USD743918S1 - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- USD743918S1 USD743918S1 US29/496,362 US201429496362F USD743918S US D743918 S1 USD743918 S1 US D743918S1 US 201429496362 F US201429496362 F US 201429496362F US D743918 S USD743918 S US D743918S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
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- indicate
- surrounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Description
The portions shown in black indicate the color black. The portions shown in white, i.e., the thin square portion surrounding the center top window in FIGS. 1 and 5 and the two small circles in FIGS. 2 and 6 indicate the color white.
The center top window inside the thin white portion in FIGS. 1 and 5 is shaded to indicate that it is translucent.
The electrodes are shaded to indicate contour.
The thin white portion is substantially planar and flush with the surrounding black body portions. The center top window is substantially planar and flush with the surrounding thin white portion and black body portions. The two small white circles of FIGS. 2 and 6 are substantially planar and flush with the surrounding black body portions.
Claims (1)
- The ornamental design for a light emitting diode, as shown and described.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/496,362 USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-024959 | 2009-10-26 | ||
JP2009-024958 | 2009-10-26 | ||
JP2009024960 | 2009-10-26 | ||
JP2009024957 | 2009-10-26 | ||
JP2009024961 | 2009-10-26 | ||
JP2009-024960 | 2009-10-26 | ||
JP2009-024961 | 2009-10-26 | ||
JP2009024958 | 2009-10-26 | ||
JP2009-024957 | 2009-10-26 | ||
JP2009024959 | 2009-10-26 | ||
US29/360,431 USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
US29/418,160 USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
US29/496,362 USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/418,160 Continuation USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
USD743918S1 true USD743918S1 (en) | 2015-11-24 |
Family
ID=46148403
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/360,431 Active USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
US29/418,160 Active USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
US14/323,699 Abandoned US20150115294A2 (en) | 2009-10-26 | 2014-07-03 | Light emitting device including resin-molded body with white portion and black portion |
US29/496,362 Active USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Family Applications Before (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/360,431 Active USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
US29/418,160 Active USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
US14/323,699 Abandoned US20150115294A2 (en) | 2009-10-26 | 2014-07-03 | Light emitting device including resin-molded body with white portion and black portion |
Country Status (1)
Country | Link |
---|---|
US (4) | USD661262S1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD661262S1 (en) * | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
JP2013222499A (en) * | 2012-04-12 | 2013-10-28 | Sharp Corp | Light source substrate unit |
USD759603S1 (en) * | 2013-07-17 | 2016-06-21 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
JP6328497B2 (en) * | 2014-06-17 | 2018-05-23 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor light emitting device, package device, and light emitting panel device |
USD866032S1 (en) | 2014-10-31 | 2019-11-05 | Charge Ahead Llc | Combination illumination device and power system |
USD842518S1 (en) | 2014-10-31 | 2019-03-05 | Charge Ahead Llc | Combination illumination device and power system |
EP3598510B1 (en) * | 2018-07-18 | 2022-02-23 | Lumileds LLC | Light emitting diode device and producing methods thereof |
Citations (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183405A (en) | 1998-12-16 | 2000-06-30 | Nichia Chem Ind Ltd | Light emitting device and its manufacture |
USD439351S1 (en) | 1999-11-18 | 2001-03-20 | Sharp Kabushiki Kaisha | Light emitting diode |
US6483623B1 (en) | 1997-11-28 | 2002-11-19 | Dowa Mining Co., Ltd. | Lamp apparatus for use in optical communication and a process for producing the same |
USD471166S1 (en) | 2001-04-06 | 2003-03-04 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
US6707069B2 (en) | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
USD491899S1 (en) | 2002-05-22 | 2004-06-22 | Nichia Corporation | Light emitting diode |
USD494550S1 (en) | 2003-08-26 | 2004-08-17 | Nichia Corporation | Light emitting diode |
USD495304S1 (en) | 2003-11-10 | 2004-08-31 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
USD505396S1 (en) | 2003-03-03 | 2005-05-24 | Nichia Corporation | Light emitting diode |
USD511329S1 (en) | 2003-07-09 | 2005-11-08 | Nichia Corporation | Light emitting diode |
JP2006130714A (en) | 2004-11-04 | 2006-05-25 | Enomoto Co Ltd | Injection molding machine, led device and led device manufactured using injection molding machine |
USD522468S1 (en) | 2004-12-27 | 2006-06-06 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
USD535263S1 (en) | 2003-09-09 | 2007-01-16 | Nichia Corporation | Light emitting diode |
US20070075325A1 (en) | 2005-10-04 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
US20080037252A1 (en) | 2006-08-04 | 2008-02-14 | Nichia Corporation, A Corporation Of Japan | Light emitting device |
USD578083S1 (en) | 2006-03-30 | 2008-10-07 | Toyoda Gosei Co., Ltd. | Light emitting diode |
USD584246S1 (en) | 2006-03-10 | 2009-01-06 | Tek Beng Low | High power light emitting diode |
US20090026480A1 (en) * | 2007-07-27 | 2009-01-29 | Nichia Corporation | Light emitting device and method of manufacturing the same |
USD586302S1 (en) | 2007-05-07 | 2009-02-10 | Alti-Electronics Co., Ltd. | Light emitting diode |
USD608309S1 (en) | 2008-09-01 | 2010-01-19 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
USD608740S1 (en) | 2008-08-29 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
USD611012S1 (en) | 2008-12-19 | 2010-03-02 | Everlight Electronics Co., Ltd. | Light emitting diode |
US20100163918A1 (en) * | 2007-06-05 | 2010-07-01 | Seoul Semiconductor Co., Ltd | Led package |
USD621801S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD621800S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD622682S1 (en) | 2009-11-09 | 2010-08-31 | Alti-Semiconductor Co., Ltd | Light emitting diode |
USD627312S1 (en) | 2010-02-01 | 2010-11-16 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
US20110255281A1 (en) | 2008-12-25 | 2011-10-20 | Showa Denko K.K. | Light-emitting device, light-emitting module, and method for manufacturing light-emitting device |
US8100555B2 (en) * | 2006-11-27 | 2012-01-24 | Shinko Electric Industries Co., Ltd. | Lighting apparatus |
US20120032197A1 (en) * | 2010-08-06 | 2012-02-09 | Nichia Corporation | Light emitting device and image display unit |
US20120056218A1 (en) * | 2010-09-08 | 2012-03-08 | Norfidathul Aizar Abdul Karim | Lead frame package with multiple bends |
US20120104427A1 (en) * | 2009-01-14 | 2012-05-03 | Chi Keung Chan | Miniature surface mount device with large pin pads |
USD661262S1 (en) | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
US20120307481A1 (en) * | 2010-12-15 | 2012-12-06 | Sung Chul Joo | Light emitting diode (led) packages, systems, devices and related methods |
US20130134454A1 (en) * | 2011-11-24 | 2013-05-30 | Cree Huiz Solid State Lighting Company Limited | Water resistant led devices and an led display including same |
USD710809S1 (en) * | 2012-01-12 | 2014-08-12 | Dominant Opto Technologies Sdn. Bhd. | Light emitting diode |
US8987775B2 (en) * | 2009-03-10 | 2015-03-24 | Lg Innotek Co., Ltd. | Light emitting device package |
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IL98660A (en) * | 1991-06-28 | 1996-10-16 | Orbotech Ltd | Method of printing an image on a substrate particularly useful for producing printed circuit boards |
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JP4174823B2 (en) * | 2003-03-27 | 2008-11-05 | サンケン電気株式会社 | Semiconductor light emitting device |
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JP2007305844A (en) * | 2006-05-12 | 2007-11-22 | Stanley Electric Co Ltd | Light-emitting device, and its manufacturing method |
US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US7910938B2 (en) * | 2006-09-01 | 2011-03-22 | Cree, Inc. | Encapsulant profile for light emitting diodes |
JP5416946B2 (en) * | 2008-11-05 | 2014-02-12 | 株式会社東芝 | Phosphor solution |
US8368112B2 (en) * | 2009-01-14 | 2013-02-05 | Cree Huizhou Opto Limited | Aligned multiple emitter package |
JP2013093418A (en) * | 2011-10-25 | 2013-05-16 | Japan Aviation Electronics Industry Ltd | Semiconductor device package assembly, semiconductor device assembly, and method for manufacturing semiconductor device |
JP6323217B2 (en) * | 2013-07-10 | 2018-05-16 | 日亜化学工業株式会社 | Light emitting device |
-
2010
- 2010-04-26 US US29/360,431 patent/USD661262S1/en active Active
-
2012
- 2012-04-12 US US29/418,160 patent/USD715233S1/en active Active
-
2014
- 2014-07-03 US US14/323,699 patent/US20150115294A2/en not_active Abandoned
- 2014-07-11 US US29/496,362 patent/USD743918S1/en active Active
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6483623B1 (en) | 1997-11-28 | 2002-11-19 | Dowa Mining Co., Ltd. | Lamp apparatus for use in optical communication and a process for producing the same |
JP2000183405A (en) | 1998-12-16 | 2000-06-30 | Nichia Chem Ind Ltd | Light emitting device and its manufacture |
USD439351S1 (en) | 1999-11-18 | 2001-03-20 | Sharp Kabushiki Kaisha | Light emitting diode |
USD471166S1 (en) | 2001-04-06 | 2003-03-04 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
US6707069B2 (en) | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
USD491899S1 (en) | 2002-05-22 | 2004-06-22 | Nichia Corporation | Light emitting diode |
USD505396S1 (en) | 2003-03-03 | 2005-05-24 | Nichia Corporation | Light emitting diode |
USD511329S1 (en) | 2003-07-09 | 2005-11-08 | Nichia Corporation | Light emitting diode |
USD494550S1 (en) | 2003-08-26 | 2004-08-17 | Nichia Corporation | Light emitting diode |
USD535263S1 (en) | 2003-09-09 | 2007-01-16 | Nichia Corporation | Light emitting diode |
USD495304S1 (en) | 2003-11-10 | 2004-08-31 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
JP2006130714A (en) | 2004-11-04 | 2006-05-25 | Enomoto Co Ltd | Injection molding machine, led device and led device manufactured using injection molding machine |
USD522468S1 (en) | 2004-12-27 | 2006-06-06 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
US20070075325A1 (en) | 2005-10-04 | 2007-04-05 | Samsung Electro-Mechanics Co., Ltd. | High power light emitting diode package |
USD584246S1 (en) | 2006-03-10 | 2009-01-06 | Tek Beng Low | High power light emitting diode |
USD578083S1 (en) | 2006-03-30 | 2008-10-07 | Toyoda Gosei Co., Ltd. | Light emitting diode |
US7815343B2 (en) | 2006-08-04 | 2010-10-19 | Nichia Corporation | Light emitting device |
US20080037252A1 (en) | 2006-08-04 | 2008-02-14 | Nichia Corporation, A Corporation Of Japan | Light emitting device |
US8100555B2 (en) * | 2006-11-27 | 2012-01-24 | Shinko Electric Industries Co., Ltd. | Lighting apparatus |
USD586302S1 (en) | 2007-05-07 | 2009-02-10 | Alti-Electronics Co., Ltd. | Light emitting diode |
US20100163918A1 (en) * | 2007-06-05 | 2010-07-01 | Seoul Semiconductor Co., Ltd | Led package |
US20090026480A1 (en) * | 2007-07-27 | 2009-01-29 | Nichia Corporation | Light emitting device and method of manufacturing the same |
USD608740S1 (en) | 2008-08-29 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
USD608309S1 (en) | 2008-09-01 | 2010-01-19 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
USD621801S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD621800S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD611012S1 (en) | 2008-12-19 | 2010-03-02 | Everlight Electronics Co., Ltd. | Light emitting diode |
US20110255281A1 (en) | 2008-12-25 | 2011-10-20 | Showa Denko K.K. | Light-emitting device, light-emitting module, and method for manufacturing light-emitting device |
US20120104427A1 (en) * | 2009-01-14 | 2012-05-03 | Chi Keung Chan | Miniature surface mount device with large pin pads |
US8987775B2 (en) * | 2009-03-10 | 2015-03-24 | Lg Innotek Co., Ltd. | Light emitting device package |
USD661262S1 (en) | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
USD715233S1 (en) | 2009-10-26 | 2014-10-14 | Nichia Corporation | Light emitting diode |
USD622682S1 (en) | 2009-11-09 | 2010-08-31 | Alti-Semiconductor Co., Ltd | Light emitting diode |
USD627312S1 (en) | 2010-02-01 | 2010-11-16 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
US20120032197A1 (en) * | 2010-08-06 | 2012-02-09 | Nichia Corporation | Light emitting device and image display unit |
US20120056218A1 (en) * | 2010-09-08 | 2012-03-08 | Norfidathul Aizar Abdul Karim | Lead frame package with multiple bends |
US20120307481A1 (en) * | 2010-12-15 | 2012-12-06 | Sung Chul Joo | Light emitting diode (led) packages, systems, devices and related methods |
US20130134454A1 (en) * | 2011-11-24 | 2013-05-30 | Cree Huiz Solid State Lighting Company Limited | Water resistant led devices and an led display including same |
USD710809S1 (en) * | 2012-01-12 | 2014-08-12 | Dominant Opto Technologies Sdn. Bhd. | Light emitting diode |
Non-Patent Citations (8)
Title |
---|
2009 Nichia LED Catalogue, Mar. 2009, pp. 56, 57, 98, 99 (http://www.nichia.co.jp). |
Examiner's Amendment accompanying Notice of Allowance dated Feb. 2, 2012 in U.S. Appl. No. 29/360,431. |
Examiner's Amendment accompanying Notice of Allowance dated Mar. 12, 2014 in U.S. Appl. No. 29/418,160. |
Office Action dated May 11, 2015 in U.S. Appl. No. 14/323,699. |
Office Action dated Oct. 3, 2011 in U.S. Appl. No. 29/360,431. |
Office Action dated Sep. 4, 2013 in U.S. Appl. No. 29/418,160. |
Office Communication dated Dec. 9, 2011 in U.S. Appl. No. 29/360,431. |
U.S. Appl. No. 14/323,699 (not published). |
Also Published As
Publication number | Publication date |
---|---|
USD661262S1 (en) | 2012-06-05 |
US20150115294A2 (en) | 2015-04-30 |
USD715233S1 (en) | 2014-10-14 |
US20140319551A1 (en) | 2014-10-30 |
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