this case, since a plurality of LEDs 10 are mounted on the outer surface of the polygonal substrate to form a three-dimensional lighting structure, a problem in which a large illuminance difference is generated between the direct portion and the side of the lighting device can be solved, and the light distribution characteristic is greatly improved.

Hereinafter, a manufacturing method for easily mounting a plurality of LEDs 10 on each substrate surface so that each surface of the substrate has a package structure as shown in FIG. 8 will be described with reference to FIGS. 10 to 13.

10 to 13 illustrate a process of forming a substrate 20 having an octagonal structure by using the metal substrate 20 having a flat plate structure, and the connection part 25 of FIG. 9 is not shown.

First, as shown in FIG. 9, the eight rectangular unit substrates 20-1 to 20-8 on which the LEDs 10 are mounted and the unit substrates 10 are fixed and the eight unit substrates are fixed. Molding (cutting) in the form of a narrow connection portion 25 extending from the unit substrates 20-1 to 20-8 for interconnecting a plurality of

wires

26a and 26b for electrical interconnection to the 10. )do. In the case of forming the octagonal pipe while continuously supplying the substrate 20, as shown in FIG. 9, 16 unit substrates every 8 unit substrates 20-1 to 20-8 or multiples of 8 for batch processing. Prepare by cutting every time.

The substrate 20 cut as described above is formed with a first notch 28a on the outer side as shown in FIG. 10, and a first notch 28a on the opposite side (inner side) corresponding to the first notch 28b. A deeper second notch 28b is formed.

The reason for forming the first notch 28a and the second notch 28b on the substrate 20 as described above is to allow the substrate 20 to be bent (bent) to the correct shape and to prevent cracks from occurring. When bent in a square shape, a portion of the portion folded into the inner surface is to maintain a uniform thickness without protruding inward. In addition, it is preferable that the insulating film 21 and the conductive pattern 22 formed on the upper surface of each unit substrate 20-1 to 20-8 be easily separated when bending.

To this end, the inner angle of the second notch 28b is preferably formed at the same angle as the inner angle of the polygon.

After the substrate 20 is formed as described above, as shown in FIG. 11, an insulating film 21 and a conductive film made of, for example, Cu are formed on one surface (the outer surface on which the first notch is formed) of the substrate 20. Form sequentially. Thereafter, the conductive film is patterned according to the position of the LED 10 to be mounted to form the conductive pattern 22. In this case, it is preferable that the insulating portion 21 and the conductive pattern 22 have partitions formed in advance on corresponding portions where the first notches 28a are formed between the unit substrates 20-1 to 20-8.

The insulating film 21 should be made of a material having electrical insulation and excellent heat transfer. For this purpose, the insulating film 21 may be made of an Al ₂ O ₃ film or a ceramic coating film through an anodizing method.

In this case, the insulating film 21 and the conductive pattern 22 may be formed by attaching a Cu conductive pattern formed on an insulating film such as polyimide on the unit substrates 20-1 to 20-8 using an adhesive. It is also possible.

Thereafter, as shown in FIG. 12, the plurality of LEDs 10 are mounted on bonding pads formed at each end of the conductive pattern 22.

In this case, the conductive pattern 22 patterned on the unit substrates 20-1 to 20-8, that is, the wiring, includes a pair of

wirings

26a and 26b formed in the connection part 25 of FIG. 9. An AC drive circuit unit 27 for driving the LED 10 is also mounted on any one connection portion 25. To this end, one of the connection portion 25 should secure an area in which the driving circuit portion 27 can be mounted.

As described above, after the unit substrates 20-1 to 20-8 are bent to form an octagonal shape as shown in FIG. 13 in the state where the LEDs 10 are mounted, the abutted portions are welded to each other, or shown in FIG. 14. By maintaining the octagonal shape by fixing the eight connections 25 using the substrate fixing portion 50 shown. In this case, the octagonal substrate 20 may be fixed by forming an octagonal fixing ring instead of the substrate fixing unit 50.

As shown in FIG. 14, eight through holes 52 are formed in the substrate fixing part 50, and the unit substrates 20-1 to 20-8 insert the connecting portion 25 into the through holes 52. To fix it. In addition, the substrate fixing part 50 has a pair of

wires

26a and 26b formed at each of the eight connection parts 25, and at the same time, the positive and negative electrical parts of the upper end of the screw cap 70 are connected to each other. (+) And (-)

connection pads

50a and 50b are provided which are connected from the

contact points

70a and 70b via the

power lines

71a and 71b.

In this case, as shown in FIG. 9, as shown in FIG. 9, the connection portion 25 of the eight rectangular unit substrates 20-1 to 20-8 can be secured instead of securing an area in which the driving circuit unit 27 can be mounted. The heat conduction part 30 is disposed by arranging the driving circuit part 27 in the substrate fixing part 50 and patterning all the connection parts 25 of the unit substrates 20-1 to 20-8 in the same narrow shape. It is also possible to further ensure a passage for the convection air incident to the hollow portion 33 of the exit through the heat dissipation portion 40 to the outside.

In addition, the LED mounting of the metal substrate 20 as shown in FIGS. 4 and 6 so as to secure a passage through which convective air incident to the hollow part 33 of the heat conductive part 30 exits to the outside through the heat dissipation part 40. It is also possible to provide a plurality of through holes 24 in the portion 20a to form another air flow passage for dissipating heat generated from the LED package 60 through the heat dissipation portion 40.

Thereafter, the thermal pad 35 is interposed between the inner surface of the octagonal substrate 20 formed through the above process, and the thermal conductive portion 30 is sandwiched and fixed.

Meanwhile, in the present invention, the light emitted from the LED 10 passes through the yellow or blue phosphor by treating the LED 10 by employing a blue or yellow LED and coating or impregnating the globe 75 with a yellow or blue phosphor. White light can be obtained.

The LED package according to the present invention made as described above, as shown in FIG. 5, after the heat generated in the LED 10 is transferred to the rear surface through the substrate 20, it is transferred to the heat conduction part 30.

The heat transferred to the heat conduction portion 30 as described above may emit heat through the air contacted in the plurality of heat dissipation holes 32 and the hollow portion 33 formed in the center of the heat conduction portion 30.

In this case, a thermal pad 35 is inserted between the rear surface (inner surface) of the substrate 20 and the heat conduction portion 30 to remove a thermal interface effect that hinders heat transfer.

The connection part 25 of the substrate 20 is coupled to the substrate fixing part 50, and the heat dissipating part 40 is illustrated between FIGS. 5 and 15 between the substrate fixing part 50 and the LED package 60. ) Is combined. At this time, in order to prevent the formation of a thermal interface that prevents heat transfer when the heat dissipation unit 40 and the LED package 60 are coupled to each other, a thermal bonding material such as the thermal pad 35 is attached to a coupling portion of each other. It is preferable to insert.

The heat dissipation part 40 is formed of a material having excellent thermal conductivity similar to the heat conduction part 30 and has a foam structure having a plurality of heat dissipation holes 41 to form the hollow part 33 of the heat conduction part 30. By discharging the air introduced through the plurality of heat dissipation holes 41 to heat the heat transmitted through the heat conduction unit 30 to the outside.

A substrate fixing part 50 into which a space for arranging

power lines

71a and 71b wired from the screw cap 70 or a connection portion 25 of the substrate 20 is inserted into an upper center portion of the heat radiating portion 40. ) Is arranged.

In addition, the heat dissipation part 40 has a plurality of holes 42a formed therein and a heat dissipation part casing 42 having free air flow is integrally coupled to the screw cap 70 and the heat dissipation part casing 42. One end of the glove 75 is coupled to the lower end of the glove 75.

On the other hand, the glove 75 is formed in a spherical shape as shown in Figure 15, and the lower end portion is gradually reduced in diameter so as to be coupled to the lower end of the radiator casing 42.

In addition, as shown in Figure 5, the glove 75 is formed in a substantially spherical shape, the upper end portion 75a is formed to be inclined outward while being connected to the lower end portion of the heat dissipation casing 42, the middle portion is made of a cylindrical structure The lower end portion 75b may have a hemispherical cross-sectional shape and gradually decrease in diameter toward the center portion. In this case, the lower end of the heat dissipation portion 40 is coupled to both ends between the casing 42 and the substrate 20, the reflector 29 for reflecting the light emitted from the LED 10 to the internal reflection is made downward It is preferred to be provided.

The reason why the globe 75 is formed in the structure shown in FIG. 5 is that the LED 10 is mounted on the polygonal substrate 20 so that the irradiation angle is made in the vertical direction with respect to the longitudinal direction. Irradiation in the horizontal direction

Since the internal reflection is made at the upper end 75a and the downward light passing through the hemispherical lower end 75b is light-distributed downward, the side and the bottom have uniform light distribution characteristics.

Meanwhile, in the above description of the embodiment, the polygon substrate 20 is formed by bending using a flat substrate to form a polygonal structure. However, in some cases, for example, extrusion is performed using Al. By using the polygonal pipe, the insulating film and the wiring conductive pattern may be formed on the outer circumferential surface of the polygonal pipe.

Further, in this case, since heat concentrating occurs at corner portions where the respective surfaces of the pipe meet each other, it is also possible to integrally form protrusions protruding into the corners during extrusion of the pipe and integrally form other heat dissipation fin structures. It is also possible to form.

Furthermore, in the above description of the embodiment, the thermal conductive portion 30 is made of a material having only excellent thermal conductivity of the same standard (for example, aluminum, copper, graphite, etc.), and a foam in which a plurality of heat dissipation holes 32 are formed. Although it is used, it is also possible to employ a structure in which the PPI (pore per inch) of the heat-dissipating foam laminated different from each other.

For example, a larger number of pores of the heat dissipation holes are disposed from the lowermost part to the upper part so that the lowermost part may use a heat dissipating foam consisting of 30 PPI in the lower part, 20 PPI in the middle layer, and 10 PPI in the uppermost layer. By adopting such a structure, the air resistance becomes larger on the lower side and decreases toward the upper side, so that a temperature gradient is set so that the temperature is set lower on the upper side than on the lower side, and convection of natural air flows from the lower side to the upper side of the heat conduction part 30. Done.

In addition, instead of the stacking method in which the PPI of the heat-dissipating foam is different in the vertical direction, the structure of stacking the heat-dissipating foam having a small PPI from the outside of the heat conductive portion 30 to the inner side is adopted to the center of the heat conductive portion 30. It is also possible to set the temperature gradient to lower the temperature gradually.

As described above, in the present invention, an efficient heat dissipation structure is adopted by adopting a convection type air-cooled structure that circulates through the inside of the metal substrate even though a plurality of LEDs are densely mounted on the surface of the substrate using a metal substrate made of a polygonal pipe. By using the LED package to realize the high-illuminance LED lighting fixture, and by placing a plurality of LEDs three-dimensionally on the surface of the polygonal pipe, excellent light distribution that can reduce the difference in the illumination between the right side and the lower side of the lighting fixture It has become possible to have characteristics.

In addition, in the present invention, by implementing a high-illuminance LED lighting fixture in a compact size by using the LED package it can be easily utilized as an embedded lighting fixture as well as an exposure type.

In addition, in the present invention, it is possible to manufacture the LED package by a batch process (batch process) it is possible to assemble and mass-produce the LED package with high light intensity and excellent light distribution characteristics and to reduce the manufacturing cost.

The LED package and the method of manufacturing the same according to the present invention can be applied to a light source of a new LED luminaire that can replace incandescent lamps and fluorescent lamps.

Claims

Multiple LEDs;

A metal substrate formed of a polygonal metal pipe and having wirings for supplying power to the plurality of LEDs formed on one surface thereof, wherein the plurality of LEDs are mounted;

And a heat conduction unit installed in close contact with the inner surface of the metal substrate to be in contact with the atmosphere.
A metal substrate made of a polygonal metal pipe;

An insulating film formed on the surface of the metal substrate;

A conductive pattern formed on the insulating layer for wiring the LED;

A plurality of LEDs mounted on the conductive pattern; And

And a heat conduction unit installed in close contact with the inner surface of the metal substrate to be in contact with the atmosphere.
The LED package according to claim 1 or 2, further comprising a thermal pad inserted between the metal substrate and the heat conduction portion to increase a heat transfer area.
4. The LED package of claim 3, wherein the thermal pad is made of carbide.
The LED package according to claim 4, wherein the carbide is formed by carbonizing a non-woven fabric of PAN or rayon.
The LED package of claim 1, wherein the metal substrate further comprises an insulating film formed on a surface of the substrate and a conductive pattern for wiring the LED.
The LED package according to claim 2 or 6, wherein the insulating film is made of any one of a polyimide film, an Al 2 O 3 film, an epoxy coating film, and a ceramic coating film.
According to claim 1 or 2, wherein each surface forming the polygonal metal substrate is formed on the LED mounting portion and the conductive wire formed on the LED mounting portion and the LED mounting portion is formed through the heat dissipation portion LED package, characterized in that consisting of a connection portion extending to the upper surface of the heat dissipation.
According to claim 1 or 2, wherein the polygonal metal substrate is made of a plurality of unit boards each having an LED mounting portion and the connection portion, characterized in that the driving circuit portion for driving the LED is formed in one of the connection portion LED package.
The LED package according to claim 1 or 2, wherein the metal substrate is made of any one material of aluminum (Al), copper (Cu), and iron (Fe).
The LED package according to claim 1 or 2, further comprising a heat dissipation unit coupled to an upper portion of the LED package to dissipate heat generated from the LED package.
The method of claim 11,

The substrate may further include a substrate fixing part disposed on an upper surface of the heat dissipation part, the upper end part of the plurality of connection parts being fixed to a plurality of coupling holes corresponding to the plurality of connection parts extending from the substrate, and the wiring of each connection part being interconnected. LED package, characterized in that.
The LED package according to claim 1 or 2, wherein the thermally conductive portion is formed of a foam structure made of one of aluminum, copper, and graphite, respectively.
12. The LED package of claim 11, wherein the heat conduction part has a hollow part formed at a center thereof.
The LED package according to claim 11, wherein the heat dissipation part further comprises a casing having a plurality of holes formed therein to surround the outer circumferential surface of the foam.
The LED package according to claim 1 or 2, wherein the heat conducting portion is formed by stacking a plurality of heat dissipating foams in which a PPI (pore per inch) of the heat dissipating foam becomes smaller from the lower side to the upper side in an upward direction.
The LED package according to claim 1 or 2, wherein the heat conducting portion is formed by stacking a plurality of heat dissipating foams in which a PPI (pore per inch) of the heat dissipating foam becomes smaller from the outside toward the center direction.
(A) forming a plurality of unit substrates integrally formed at a width interval of each surface forming a polygon;

(B) forming a bending notch between the plurality of unit substrates;

(C) forming an insulating film and a wiring conductive pattern on each surface of the plurality of unit substrates;

(D) mounting a plurality of LEDs on the wiring conductive pattern; And

(E) forming a polygonal substrate by bending the plurality of unit substrates at the position where the notch is formed;

LED package manufacturing method comprising a.
(A) preparing a metal substrate made of a polygonal metal pipe;

(B) forming a conductive pattern for wiring on the upper surface of the flexible insulating substrate;

(C) attaching an insulating substrate on which the conductive pattern is formed to each side of the metal substrate; And

(D) mounting an LED on the wiring conductive pattern;

LED package manufacturing method comprising a.
20. The method of claim 18 or 19, further comprising coupling a heat conduction portion for transferring heat to the inside of the polygonal substrate.
21. The method of claim 20, wherein the heat conducting unit is made of any one of aluminum, copper and graphite as a foam structure.
The method of claim 18 or 19,

The method of manufacturing an LED package, characterized in that it further comprises the step of connecting the heat dissipation portion made of a thermally conductive foam to the upper end of the LED package.
23. The method of claim 22, wherein the heat dissipation unit is made of any one of aluminum, copper and graphite as a material of the LED package manufacturing method.
The method of claim 20, wherein the heat conduction portion is a LED package manufacturing method, characterized in that the hollow portion is formed in the center thereof.
21. The method of claim 20, further comprising inserting a thermal pad prior to joining the polygonal substrate and the thermally conductive portion.
27. The method of claim 25, wherein the thermal pad is made of carbide.
20. The method of claim 18 or 19, wherein the substrate is made of any one of a metal plate of aluminum, copper, iron plate.
20. The method of claim 18 or 19, wherein each surface forming the polygonal substrate is formed with an LED mounting portion on which the LED is mounted, and a wiring connected to the conductive pattern formed on the LED mounting portion is radiated through the heat radiating portion LED package manufacturing method comprising a connection portion extending to the upper surface of the portion.
20. The method of claim 18 or 19, wherein the bending notch is formed on one side or both sides of the substrate.
20. The method of claim 19, further comprising a plurality of heat sink fins protruding into the corner of the polygonal substrate.