USD715233S1 - Light emitting diode - Google Patents
Light emitting diode Download PDFInfo
- Publication number
- USD715233S1 USD715233S1 US29/418,160 US201229418160F USD715233S US D715233 S1 USD715233 S1 US D715233S1 US 201229418160 F US201229418160 F US 201229418160F US D715233 S USD715233 S US D715233S
- Authority
- US
- United States
- Prior art keywords
- light emitting
- emitting diode
- color
- view
- elevational view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Description
The patent or application file contains drawings executed in color. Copies of this patent or patent application publication with color drawings will be provided by the Office upon request and payment of the necessary fees.
The portion shown in black indicates the color black. The portion shown in white, i.e., the thin oval portion surrounding the center top window in FIGS. 1 and 4 , indicates the color white.
The center top window inside the thin white portion in FIGS. 1 and 4 is shaded to indicate it is translucent.
The electrodes are shaded to indicate contour.
The thin white portion is substantially planar and flush with the surrounding black body portion. The center top window is substantially planar and flush with the surrounding thin white portion and black body portion.
Claims (1)
- The ornamental design for a light emitting diode, as shown and described.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US29/418,160 USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
US14/323,699 US20150115294A2 (en) | 2009-10-26 | 2014-07-03 | Light emitting device including resin-molded body with white portion and black portion |
US29/496,362 USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009-024958 | 2009-10-26 | ||
JP2009024960 | 2009-10-26 | ||
JP2009024957 | 2009-10-26 | ||
JP2009024961 | 2009-10-26 | ||
JP2009024958 | 2009-10-26 | ||
JP2009024959 | 2009-10-26 | ||
US29/360,431 USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
US29/418,160 USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/360,431 Division USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/323,699 Continuation US20150115294A2 (en) | 2009-10-26 | 2014-07-03 | Light emitting device including resin-molded body with white portion and black portion |
US29/496,362 Continuation USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
USD715233S1 true USD715233S1 (en) | 2014-10-14 |
Family
ID=46148403
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/360,431 Active USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
US29/418,160 Active USD715233S1 (en) | 2009-10-26 | 2012-04-12 | Light emitting diode |
US14/323,699 Abandoned US20150115294A2 (en) | 2009-10-26 | 2014-07-03 | Light emitting device including resin-molded body with white portion and black portion |
US29/496,362 Active USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US29/360,431 Active USD661262S1 (en) | 2009-10-26 | 2010-04-26 | Light emitting diode |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US14/323,699 Abandoned US20150115294A2 (en) | 2009-10-26 | 2014-07-03 | Light emitting device including resin-molded body with white portion and black portion |
US29/496,362 Active USD743918S1 (en) | 2009-10-26 | 2014-07-11 | Light emitting diode |
Country Status (1)
Country | Link |
---|---|
US (4) | USD661262S1 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD743918S1 (en) | 2009-10-26 | 2015-11-24 | Nichia Corporation | Light emitting diode |
USD759603S1 (en) * | 2013-07-17 | 2016-06-21 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
USD842518S1 (en) | 2014-10-31 | 2019-03-05 | Charge Ahead Llc | Combination illumination device and power system |
USD866032S1 (en) | 2014-10-31 | 2019-11-05 | Charge Ahead Llc | Combination illumination device and power system |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013222499A (en) * | 2012-04-12 | 2013-10-28 | Sharp Corp | Light source substrate unit |
JP6328497B2 (en) * | 2014-06-17 | 2018-05-23 | ソニーセミコンダクタソリューションズ株式会社 | Semiconductor light emitting device, package device, and light emitting panel device |
EP3598510B1 (en) * | 2018-07-18 | 2022-02-23 | Lumileds LLC | Light emitting diode device and producing methods thereof |
Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000183405A (en) | 1998-12-16 | 2000-06-30 | Nichia Chem Ind Ltd | Light emitting device and its manufacture |
USD439351S1 (en) | 1999-11-18 | 2001-03-20 | Sharp Kabushiki Kaisha | Light emitting diode |
US6483623B1 (en) | 1997-11-28 | 2002-11-19 | Dowa Mining Co., Ltd. | Lamp apparatus for use in optical communication and a process for producing the same |
USD471166S1 (en) | 2001-04-06 | 2003-03-04 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
US6707069B2 (en) | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
USD491899S1 (en) | 2002-05-22 | 2004-06-22 | Nichia Corporation | Light emitting diode |
USD494550S1 (en) | 2003-08-26 | 2004-08-17 | Nichia Corporation | Light emitting diode |
USD495304S1 (en) | 2003-11-10 | 2004-08-31 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
USD505396S1 (en) | 2003-03-03 | 2005-05-24 | Nichia Corporation | Light emitting diode |
USD511329S1 (en) | 2003-07-09 | 2005-11-08 | Nichia Corporation | Light emitting diode |
JP2006130714A (en) | 2004-11-04 | 2006-05-25 | Enomoto Co Ltd | Injection molding machine, led device and led device manufactured using injection molding machine |
USD522468S1 (en) | 2004-12-27 | 2006-06-06 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
USD535263S1 (en) | 2003-09-09 | 2007-01-16 | Nichia Corporation | Light emitting diode |
USD578083S1 (en) | 2006-03-30 | 2008-10-07 | Toyoda Gosei Co., Ltd. | Light emitting diode |
USD584246S1 (en) | 2006-03-10 | 2009-01-06 | Tek Beng Low | High power light emitting diode |
USD586302S1 (en) | 2007-05-07 | 2009-02-10 | Alti-Electronics Co., Ltd. | Light emitting diode |
USD608309S1 (en) | 2008-09-01 | 2010-01-19 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
USD608740S1 (en) | 2008-08-29 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
USD611012S1 (en) | 2008-12-19 | 2010-03-02 | Everlight Electronics Co., Ltd. | Light emitting diode |
USD621800S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD621801S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD622682S1 (en) | 2009-11-09 | 2010-08-31 | Alti-Semiconductor Co., Ltd | Light emitting diode |
US7815343B2 (en) | 2006-08-04 | 2010-10-19 | Nichia Corporation | Light emitting device |
USD627312S1 (en) | 2010-02-01 | 2010-11-16 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
US20110255281A1 (en) | 2008-12-25 | 2011-10-20 | Showa Denko K.K. | Light-emitting device, light-emitting module, and method for manufacturing light-emitting device |
USD661262S1 (en) * | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
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IL98660A (en) * | 1991-06-28 | 1996-10-16 | Orbotech Ltd | Method of printing an image on a substrate particularly useful for producing printed circuit boards |
KR100309623B1 (en) * | 1994-02-28 | 2002-04-24 | 사토 게니치로 | Light emitting diode lamps and matrix indicators using them |
WO2002056447A2 (en) * | 2000-12-26 | 2002-07-18 | Bei Technologies, Inc. | Linear brushless dc motor with ironless armature assembly |
WO2004001862A1 (en) * | 2002-06-19 | 2003-12-31 | Sanken Electric Co., Ltd. | Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device |
CN100539627C (en) * | 2002-12-10 | 2009-09-09 | 罗姆股份有限公司 | Light element and the image read-out that possesses it |
JP4174823B2 (en) * | 2003-03-27 | 2008-11-05 | サンケン電気株式会社 | Semiconductor light emitting device |
JP4516337B2 (en) * | 2004-03-25 | 2010-08-04 | シチズン電子株式会社 | Semiconductor light emitting device |
KR100616695B1 (en) * | 2005-10-04 | 2006-08-28 | 삼성전기주식회사 | High power light emitting diode package |
JP2007305844A (en) * | 2006-05-12 | 2007-11-22 | Stanley Electric Co Ltd | Light-emitting device, and its manufacturing method |
US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
US7910938B2 (en) * | 2006-09-01 | 2011-03-22 | Cree, Inc. | Encapsulant profile for light emitting diodes |
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US7956469B2 (en) * | 2007-07-27 | 2011-06-07 | Nichia Corporation | Light emitting device and method of manufacturing the same |
JP5416946B2 (en) * | 2008-11-05 | 2014-02-12 | 株式会社東芝 | Phosphor solution |
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US9685592B2 (en) * | 2009-01-14 | 2017-06-20 | Cree Huizhou Solid State Lighting Company Limited | Miniature surface mount device with large pin pads |
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US20120056218A1 (en) * | 2010-09-08 | 2012-03-08 | Norfidathul Aizar Abdul Karim | Lead frame package with multiple bends |
US8610140B2 (en) * | 2010-12-15 | 2013-12-17 | Cree, Inc. | Light emitting diode (LED) packages, systems, devices and related methods |
JP2013093418A (en) * | 2011-10-25 | 2013-05-16 | Japan Aviation Electronics Industry Ltd | Semiconductor device package assembly, semiconductor device assembly, and method for manufacturing semiconductor device |
CN103262269B (en) * | 2011-11-24 | 2018-06-19 | 惠州科锐半导体照明有限公司 | LED encapsulation piece |
USD710809S1 (en) * | 2012-01-12 | 2014-08-12 | Dominant Opto Technologies Sdn. Bhd. | Light emitting diode |
JP6323217B2 (en) * | 2013-07-10 | 2018-05-16 | 日亜化学工業株式会社 | Light emitting device |
-
2010
- 2010-04-26 US US29/360,431 patent/USD661262S1/en active Active
-
2012
- 2012-04-12 US US29/418,160 patent/USD715233S1/en active Active
-
2014
- 2014-07-03 US US14/323,699 patent/US20150115294A2/en not_active Abandoned
- 2014-07-11 US US29/496,362 patent/USD743918S1/en active Active
Patent Citations (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US6483623B1 (en) | 1997-11-28 | 2002-11-19 | Dowa Mining Co., Ltd. | Lamp apparatus for use in optical communication and a process for producing the same |
JP2000183405A (en) | 1998-12-16 | 2000-06-30 | Nichia Chem Ind Ltd | Light emitting device and its manufacture |
USD439351S1 (en) | 1999-11-18 | 2001-03-20 | Sharp Kabushiki Kaisha | Light emitting diode |
USD471166S1 (en) | 2001-04-06 | 2003-03-04 | Kabushiki Kaisha Toshiba | Light emitting semiconductor device |
US6707069B2 (en) | 2001-12-24 | 2004-03-16 | Samsung Electro-Mechanics Co., Ltd | Light emission diode package |
USD491899S1 (en) | 2002-05-22 | 2004-06-22 | Nichia Corporation | Light emitting diode |
USD505396S1 (en) | 2003-03-03 | 2005-05-24 | Nichia Corporation | Light emitting diode |
USD511329S1 (en) | 2003-07-09 | 2005-11-08 | Nichia Corporation | Light emitting diode |
USD494550S1 (en) | 2003-08-26 | 2004-08-17 | Nichia Corporation | Light emitting diode |
USD535263S1 (en) | 2003-09-09 | 2007-01-16 | Nichia Corporation | Light emitting diode |
USD495304S1 (en) | 2003-11-10 | 2004-08-31 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
JP2006130714A (en) | 2004-11-04 | 2006-05-25 | Enomoto Co Ltd | Injection molding machine, led device and led device manufactured using injection molding machine |
USD522468S1 (en) | 2004-12-27 | 2006-06-06 | Samsung Electro-Mechanics Co., Ltd. | Light-emitting diode |
USD584246S1 (en) | 2006-03-10 | 2009-01-06 | Tek Beng Low | High power light emitting diode |
USD578083S1 (en) | 2006-03-30 | 2008-10-07 | Toyoda Gosei Co., Ltd. | Light emitting diode |
US7815343B2 (en) | 2006-08-04 | 2010-10-19 | Nichia Corporation | Light emitting device |
USD586302S1 (en) | 2007-05-07 | 2009-02-10 | Alti-Electronics Co., Ltd. | Light emitting diode |
USD608740S1 (en) | 2008-08-29 | 2010-01-26 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode substrate |
USD608309S1 (en) | 2008-09-01 | 2010-01-19 | Lg Innotek Co., Ltd. | Light-emitting diode (LED) |
USD621800S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD621801S1 (en) | 2008-12-12 | 2010-08-17 | Everlight Electronics Co., Ltd. | Light-emitting diode device |
USD611012S1 (en) | 2008-12-19 | 2010-03-02 | Everlight Electronics Co., Ltd. | Light emitting diode |
US20110255281A1 (en) | 2008-12-25 | 2011-10-20 | Showa Denko K.K. | Light-emitting device, light-emitting module, and method for manufacturing light-emitting device |
USD661262S1 (en) * | 2009-10-26 | 2012-06-05 | Nichia Corporation | Light emitting diode |
USD622682S1 (en) | 2009-11-09 | 2010-08-31 | Alti-Semiconductor Co., Ltd | Light emitting diode |
USD627312S1 (en) | 2010-02-01 | 2010-11-16 | Foxsemicon Integrated Technology, Inc. | Light-emitting diode |
Non-Patent Citations (1)
Title |
---|
2009 Nichia LED Catalogue, Mar. 2009, pp. 56, 57, 98, 99 (http://www.nichia.co.jp). |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USD743918S1 (en) | 2009-10-26 | 2015-11-24 | Nichia Corporation | Light emitting diode |
USD759603S1 (en) * | 2013-07-17 | 2016-06-21 | Nuflare Technology, Inc. | Chamber of charged particle beam drawing apparatus |
USD842518S1 (en) | 2014-10-31 | 2019-03-05 | Charge Ahead Llc | Combination illumination device and power system |
USD866032S1 (en) | 2014-10-31 | 2019-11-05 | Charge Ahead Llc | Combination illumination device and power system |
USD868326S1 (en) | 2014-10-31 | 2019-11-26 | Charge Ahead Llc | Combination illumination device and power system |
Also Published As
Publication number | Publication date |
---|---|
USD743918S1 (en) | 2015-11-24 |
USD661262S1 (en) | 2012-06-05 |
US20150115294A2 (en) | 2015-04-30 |
US20140319551A1 (en) | 2014-10-30 |
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