USD754083S1 - Electric terminal - Google Patents
Electric terminal Download PDFInfo
- Publication number
- USD754083S1 USD754083S1 US29/470,060 US201329470060F USD754083S US D754083 S1 USD754083 S1 US D754083S1 US 201329470060 F US201329470060 F US 201329470060F US D754083 S USD754083 S US D754083S
- Authority
- US
- United States
- Prior art keywords
- electric terminal
- view
- elevation view
- design
- electric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Description
The dashed-dot-dashed lines represent the boundary line of the claimed design. The even dashed broken lines shown in the drawings represent portions of the electric terminal that form no part of the claimed design.
Claims (1)
- The ornamental design for an electric terminal, as shown and described.
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/470,060 USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
US29/556,621 USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,619 USD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,618 USD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/614,894 USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
US29/669,185 USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
US29/723,349 USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/470,060 USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
Related Child Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/556,621 Division USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,618 Division USD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,619 Division USD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
Publications (1)
Publication Number | Publication Date |
---|---|
USD754083S1 true USD754083S1 (en) | 2016-04-19 |
Family
ID=55700350
Family Applications (7)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/470,060 Active USD754083S1 (en) | 2013-10-17 | 2013-10-17 | Electric terminal |
US29/556,619 Active USD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,618 Active USD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,621 Active USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/614,894 Active USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
US29/669,185 Active USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
US29/723,349 Active USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Family Applications After (6)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/556,619 Active USD775093S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,618 Active USD775092S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/556,621 Active USD798249S1 (en) | 2013-10-17 | 2016-03-02 | Electric terminal |
US29/614,894 Active USD834548S1 (en) | 2013-10-17 | 2017-08-24 | Electric terminal |
US29/669,185 Active USD877708S1 (en) | 2013-10-17 | 2018-11-06 | Electrical terminal |
US29/723,349 Active USD942406S1 (en) | 2013-10-17 | 2020-02-06 | Electric terminal |
Country Status (1)
Country | Link |
---|---|
US (7) | USD754083S1 (en) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD775093S1 (en) * | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
USD792410S1 (en) * | 2013-03-13 | 2017-07-18 | Nagrastar Llc | Smart card interface |
USD805680S1 (en) * | 2013-12-09 | 2017-12-19 | Kenall Manufacturing Company | Driver housing |
USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD840404S1 (en) | 2013-03-13 | 2019-02-12 | Nagrastar, Llc | Smart card interface |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937232S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9888283B2 (en) | 2013-03-13 | 2018-02-06 | Nagrastar Llc | Systems and methods for performing transport I/O |
USD814431S1 (en) * | 2015-05-15 | 2018-04-03 | Mitsubishi Electric Corporation | Power semiconductor device |
USD846513S1 (en) * | 2016-04-27 | 2019-04-23 | Ngk Insulators, Ltd. | Sheet heater for electrostatic chuck |
USD845906S1 (en) * | 2017-03-09 | 2019-04-16 | Sendyne Corporation | Electrical shunt |
JP1641098S (en) * | 2018-06-26 | 2019-09-09 | ||
USD888673S1 (en) | 2018-06-26 | 2020-06-30 | Rohm Co., Ltd. | Semiconductor module |
USD956707S1 (en) * | 2019-09-26 | 2022-07-05 | Lapis Semiconductor Co., Ltd. | Circuit board |
USD947801S1 (en) * | 2019-11-07 | 2022-04-05 | Phoenix Contact Gmbh & Co. Kg | Printed circuit board |
USD986174S1 (en) * | 2020-07-10 | 2023-05-16 | Xinghui Peng | Power connector |
Citations (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579046A (en) * | 1969-05-02 | 1971-05-18 | Jordan Controls Inc | Electrical housing assembly having a plurality of chambers with adjacent circuit board elements |
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
US4698663A (en) * | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
USD317300S (en) * | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
US5066999A (en) * | 1989-10-23 | 1991-11-19 | Micron Technology, Inc. | Resistor under wirebond pad |
US5757082A (en) * | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
US6078505A (en) * | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
US6348742B1 (en) * | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
US6476505B2 (en) * | 1999-04-27 | 2002-11-05 | Oki Electric Industry Co, Ltd. | Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
US6483038B2 (en) * | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD485536S1 (en) * | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
US20060097374A1 (en) * | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD547371S1 (en) * | 2005-10-22 | 2007-07-24 | Karl Frederick Miller | Reminder form |
USD601520S1 (en) * | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
USD612347S1 (en) * | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
USD633054S1 (en) * | 2009-07-28 | 2011-02-22 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD633450S1 (en) * | 2009-07-28 | 2011-03-01 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD638810S1 (en) * | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD638809S1 (en) * | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD684547S1 (en) * | 2011-08-30 | 2013-06-18 | Panasonic Corporation | Fixing base for an electroluminescence module |
USD690277S1 (en) * | 2011-09-07 | 2013-09-24 | Panasonic Corporation | Electroluminescence module |
USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
USD694200S1 (en) * | 2011-09-07 | 2013-11-26 | Panasonic Corporation | Electroluminescence module |
USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
USD708595S1 (en) * | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Electroluminescence module |
USD708594S1 (en) * | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Panel board for electroluminescence module |
USD730304S1 (en) * | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD736213S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) * | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD363920S (en) * | 1992-12-02 | 1995-11-07 | K. W. Muth Company, Inc. | Electrical circuit board |
JP2962160B2 (en) * | 1994-09-14 | 1999-10-12 | 住友電装株式会社 | Electrical junction box |
US6494723B2 (en) * | 2000-03-31 | 2002-12-17 | Autonetworks Technologies, Ltd. | Terminal that provides connection between a wire circuit and a printed circuit, and electric junction box including said terminal |
US6392291B1 (en) * | 2001-03-16 | 2002-05-21 | Micron Technology, Inc. | Semiconductor component having selected terminal contacts with multiple electrical paths |
US6753482B1 (en) * | 2002-05-06 | 2004-06-22 | Micron Technology, Inc. | Semiconductor component with adjustment circuitry |
JP2004096950A (en) * | 2002-09-03 | 2004-03-25 | Sumitomo Wiring Syst Ltd | Conductive material |
JP2004159478A (en) * | 2002-11-08 | 2004-06-03 | Sumitomo Wiring Syst Ltd | Junction box |
US7709292B2 (en) * | 2006-09-29 | 2010-05-04 | Sadwick Laurence P | Processes and packaging for high voltage integrated circuits, electronic devices, and circuits |
US8318535B2 (en) * | 2007-06-28 | 2012-11-27 | Sandisk Technologies Inc. | Method of fabricating a memory card using SiP/SMT hybrid technology |
US9402319B2 (en) * | 2011-05-11 | 2016-07-26 | Vlt, Inc. | Panel-molded electronic assemblies |
US8966747B2 (en) * | 2011-05-11 | 2015-03-03 | Vlt, Inc. | Method of forming an electrical contact |
JP5740372B2 (en) * | 2012-09-12 | 2015-06-24 | 株式会社東芝 | Semiconductor memory card |
US20140099805A1 (en) * | 2012-10-10 | 2014-04-10 | Motorola Mobility Llc | Electronic connector capable of accepting a single subscriber identity mopdule or a memory card |
TWM450884U (en) * | 2012-10-11 | 2013-04-11 | Carry Technology Co Ltd | Memory card adapter device |
USD754083S1 (en) * | 2013-10-17 | 2016-04-19 | Vlt, Inc. | Electric terminal |
US9936580B1 (en) * | 2015-01-14 | 2018-04-03 | Vlt, Inc. | Method of forming an electrical connection to an electronic module |
US10785871B1 (en) * | 2018-12-12 | 2020-09-22 | Vlt, Inc. | Panel molded electronic assemblies with integral terminals |
-
2013
- 2013-10-17 US US29/470,060 patent/USD754083S1/en active Active
-
2016
- 2016-03-02 US US29/556,619 patent/USD775093S1/en active Active
- 2016-03-02 US US29/556,618 patent/USD775092S1/en active Active
- 2016-03-02 US US29/556,621 patent/USD798249S1/en active Active
-
2017
- 2017-08-24 US US29/614,894 patent/USD834548S1/en active Active
-
2018
- 2018-11-06 US US29/669,185 patent/USD877708S1/en active Active
-
2020
- 2020-02-06 US US29/723,349 patent/USD942406S1/en active Active
Patent Citations (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3579046A (en) * | 1969-05-02 | 1971-05-18 | Jordan Controls Inc | Electrical housing assembly having a plurality of chambers with adjacent circuit board elements |
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
US4698663A (en) * | 1986-09-17 | 1987-10-06 | Fujitsu Limited | Heatsink package for flip-chip IC |
USD317300S (en) * | 1987-07-04 | 1991-06-04 | Terutomi Hasegawa | Semi-conductor mounting substrate |
US5066999A (en) * | 1989-10-23 | 1991-11-19 | Micron Technology, Inc. | Resistor under wirebond pad |
US5757082A (en) * | 1995-07-31 | 1998-05-26 | Rohm Co., Ltd. | Semiconductor chips, devices incorporating same and method of making same |
US5994772A (en) * | 1996-12-19 | 1999-11-30 | Lg Semicon Co., Ltd. | Semiconductor package |
US6348742B1 (en) * | 1999-01-25 | 2002-02-19 | Clear Logic, Inc. | Sacrificial bond pads for laser configured integrated circuits |
US6476505B2 (en) * | 1999-04-27 | 2002-11-05 | Oki Electric Industry Co, Ltd. | Semiconductor device having pads, the intervals of which are adjusted and arranged in semiconductor chip corners |
US6078505A (en) * | 1999-05-14 | 2000-06-20 | Triquint Semiconductor, Inc. | Circuit board assembly method |
US6483038B2 (en) * | 2000-05-23 | 2002-11-19 | Samsung Electronics Co., Ltd. | Memory card |
USD466093S1 (en) * | 2001-04-27 | 2002-11-26 | Taiyo Yuden Co., Ltd. | Hybird integrated circuit board |
USD471167S1 (en) * | 2001-04-27 | 2003-03-04 | Taiyo Yuden Co., Ltd. | Hybrid integrated circuit board |
USD485536S1 (en) * | 2003-03-10 | 2004-01-20 | Pulse Engineering, Inc. | Electronics component assembly |
US20060097374A1 (en) * | 2004-11-10 | 2006-05-11 | Yoshimi Egawa | Multi chip package |
USD612347S1 (en) * | 2005-01-14 | 2010-03-23 | Panasonic Corporation | Electric circuit board |
USD601520S1 (en) * | 2005-01-14 | 2009-10-06 | Panasonic Corporation | Electric circuit board |
USD540272S1 (en) * | 2005-04-18 | 2007-04-10 | Murata Manufacturing Co., Ltd. | Semiconductor module |
USD547371S1 (en) * | 2005-10-22 | 2007-07-24 | Karl Frederick Miller | Reminder form |
USD633450S1 (en) * | 2009-07-28 | 2011-03-01 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD633054S1 (en) * | 2009-07-28 | 2011-02-22 | Panasonic Electric Works Co., Ltd. | Electro luminescence module |
USD638810S1 (en) * | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD638809S1 (en) * | 2010-05-14 | 2011-05-31 | Panasonic Corporation | Substrate for light source of light emitting diode |
USD684547S1 (en) * | 2011-08-30 | 2013-06-18 | Panasonic Corporation | Fixing base for an electroluminescence module |
USD694200S1 (en) * | 2011-09-07 | 2013-11-26 | Panasonic Corporation | Electroluminescence module |
USD690277S1 (en) * | 2011-09-07 | 2013-09-24 | Panasonic Corporation | Electroluminescence module |
USD690672S1 (en) * | 2011-10-04 | 2013-10-01 | Kabushiki Kaisha Yaskawa Denki | Encoder optical module |
USD699201S1 (en) * | 2012-10-01 | 2014-02-11 | Gemalto M2M Gmbh | Pad arrangement of a circuit module |
USD708595S1 (en) * | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Electroluminescence module |
USD708594S1 (en) * | 2013-01-11 | 2014-07-08 | Panasonic Corporation | Panel board for electroluminescence module |
USD730304S1 (en) * | 2014-05-15 | 2015-05-26 | Kabushiki Kaisha Toshiba | Substrate for an electronic circuit |
USD736213S1 (en) * | 2014-07-01 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
USD736216S1 (en) * | 2014-07-30 | 2015-08-11 | Samsung Electronics Co., Ltd. | Memory card |
Non-Patent Citations (2)
Title |
---|
Mitsubishi Electric Corporation, Release No. 2647, Mitsubishi Electric Launches 1200V/50A Large-Type Dual In-Line Package Intelligent Power Module, Jan. 26, 2012, 2 pages. |
Protek Devices, Package Outline, 16 Pin Drip Package, 2000, 2 pages. |
Cited By (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD792410S1 (en) * | 2013-03-13 | 2017-07-18 | Nagrastar Llc | Smart card interface |
USD792411S1 (en) * | 2013-03-13 | 2017-07-18 | Nagrastar Llc | Smart card interface |
USD949864S1 (en) * | 2013-03-13 | 2022-04-26 | Nagrastar Llc | Smart card interface |
USD840404S1 (en) | 2013-03-13 | 2019-02-12 | Nagrastar, Llc | Smart card interface |
USD942406S1 (en) | 2013-10-17 | 2022-02-01 | Vicor Corporation | Electric terminal |
USD775092S1 (en) * | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
USD798249S1 (en) * | 2013-10-17 | 2017-09-26 | Vlt, Inc. | Electric terminal |
USD834548S1 (en) | 2013-10-17 | 2018-11-27 | Vlt, Inc. | Electric terminal |
USD775093S1 (en) * | 2013-10-17 | 2016-12-27 | Vlt, Inc. | Electric terminal |
USD877708S1 (en) | 2013-10-17 | 2020-03-10 | Vlt, Inc. | Electrical terminal |
USD805680S1 (en) * | 2013-12-09 | 2017-12-19 | Kenall Manufacturing Company | Driver housing |
USD844216S1 (en) * | 2013-12-09 | 2019-03-26 | Kenall Manufacturing Company | Driver housing |
USD864968S1 (en) * | 2015-04-30 | 2019-10-29 | Echostar Technologies L.L.C. | Smart card interface |
USD813182S1 (en) * | 2016-08-02 | 2018-03-20 | Panasonic Intellectual Property Management Co., Ltd. | Semiconductor device |
USD934821S1 (en) * | 2019-07-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937233S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD937232S1 (en) | 2019-10-24 | 2021-11-30 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD938925S1 (en) * | 2019-10-24 | 2021-12-21 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD934820S1 (en) * | 2019-10-24 | 2021-11-02 | Nuvoton Technology Corporation Japan | Semiconductor device |
USD951215S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951212S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951213S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
USD951214S1 (en) * | 2019-12-11 | 2022-05-10 | Panasonic Semiconductor Solutions Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
USD798249S1 (en) | 2017-09-26 |
USD942406S1 (en) | 2022-02-01 |
USD775092S1 (en) | 2016-12-27 |
USD834548S1 (en) | 2018-11-27 |
USD877708S1 (en) | 2020-03-10 |
USD775093S1 (en) | 2016-12-27 |
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