US20090219722A1 - Ceramic light emitting device - Google Patents

Ceramic light emitting device Download PDF

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Publication number
US20090219722A1
US20090219722A1 US12/039,619 US3961908A US2009219722A1 US 20090219722 A1 US20090219722 A1 US 20090219722A1 US 3961908 A US3961908 A US 3961908A US 2009219722 A1 US2009219722 A1 US 2009219722A1
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Prior art keywords
light emitting
emitting device
peripheral wall
mounting portion
reflective
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Granted
Application number
US12/039,619
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US7855398B2 (en
Inventor
Chin Nyap Tan
Siang Ling Oon
Chu Kun Tan
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Document Security Systems Inc
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Avago Technologies ECBU IP Singapore Pte Ltd
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Priority to US12/039,619 priority Critical patent/US7855398B2/en
Assigned to AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. reassignment AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OON, SIANG LING, TAN, CHIN NYAP, TAN, CHU KUN
Publication of US20090219722A1 publication Critical patent/US20090219722A1/en
Application granted granted Critical
Publication of US7855398B2 publication Critical patent/US7855398B2/en
Assigned to INTELLECTUAL DISCOVERY CO., LTD. reassignment INTELLECTUAL DISCOVERY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: AVAGO TECHNOLOGIES ECBU IP (SINGAPORE) PTE. LTD., AVAGO TECHNOLOGIES FIBER IP (SINGAPORE) PTE. LTD., AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Assigned to DOCUMENT SECURITY SYSTEMS, INC. reassignment DOCUMENT SECURITY SYSTEMS, INC. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: INTELLECTUAL DISCOVERY CO. LTD.
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting

Definitions

  • Ceramic materials may be used as substrates for light emitting devices, such as light emitting diodes.
  • the ceramic material provides good thermal properties for the light emitting devices.
  • the ceramic material may be formed as a well, wherein a light emitter is located on the bottom of the well. Although ceramic materials have good thermal properties, they do not reflect light well.
  • a reflective plating may be used on the walls of the well to reflect light emitted by the light emitter.
  • the well may be filled with a transparent material, such as silicon.
  • a transparent material such as silicon.
  • silicon and other transparent materials do not adhere well to the reflective material and typically delaminate, which may damage the light emitter or leads connected to the light emitter.
  • FIG. 1 is a top plan view of an embodiment of a light emitting device.
  • FIG. 2 is a side, cutaway view of the light emitting device of FIG. 1 .
  • Light emitting devices are described herein.
  • a top plan view of an embodiment of a light emitting device 100 is shown in FIG. 1 and a side cutaway view of the light emitting device is shown in FIG. 2 .
  • the light emitting device 100 includes a substrate 106 with a light emitter 110 located proximate or attached to the substrate 106 .
  • the light emitter 110 may be, as an example, a light-emitting diode.
  • the substrate 106 is made of a material at least partially comprising ceramic.
  • the substrate 106 includes a reflector portion 112 and a mounting portion 114 , wherein the reflector portion 112 at least partially surrounds the mounting portion 114 .
  • the reflector portion 112 may not completely surround the mounting portion 114 .
  • the reflector portion 112 is shown as being circular, but it may be any shape.
  • the mounting portion 114 may be substantially planar in order to support the light emitter 110 .
  • the reflector portion 112 includes an outer peripheral wall 120 and an inner peripheral wall 122 .
  • the inner peripheral wall may have a height of approximately 0.5 millimeters.
  • Between the outer peripheral wall 120 and the inner peripheral wall 122 is a reflective surface 126 and an upper surface 128 separated by an edge 130 .
  • the edge 130 separates the reflective surface 126 from the upper surface 128 and need not be a rigid angle.
  • the combination of the reflective portion 112 and the mounting portion 114 forms a well 134 into which a transparent or semi-transparent material, such as silicon may be placed.
  • Leads 140 , 142 may be used to electrically connect the light emitter 110 to traces or other contacts, not shown, on the mounting portion 114 .
  • the inner peripheral 122 wall may extend substantially perpendicular to the mounting portion 114 .
  • the reflective surface 126 may extend at an angle from the inner peripheral wall 122 . The angle depends on the beam pattern of light to be emitted by the light emitting device 100 . In the embodiment of the light emitting device of FIG. 2 , the intersection of the reflective surface 126 and the inner peripheral wall 122 forms an obtuse angle.
  • the light emitter 110 is attached to the mounting surface 114 using conventional mechanisms. For example, an adhesive may be used.
  • the leads 140 , 142 supply electric power to the light emitter 110 by way of traces or the like, not shown, on the mounting surface 114 .
  • the light emitter 110 When the light emitter 110 is powered, it emits light.
  • the direction of the light emission may be in any direction, including toward the reflective surface 126 .
  • the well 134 may be filled with a transparent or semi-transparent material.
  • the material is silicon.
  • other materials may be used to fill the well 134 .
  • the silicon or other material filling the well 134 may also serve to diffuse light emitted from the light emitter 110 .
  • the diffusion causes light to be emitted in many different directions and may cause some light to be incident with the reflective surface 126 .
  • the angle of the reflective surface 126 causes incident light to reflect out of the well 134 .
  • the reflective surface 126 is coated with a reflective material 150 , such as gold or silver.
  • the reflective material 150 is plated to the reflective surface 126 .
  • the reflective material 150 serves to reflect light emitted from the light emitter 110 out of the well 134 .
  • the reflective material 150 is not located on the inner peripheral wall 122 . Therefore, the silicon or other material filling the well 134 contacts the ceramic substrate directly. As set forth below, the material filling the well 134 may not adhere well to the reflective material 150 .
  • the inner peripheral wall 122 is comprised of ceramic. Therefore, the silicon or other filler material in the well 134 contacts the ceramic of the inner peripheral wall 122 . Silicon or other filler material may delaminate from the reflective material 150 .
  • the inner peripheral wall 122 serves to stop the delamination from encountering the proximity of the light emitter 110 .
  • the ceramic surface of the inner peripheral wall 122 adheres strongly with the filler material, which stops delamination. Should the delamination get close to the light emitter 110 , it could pull the leads 140 , 142 from either the mounting portion 114 or the light emitter 110 .
  • the delamination could also cause the light emitter 110 to become dislodged from the mounting portion 114 .
  • the delamination may also enable contaminants in the well 134 , which can cause the aforementioned problems.
  • the ceramic on the inner peripheral wall 122 is a surface in which the silicon or other filler material can adhere. Therefore, if the filler material delaminates from the reflective material 150 , the delamination will stop at the inner peripheral wall 122 and will not spread to the vicinity of the light emitter 110 . Accordingly, the aforementioned problems associated with delamination are prevented.

Abstract

A light emitting device comprising a ceramic substrate is disclosed. And embodiment of the substrate comprises a mounting portion, a peripheral wall extending from the mounting portion, and a reflective surface extending from the peripheral wall opposite the mounting portion. The reflective surface has a reflective material located thereon. The peripheral wall, the mounting portion, and the reflective surface form a well. A light emitter is located adjacent the mounting portion. A transparent material is located in the well. The peripheral wall is devoid of the reflective material.

Description

    BACKGROUND
  • Ceramic materials may be used as substrates for light emitting devices, such as light emitting diodes. The ceramic material provides good thermal properties for the light emitting devices. The ceramic material may be formed as a well, wherein a light emitter is located on the bottom of the well. Although ceramic materials have good thermal properties, they do not reflect light well. In order to improve the intensity of light emitted by the light emitting device, a reflective plating may be used on the walls of the well to reflect light emitted by the light emitter.
  • In order to protect the light emitter, the well may be filled with a transparent material, such as silicon. However, silicon and other transparent materials do not adhere well to the reflective material and typically delaminate, which may damage the light emitter or leads connected to the light emitter.
    • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a top plan view of an embodiment of a light emitting device.
  • FIG. 2 is a side, cutaway view of the light emitting device of FIG. 1.
    •  DETAILED DESCRIPTION
  • Light emitting devices are described herein. A top plan view of an embodiment of a light emitting device 100 is shown in FIG. 1 and a side cutaway view of the light emitting device is shown in FIG. 2. The light emitting device 100 includes a substrate 106 with a light emitter 110 located proximate or attached to the substrate 106. The light emitter 110 may be, as an example, a light-emitting diode.
  • The substrate 106 is made of a material at least partially comprising ceramic. The substrate 106 includes a reflector portion 112 and a mounting portion 114, wherein the reflector portion 112 at least partially surrounds the mounting portion 114. In some embodiments, the reflector portion 112 may not completely surround the mounting portion 114. The reflector portion 112 is shown as being circular, but it may be any shape. The mounting portion 114 may be substantially planar in order to support the light emitter 110.
  • The reflector portion 112 includes an outer peripheral wall 120 and an inner peripheral wall 122. The inner peripheral wall may have a height of approximately 0.5 millimeters. Between the outer peripheral wall 120 and the inner peripheral wall 122 is a reflective surface 126 and an upper surface 128 separated by an edge 130. The edge 130 separates the reflective surface 126 from the upper surface 128 and need not be a rigid angle. The combination of the reflective portion 112 and the mounting portion 114 forms a well 134 into which a transparent or semi-transparent material, such as silicon may be placed. Leads 140, 142 may be used to electrically connect the light emitter 110 to traces or other contacts, not shown, on the mounting portion 114.
  • The inner peripheral 122 wall may extend substantially perpendicular to the mounting portion 114. The reflective surface 126 may extend at an angle from the inner peripheral wall 122. The angle depends on the beam pattern of light to be emitted by the light emitting device 100. In the embodiment of the light emitting device of FIG. 2, the intersection of the reflective surface 126 and the inner peripheral wall 122 forms an obtuse angle.
  • The light emitter 110 is attached to the mounting surface 114 using conventional mechanisms. For example, an adhesive may be used. The leads 140, 142 supply electric power to the light emitter 110 by way of traces or the like, not shown, on the mounting surface 114. When the light emitter 110 is powered, it emits light. The direction of the light emission may be in any direction, including toward the reflective surface 126.
  • In conventional light emitting devices, contaminants can enter the well and ruin the light emitting device 100. For example, the contaminants can erode or break the leads 140, 142 or the traces on the mounting surface 114. In addition, the contaminants can damage the light emitter 110 in numerous ways. In order to keep contaminants away from the light emitter 110 and its associated electronics, the well 134 may be filled with a transparent or semi-transparent material. One example of the material is silicon. However, other materials may be used to fill the well 134. The silicon or other material filling the well 134 may also serve to diffuse light emitted from the light emitter 110. The diffusion causes light to be emitted in many different directions and may cause some light to be incident with the reflective surface 126. The angle of the reflective surface 126 causes incident light to reflect out of the well 134.
  • The reflective surface 126 is coated with a reflective material 150, such as gold or silver. In some embodiments, the reflective material 150 is plated to the reflective surface 126. The reflective material 150 serves to reflect light emitted from the light emitter 110 out of the well 134. As described in greater detail below, the reflective material 150 is not located on the inner peripheral wall 122. Therefore, the silicon or other material filling the well 134 contacts the ceramic substrate directly. As set forth below, the material filling the well 134 may not adhere well to the reflective material 150.
  • As stated above, the inner peripheral wall 122 is comprised of ceramic. Therefore, the silicon or other filler material in the well 134 contacts the ceramic of the inner peripheral wall 122. Silicon or other filler material may delaminate from the reflective material 150. The inner peripheral wall 122 serves to stop the delamination from encountering the proximity of the light emitter 110. The ceramic surface of the inner peripheral wall 122 adheres strongly with the filler material, which stops delamination. Should the delamination get close to the light emitter 110, it could pull the leads 140, 142 from either the mounting portion 114 or the light emitter 110. The delamination could also cause the light emitter 110 to become dislodged from the mounting portion 114. The delamination may also enable contaminants in the well 134, which can cause the aforementioned problems.
  • The ceramic on the inner peripheral wall 122 is a surface in which the silicon or other filler material can adhere. Therefore, if the filler material delaminates from the reflective material 150, the delamination will stop at the inner peripheral wall 122 and will not spread to the vicinity of the light emitter 110. Accordingly, the aforementioned problems associated with delamination are prevented.

Claims (21)

1. A light emitting device comprising:
a ceramic substrate, said substrate comprising:
a mounting portion;
a peripheral wall extending from said mounting portion; and
a reflective surface extending from said peripheral wall opposite said mounting portion, said reflective surface comprising a reflective material located thereon;
wherein said mounting portion, said peripheral wall, and said reflective surface form a well;
a light emitter located adjacent said mounting portion; and
a transparent material located in said well;
wherein said peripheral wall is devoid of said reflective material.
2. The light emitting device of claim 1, wherein said reflective material surrounds said light emitter.
3. The light emitting device of claim 1, wherein said reflective material comprises gold.
4. The light emitting device of claim 1, wherein said reflective material comprises silver.
5. The light emitting device of claim 1, wherein said transparent material comprises silicon.
6. The light emitting device of claim 1, wherein said mounting portion is devoid of said reflective material.
7. The light emitting device of claim 1, wherein said reflective material is plated to said reflective surface.
8. The light emitting device of claim 1, wherein said mounting portion is planar.
9. The light emitting device of claim 1, wherein said peripheral wall comprises ceramic.
10. The light emitting device of claim 1, wherein said peripheral wall surrounds said light emitter.
11. The light emitting device of claim 1, wherein said peripheral wall extends substantially perpendicular from said mounting portion.
12. The light emitting device of claim 1, wherein said reflective surface extends from said peripheral wall opposite said mounting portion, and wherein an obtuse angle is formed between said reflective surface and said peripheral wall.
13. A method of manufacturing a light emitting device, said method comprising:
forming a well in a ceramic substrate, said well comprising:
a mounting portion;
a peripheral wall extending from said mounting portion; and
a reflective surface extending from said peripheral wall opposite said mounting portion;
locating a reflective material on said reflective surface, wherein said reflective material does not contact said peripheral wall;
locating a light emitter located adjacent said mounting portion; and
at least partially filling said well with a transparent material.
14. The light emitting device of claim 13, wherein said reflective surface surrounds said light emitter.
15. The light emitting device of claim 13, wherein said reflective material comprises gold.
16. The light emitting device of claim 13, wherein said reflective material comprises silver.
17. The light emitting device of claim 13, wherein said transparent material comprises silicon.
18. The light emitting device of claim 13, wherein said reflective material is plated to said reflective surface.
19. The light emitting device of claim 13, wherein said peripheral wall surrounds said light emitter.
20. The light emitting device of claim 13, wherein said peripheral wall extends substantially perpendicular from said mounting portion.
21. The light emitting device of claim 13, wherein said reflective surface extends from said peripheral wall opposite said mounting portion, and wherein an obtuse angle is formed between said reflective surface and said peripheral wall.
US12/039,619 2008-02-28 2008-02-28 Ceramic light emitting device package Expired - Fee Related US7855398B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110012497A1 (en) * 2009-07-15 2011-01-20 Kyowa Electric Wire Co., Ltd. Plating structure and method for manufacturing electric material

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507049B1 (en) * 2000-09-01 2003-01-14 General Electric Company Encapsulants for solid state devices
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20040211970A1 (en) * 2003-04-24 2004-10-28 Yoshiaki Hayashimoto Semiconductor light emitting device with reflectors having cooling function
US20080217633A1 (en) * 2007-03-01 2008-09-11 Wu Yin Chang Light emitting diode structure
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US7514723B2 (en) * 2001-11-30 2009-04-07 Osram Opto Semiconductors Gmbh Optoelectronic component

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6507049B1 (en) * 2000-09-01 2003-01-14 General Electric Company Encapsulants for solid state devices
US7514723B2 (en) * 2001-11-30 2009-04-07 Osram Opto Semiconductors Gmbh Optoelectronic component
US6707069B2 (en) * 2001-12-24 2004-03-16 Samsung Electro-Mechanics Co., Ltd Light emission diode package
US20040211970A1 (en) * 2003-04-24 2004-10-28 Yoshiaki Hayashimoto Semiconductor light emitting device with reflectors having cooling function
US7456499B2 (en) * 2004-06-04 2008-11-25 Cree, Inc. Power light emitting die package with reflecting lens and the method of making the same
US20080217633A1 (en) * 2007-03-01 2008-09-11 Wu Yin Chang Light emitting diode structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110012497A1 (en) * 2009-07-15 2011-01-20 Kyowa Electric Wire Co., Ltd. Plating structure and method for manufacturing electric material

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