USD783547S1 - LED package - Google Patents

LED package Download PDF

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Publication number
USD783547S1
USD783547S1 US29/529,243 US201529529243F USD783547S US D783547 S1 USD783547 S1 US D783547S1 US 201529529243 F US201529529243 F US 201529529243F US D783547 S USD783547 S US D783547S
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United States
Prior art keywords
led package
view
elevation view
led
mirror image
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US29/529,243
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Michael John Bergmann
Jesse Reiherzer
Joseph Gates Clark
Benjamin Jacobson
Sung Chul Joo
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Creeled Inc
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Cree Inc
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Priority to US29/529,243 priority Critical patent/USD783547S1/en
Assigned to CREE, INC. reassignment CREE, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: BERGMANN, MICHAEL JOHN, CLARK, JOSEPH GATES, JACOBSON, BENJAMIN, JOO, SUNG CHUL, REIHERZER, JESSE
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Publication of USD783547S1 publication Critical patent/USD783547S1/en
Assigned to CREELED, INC. reassignment CREELED, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREE, INC.
Assigned to CITIZENS BANK, N.A. reassignment CITIZENS BANK, N.A. SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: CREELED, INC., SMART EMBEDDED COMPUTING, INC., SMART High Reliability Solutions, LLC, SMART MODULAR TECHNOLOGIES, INC.
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Description

FIG. 1 is a top, front, left side perspective view of an LED package showing one embodiment of package configuration according to the present invention.
FIG. 2 is a front elevation view of the LED shown in FIG. 1, the rear elevation view being a mirror image.
FIG. 3 is a left side elevation view of the LED package shown in FIG. 1, the right side elevation view being a mirror image.
FIG. 4 is a top plan view of the LED package shown in FIG. 1.
FIG. 5 is a bottom plan view of the LED package shown in FIG. 1.
FIG. 6 is a top, front, left side perspective view of an LED package showing one embodiment of package configuration according to the present invention.
FIG. 7 is a front elevation view of the LED shown in FIG. 2, the rear elevation view being a mirror image.
FIG. 8 is a left side elevation view of the LED package shown in FIG. 2, the right side elevation view being a mirror image.
FIG. 9 is a top plan view of the LED package shown in FIG. 2; and,
FIG. 10 is a bottom plan view of the LED package shown in FIG. 2.
Broken lines in the figures are for illustrative purposes only and form no part of the claimed design.

Claims (1)

    CLAIM
  1. The ornamental design for a LED package, as shown and described herein.
US29/529,243 2015-06-04 2015-06-04 LED package Active USD783547S1 (en)

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US29/529,243 USD783547S1 (en) 2015-06-04 2015-06-04 LED package

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US29/529,243 USD783547S1 (en) 2015-06-04 2015-06-04 LED package

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USD783547S1 true USD783547S1 (en) 2017-04-11

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Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD805398S1 (en) * 2016-07-19 2017-12-19 Under Armour, Inc. Package
USD805399S1 (en) * 2016-07-19 2017-12-19 Under Armour, Inc. Package
USD809382S1 (en) 2016-07-19 2018-02-06 Under Armour, Inc. Package
USD815959S1 (en) 2016-07-19 2018-04-24 Under Armour, Inc. Package
USD826184S1 (en) * 2016-03-24 2018-08-21 Hamamatsu Photonics K.K. Optical semiconductor element
USD830821S1 (en) 2016-07-19 2018-10-16 Under Armour, Inc. Package
USD831592S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K. Optical semiconductor element
USD831593S1 (en) * 2016-03-24 2018-10-23 Hamamatsu Photonics K.K Optical semiconductor element
USD832802S1 (en) * 2016-03-24 2018-11-06 Hamamatsu Photonics K.K. Optical semiconductor element
USD906270S1 (en) * 2018-10-26 2020-12-29 Kingbright Electronics Co. Ltd. LED component
USD1000400S1 (en) 2021-04-16 2023-10-03 Creeled, Inc. Light emitting diode package

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