US20040070338A1 - White light emitting device - Google Patents

White light emitting device Download PDF

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Publication number
US20040070338A1
US20040070338A1 US10/679,490 US67949003A US2004070338A1 US 20040070338 A1 US20040070338 A1 US 20040070338A1 US 67949003 A US67949003 A US 67949003A US 2004070338 A1 US2004070338 A1 US 2004070338A1
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Prior art keywords
light emitting
cover member
emitting device
white light
luminance
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US10/679,490
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US7180240B2 (en
Inventor
Katsuhiko Noguchi
Megumi Horiuchi
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Citizen Electronics Co Ltd
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Citizen Electronics Co Ltd
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Assigned to CITIZEN ELECTRONICS CO., LTD. reassignment CITIZEN ELECTRONICS CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: HORIUCHI, MEGUMI, NOGUCHI, KATSUHIKO
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/505Wavelength conversion elements characterised by the shape, e.g. plate or foil
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73201Location after the connecting process on the same surface
    • H01L2224/73203Bump and layer connectors
    • H01L2224/73204Bump and layer connectors the bump connector being embedded into the layer connector
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50Wavelength conversion elements
    • H01L33/501Wavelength conversion elements characterised by the materials, e.g. binder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Definitions

  • the present invention relates to a white light emitting device.
  • FIG. 25 is a sectional view of a conventional LED device disclosed in U.S. Pat. No. 6,069,440.
  • the white LED device 70 comprises a substrate 73 , electrodes 71 and 72 secured to the substrate 73 and a blue LED 61 mounted on the substrate 73 .
  • the LED 61 is connected to the electrodes 71 and 72 by lead wires 62 .
  • the LED 61 and electrodes 71 , 72 are encapsulated with a transparent encapsulating resin 91 .
  • the fluorescent material comprises phosphor particles 81 .
  • the LED When the current is applied to the blue LED 61 via electrodes 71 and 72 , the LED emits blue light Pb. When a portion of the blue light impinges upon the phosphor particle, the phosphor particle absorbs the blue light and emits yellow light Py. When the yellow light Py and the blue light Pb are combined, white light Pw is created.
  • U.S. Pat. No. 6,319,425 discloses an LED covered by a cap in which fluorescent material is included.
  • U.S. Pat. No. 6,351,069 discloses an LED encapsulated by a transparent resin in which two kinds of phosphor particles are included, thereby producing white light.
  • the LED is a compound semiconductor
  • the chromaticity and luminance of the mixed white light Pw also vary widely because of difference of quantity and distribution of the phosphor particles in the encapsulating resin.
  • FIGS. 26 and 27 are graphs showing numeric data widely varied in chromaticity and luminance of LED devices.
  • FIG. 26 is a graph of XYZ chromaticity coordinates showing variation in chromaticity of LED devices by 1 lot mass production. Each black point indicates the chromaticity of an LED device. The variation is in an upward zonal arrangement.
  • the dispersion of the black points in the width direction shown by the letter A means the variation of chromaticity of the blue LED
  • the dispersion in the longitudinal direction shown by the letter B means the variation of quantity and distribution of the phosphor particles in the encapsulating resin.
  • An LED device having chromaticity which is largely deviated from a central value in FIG. 26 can not be used as a device for emitting white light. It is frequently desirable that the LED device has chromaticity in a central range shown by hatching where X and Y are in a range of 0.33 ⁇ 0.01.
  • the horizontal axis shows luminance and the vertical axis shows the number of LED devices.
  • the luminance variation is distributed in +30% to ⁇ 40% range from the center of the distribution.
  • a desirable range R 2 is about ⁇ 20% as shown by arrows in FIG. 27.
  • An object of the present invention is to provide a white light emitting device which may correct distributions of the chromaticity and luminance in a desired range.
  • a white light emitting device comprising a blue light emitting element, a cover member for covering the blue light emitting element, fluorescent material being mixed in the cover member for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material being mixed in the cover member for adjusting the luminance of the light.
  • the luminance reducing material is pigment or dye for reducing the luminance irrespective of the wavelength of the light emitting from the light emitting element.
  • the cover member is formed with elastomer of silicon group in which the fluorescent material and the luminance reducing material are mixed.
  • the present invention further provides a white light emitting device comprising a case body having a recess forming a reflection face, a blue light emitting element mounted on a bottom of the recess, a cover member including fluorescent material and covering a light emitting face of the case body, fluorescent material being mixed in the cover member for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material being mixed in the cover member for adjusting the luminance of the light.
  • the white light emitting device further comprises a cover member holding portion formed in the recess of the case body, the cover member being mounted on the cover member holding portion.
  • the recess is formed into a cup shape having an inclination surface open to a light emitting direction, the cover member has an inclined peripheral wall so as to be engaged with the inclination surface.
  • the white light emitting device further comprises a shoulder formed in the recess of the case body for holding the cover member.
  • the blue light emitting element is mounted on the bottom of the recess by face down bonding.
  • the blue light emitting element is mounted on a substrate by face down bonding to form a light emitting unit, and the substrate is mounted on the bottom of the recess.
  • the blue light emitting element is an LED of InGaN group.
  • the fluorescent material is a fluorescent material of YAG group.
  • the luminance reducing material is a pigment of black.
  • the present invention also provides a white light emitting device comprising, a case body having a recess forming a reflection face, a blue light emitting element mounted on a bottom of the recess, a cover member including fluorescent material and covering a light emitting face of the case body, the case body comprising a pair of metal cores which are opposed to each other interposing an insulation member, the surface of each of the metal cores being coated with a metal plating having high reflectance, fluorescent material for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material for adjusting the luminance of the light being mixed in the cover member.
  • the metal case is made of a magnesium alloy, the surface of the metal core is coated with silver plating.
  • the cover member has arms, the arms are engaged with grooves formed in the case body.
  • a projection is formed on the arm of the cover member, the projection is engaged with an engaging hole formed in the groove of the case body.
  • the cover member is provided by separating from a cover member assembly comprising a plurality of cover members which are connected by arms.
  • FIG. 1 is a perspective view of a white light emitting device according to a first embodiment of the present invention
  • FIG. 2 is a perspective view of the white light emitting device in which a cover member in FIG. 1 is removed;
  • FIG. 3 is a sectional view of the white light emitting device taken along a line III-III of FIG. 1;
  • FIG. 4 is a perspective view of a light emitting unit
  • FIG. 5 is a sectional view showing a white light emitting device according to a second embodiment of the present invention.
  • FIG. 6 is a perspective view showing a white light emitting device according to a third embodiment of the present invention.
  • FIG. 7 is a perspective view of the white light emitting device as viewed from a reverse side thereof;
  • FIG. 8 is a sectional view taken along a line VIII-VIII of FIG. 6;
  • FIG. 9 is a flowchart showing the steps for manufacturing the third embodiment
  • FIGS. 10, 11, 12 , 13 a and 13 b are perspective views for explaining a method for manufacturing a light emitting element unit assembly
  • FIG. 14 is a perspective view of a metal core assembly
  • FIGS. 15, 16, 17 and 18 are perspective views for explaining a method for manufacturing a light emitting device
  • FIG. 19 is a perspective view showing a method for combining a light emitting element unit and a cover member
  • FIG. 20 is a plan view showing a white light emitting device according to a fourth embodiment of the present invention.
  • FIG. 21 is a sectional view of the device taken along a line A-A of FIG. 20;
  • FIGS. 22 a to 22 c are perspective views for explaining a method of manufacturing a white light emitting device of a fourth embodiment
  • FIG. 23 is a plan view of a white light emitting device according to a fifth embodiment of the present invention.
  • FIG. 24 is a sectional view of the device taken along a line B-B of FIG. 23;
  • FIG. 25 is a sectional view of a conventional LED device disclosed in U.S. Pat. No. 6,069,440;
  • FIGS. 26 and 27 are graphs showing dispersion in chromaticity and luminance of LED devices.
  • FIG. 1 is a perspective view of a white light emitting device according to a first embodiment of the present invention
  • FIG. 2 is a perspective view of the white light emitting device in which a cover member in FIG. 1 is removed
  • FIG. 3 is a sectional view of the white light emitting device taken along a line III-III of FIG. 1
  • FIG. 4 is a perspective view of a light emitting element unit.
  • a white light emitting LED device 10 comprises a cubic case 1 made of moldable metal having a high heat conductivity such as Mg group and formed by injection molding, and having a recess 1 c of an inverted truncated cone and having an inclined inside wall 1 k.
  • the case 1 c comprises a pair of first and second half metal cores 3 a and 3 b, interposing an insulation layer 2 which is made of resin and charged in a slit 1 g.
  • the inside wall of the recess 1 c and an upper surface 1 a of the case 1 c are processed into a light reflection surface by silver plating.
  • a light emitting element unit 5 comprises a blue LED 6 of InGaN group, a substrate 7 made of ceramics and having upper electrodes 7 a and 7 b and lower electrodes 7 c and 7 d.
  • the upper and lower electrodes 7 a and 7 c, and the upper and lower electrodes 7 b and 7 d are electrically connected with each other by a pair of through-holes 7 e, thereby forming a pair of wiring patterns.
  • a pair of bumps 6 a (FIG. 3) are secured to a pair of electrodes (not shown) on the underside of the LED 6 .
  • the blue LED 6 as a light emitting element is mounted on the upper electrodes 7 a, 7 b through bumps 6 a by face down bonding.
  • the underside of the LED 6 is encapsulated by a resin 8 to protect the bumps 6 a. Further, the LED 6 is encapsulated by a resin 9 .
  • the light emitting element unit 5 is mounted on the bottom of the recess 1 c by soldering the lower electrodes 7 c, 7 d to the metal cores 3 a, 3 b.
  • a cover member 11 made of transparent resin such as elastomer of silicon group has an outside shape so as to engage with the inclined wall 1 k of the recess 1 c. If required, the cover member 11 is secured to the recess 1 c by caulking or an adhesive.
  • YAG phosphor particles 12 and a luminance reducing material particles 13 such as pigment and dye particles 7 f are mixed. The phosphor particle 12 and the pigment particle 13 are selected so that the chromaticity and luminance of the light emitted from the LED 6 are corrected to desired values.
  • the phosphor particle is selected from fluorescent materials of YAG group where the ratio of Ga to Gd is variously changed.
  • pigments of black group in which graphite and carbon or red, green and blue pigments are mixed are used.
  • the case 1 is made of a metal having a high heat conductivity, the case is superior in heat radiation. Therefore, the LED device can effectively be used for a light emitting device in which the case temperature rises highly because of a large current.
  • the cover member 11 in which the phosphor particles 12 and the luminance reducing particles 13 are mixed.
  • a white light emitting device 1 satisfies both of the chromaticity and luminance in a desired range, thereby reducing the variation in characteristics. Since the luminance reducing member is used, initial luminance can be set to a large value, so that the luminance is adjusted by reducing the luminance. Therefore, luminance can be adjusted in a wide range.
  • the cover member 11 is made of the elastomer of silicon group, the phosphor particles 12 and the luminance reducing particles 13 are uniformly distributed in the cover member without depositing and biasing. Therefore, the LED device emits light uniform in chromaticity and luminance.
  • FIG. 5 is a sectional view showing a white light emitting device according to a second embodiment of the present invention.
  • the white light emitting device 20 has the case 1 same as that of the first embodiment.
  • a cover plate 14 made of glass or transparent solid plastic such as acrylic resin and silicon is secured to the upper surface 1 a to press the cover member 11 against the inside wall of the recess 1 c.
  • Other parts are identified by the same reference numerals as FIG. 3.
  • cover member 11 Since the cover member 11 is held by the cover plate 14 , it is not necessary to adhere the cover member 11 to the wall of the recess 1 k.
  • FIG. 6 is a perspective view showing a white light emitting device according to a third embodiment of the present invention.
  • FIG. 7 is a perspective view of the white light emitting device as viewed from a reverse side thereof,
  • FIG. 8 is a sectional view taken along a line VIII-VIII of FIG. 6.
  • the white light emitting device 30 comprises a case 21 having a cubic shape.
  • the case 21 comprises a pair of metal cores 23 a and 23 b made of metal having a high heat conductivity, and a combining resin 24 of heat resistivity.
  • the combining resin 24 is mounted on a step 21 f of the case 21 to form an upper shape of the case, charged in a slit 21 g between the metal cores 23 a and 23 b, and in grooves 23 c and 23 d formed in the side wall and the underside of the metal cores 23 a and 23 b, thereby combining the metal cores.
  • the undersides of the metal cores 23 a and 23 b form a pair of electrodes 25 and 26 .
  • a recess 21 c is formed in the metal cores 23 a and 23 b.
  • the inside wall of the recess 21 c and the surfaces of the metal cores 23 a and 23 b are processed into light reflection surfaces by silver plating.
  • a shoulder 21 e is formed in an upper portion of the recess 21 c, and a cover member 32 is mounted on the shoulder.
  • Other parts are the same as the first embodiment and identified by the same reference numerals as the first embodiment.
  • FIG. 9 is a flowchart showing the steps for manufacturing the third embodiment
  • FIGS. 10 ⁇ 18 are perspective views showing the steps, whereby a plurality of light emitting element devices are manufactured at the same time.
  • a substrate assembly for a light emitting element unit is manufactured.
  • FIG. 10 is a perspective view of a substrate assembly 107 .
  • the substrate assembly 107 is divided into nine areas 24 for nine LED devices by dicing lines 26 and 27 . On the upper surface and the underside of a substrate material, four sets of electrodes 107 b are secured.
  • a pair of through-holes 107 c are formed to electrically connect the upper and lower electrodes 107 b.
  • the blue LED 6 is mounted on the upper electrodes 107 b through bumps (not shown) as shown in FIG. 11. Further, at a step S 3 , the underside of the LED 6 is encapsulated by the resin 8 and encapsulating resin 9 to form a light emitting element unit assembly 105 as shown in FIG. 12.
  • step S 4 the light emitting element unit assembly 105 is cut off along the dicing lines 26 and 27 to produce the light emitting element unit 5 from the assembly 105 as shown in FIG. 13 b.
  • the chromaticity and luminance of each of the produced lighting element units are measured.
  • the measured units are classified into ranks dependent on the result of the measurement.
  • a metal core assembly is manufactured.
  • a metal core assembly 123 is formed by injection molding and divided into nine areas 30 for nine units 5 by dicing lines 31 and 32 .
  • a cylindrical portion 123 b having recess 21 c is formed in each area 30 at a central portion.
  • Three slits 123 g are formed in parallel to the lines 32 except a peripheral frame 123 a.
  • a resin is charged in a recess within the peripheral frame 123 a, slits 123 g and grooves 123 c to form a resin layer 104 as shown in FIG. 15.
  • a case assembly 121 is produced.
  • step S 7 light emitting element units 5 belonging to the same class are mounted on bottoms 21 d of recesses 21 c as shown in FIG. 16.
  • cover members 32 belonging to the same rank are secured to the inside wall of the recesses 21 c, respectively, to form a light emitting element device assembly 130 as shown in FIG. 17.
  • step S 9 the assembly 130 is cut off along the dicing lines 31 and 32 to separate the independent light emitting device 30 as shown in FIG. 18.
  • FIG. 19 is a perspective view showing a method for combining a blue light emitting element unit and a cover member.
  • the blue LED 6 in the unit 5 is measured about the chromaticity and the luminance by an LED tester, and measured LEDs are classified into classes, for example classes a, b, c, in accordance with the measured characteristics.
  • the cover members 32 are also classified into classes A, B and C so that the combinations a and A, b and B, c and C perform to emit desirable white lights.
  • the combined sets are mounted in the case 21 .
  • white light emitting devices 30 are produced.
  • the cover member 32 can easily be set in the recess.
  • the vertical wall 21 m is formed, and the side wall 32 a of the cover member 32 is accordingly vertical. Therefore, when the cover member is set in the recess 21 c, it is not necessary to judge the distinction of both sides of the cover member.
  • FIG. 20 is a plan view showing a white light emitting device according to a fourth embodiment of the present invention
  • FIG. 21 is a sectional view of the device taken along a line A-A of FIG. 21.
  • the white light emitting device 40 comprises a case 31 comprising a pair of metal cores 33 a and 33 b and a slit 33 c between the metal cores 33 a and 33 b.
  • the device 40 is characterized in that four grooves 31 a are formed in the upper surfaces of the metal cores 33 a, 33 b radially extending from the recess 21 c.
  • four arms 42 a are radially extending from a cover member 42 , corresponding to the grooves 31 a. The arms 42 a are engaged in the grooves 31 a and secured thereto.
  • FIGS. 22 a ⁇ 22 c are perspective views showing steps for manufacturing a light emitting device assembly. Referring to FIG. 22 a, nine cover members 42 are assembled by connecting arms 42 a of each cover member 42 , thereby forming a cover member assembly 142 .
  • the cover member assembly 142 is mounted on the case assembly 131 .
  • a light emitting device assembly 140 is formed.
  • a plurality of cover members 42 having the same characteristics are assembled. Therefore, light emitting devices of same characteristics can be produced. Further, constructing steps are reduced.
  • FIG. 23 is a plan view of a white light emitting device according to a fifth embodiment of the present invention
  • FIG. 24 is a sectional view of the device taken along a line B-B of FIG. 23.
  • the white light emitting device 50 comprises a case 41 comprising a pair of metal cores 43 a and 43 b and a slit 43 c between the metal cores 43 a and 43 b.
  • four grooves 41 a are formed in the upper surfaces of the metal cores 43 a, 43 b, radially extending from the recess 21 c.
  • an engaging hole 41 j is formed in the bottom of the groove.
  • four arms 51 a are radially extending from a cover member 51 and a projection 51 c is formed on the underside of the arm 51 a corresponding to the hole 41 j of the groove 41 a.
  • the arms 51 a are engaged in the grooves 41 a and the projection 51 c is engaged with hole 41 j and secured thereto.
  • the cover member 51 is strongly fixed to the case 41 by the engagement of the projection 51 c with the hole 41 j.
  • the cover member in which the phosphor particles and the luminance reducing particles are mixed. Therefore the white light emitting device produces white light which satisfies both of the chromaticity and luminance in a desired range by selecting the amount of the phosphor and luminance reducing particles, thereby reducing the dispersion in characteristics.
  • initial luminance can be set to a large value, so that the luminance is adjusted by reducing the luminance. Therefore, luminance can be adjusted in a wide range.
  • the cover member is made of the elastomer of silicon group, the phosphor particles and the luminance reducing particles are uniformly distributed in the cover member without depositing and biasing. Therefore, the LED device emits light uniform in chromaticity and luminance.

Abstract

A blue light emitting element is mounted on a bottom of a case body. A cover member covers the blue light emitting element. Fluorescent material is mixed in the cover member for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material for adjusting the luminance of the light is mixed in the cover member.

Description

    BACKGROUND OF THE INVENTION
  • The present invention relates to a white light emitting device. [0001]
  • FIG. 25 is a sectional view of a conventional LED device disclosed in U.S. Pat. No. 6,069,440. The [0002] white LED device 70 comprises a substrate 73, electrodes 71 and 72 secured to the substrate 73 and a blue LED 61 mounted on the substrate 73. The LED 61 is connected to the electrodes 71 and 72 by lead wires 62. The LED 61 and electrodes 71, 72 are encapsulated with a transparent encapsulating resin 91.
  • In the [0003] resin 91, fluorescent materials of YAG group are mixed. The fluorescent material comprises phosphor particles 81.
  • When the current is applied to the [0004] blue LED 61 via electrodes 71 and 72, the LED emits blue light Pb. When a portion of the blue light impinges upon the phosphor particle, the phosphor particle absorbs the blue light and emits yellow light Py. When the yellow light Py and the blue light Pb are combined, white light Pw is created.
  • Furthermore, U.S. Pat. No. 6,319,425 discloses an LED covered by a cap in which fluorescent material is included. [0005]
  • Further, U.S. Pat. No. 6,351,069 discloses an LED encapsulated by a transparent resin in which two kinds of phosphor particles are included, thereby producing white light. [0006]
  • However, since the LED is a compound semiconductor, there is wide variation in chromaticity and luminance of products. Further, the chromaticity and luminance of the mixed white light Pw also vary widely because of difference of quantity and distribution of the phosphor particles in the encapsulating resin. [0007]
  • FIGS. 26 and 27 are graphs showing numeric data widely varied in chromaticity and luminance of LED devices. [0008]
  • FIG. 26 is a graph of XYZ chromaticity coordinates showing variation in chromaticity of LED devices by [0009] 1 lot mass production. Each black point indicates the chromaticity of an LED device. The variation is in an upward zonal arrangement. Here, the dispersion of the black points in the width direction shown by the letter A means the variation of chromaticity of the blue LED, the dispersion in the longitudinal direction shown by the letter B means the variation of quantity and distribution of the phosphor particles in the encapsulating resin.
  • An LED device having chromaticity which is largely deviated from a central value in FIG. 26 can not be used as a device for emitting white light. It is frequently desirable that the LED device has chromaticity in a central range shown by hatching where X and Y are in a range of 0.33±0.01. [0010]
  • In the graph of FIG. 27, the horizontal axis shows luminance and the vertical axis shows the number of LED devices. The luminance variation is distributed in +30% to −40% range from the center of the distribution. However, a desirable range R[0011] 2 is about ±20% as shown by arrows in FIG. 27.
  • SUMMARY OF THE INVENTION
  • An object of the present invention is to provide a white light emitting device which may correct distributions of the chromaticity and luminance in a desired range. [0012]
  • According to the present invention, there is provided a white light emitting device comprising a blue light emitting element, a cover member for covering the blue light emitting element, fluorescent material being mixed in the cover member for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material being mixed in the cover member for adjusting the luminance of the light. [0013]
  • The luminance reducing material is pigment or dye for reducing the luminance irrespective of the wavelength of the light emitting from the light emitting element. [0014]
  • The cover member is formed with elastomer of silicon group in which the fluorescent material and the luminance reducing material are mixed. [0015]
  • The present invention further provides a white light emitting device comprising a case body having a recess forming a reflection face, a blue light emitting element mounted on a bottom of the recess, a cover member including fluorescent material and covering a light emitting face of the case body, fluorescent material being mixed in the cover member for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material being mixed in the cover member for adjusting the luminance of the light. [0016]
  • In an aspect of the invention, the white light emitting device further comprises a cover member holding portion formed in the recess of the case body, the cover member being mounted on the cover member holding portion. [0017]
  • The recess is formed into a cup shape having an inclination surface open to a light emitting direction, the cover member has an inclined peripheral wall so as to be engaged with the inclination surface. [0018]
  • In another aspect of the invention, the white light emitting device further comprises a shoulder formed in the recess of the case body for holding the cover member. [0019]
  • The blue light emitting element is mounted on the bottom of the recess by face down bonding. [0020]
  • The blue light emitting element is mounted on a substrate by face down bonding to form a light emitting unit, and the substrate is mounted on the bottom of the recess. [0021]
  • The blue light emitting element is an LED of InGaN group. [0022]
  • The fluorescent material is a fluorescent material of YAG group. [0023]
  • The luminance reducing material is a pigment of black. [0024]
  • The present invention also provides a white light emitting device comprising, a case body having a recess forming a reflection face, a blue light emitting element mounted on a bottom of the recess, a cover member including fluorescent material and covering a light emitting face of the case body, the case body comprising a pair of metal cores which are opposed to each other interposing an insulation member, the surface of each of the metal cores being coated with a metal plating having high reflectance, fluorescent material for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material for adjusting the luminance of the light being mixed in the cover member. [0025]
  • The metal case is made of a magnesium alloy, the surface of the metal core is coated with silver plating. [0026]
  • The cover member has arms, the arms are engaged with grooves formed in the case body. [0027]
  • A projection is formed on the arm of the cover member, the projection is engaged with an engaging hole formed in the groove of the case body. [0028]
  • The cover member is provided by separating from a cover member assembly comprising a plurality of cover members which are connected by arms. [0029]
  • These and other objects and features of the present invention will become more apparent from the following detailed description with reference to the accompanying drawings.[0030]
  • BRIEF DESCRIPTION OF DRAWINGS
  • FIG. 1 is a perspective view of a white light emitting device according to a first embodiment of the present invention; [0031]
  • FIG. 2 is a perspective view of the white light emitting device in which a cover member in FIG. 1 is removed; [0032]
  • FIG. 3 is a sectional view of the white light emitting device taken along a line III-III of FIG. 1; [0033]
  • FIG. 4 is a perspective view of a light emitting unit; [0034]
  • FIG. 5 is a sectional view showing a white light emitting device according to a second embodiment of the present invention; [0035]
  • FIG. 6 is a perspective view showing a white light emitting device according to a third embodiment of the present invention; [0036]
  • FIG. 7 is a perspective view of the white light emitting device as viewed from a reverse side thereof; [0037]
  • FIG. 8 is a sectional view taken along a line VIII-VIII of FIG. 6; [0038]
  • FIG. 9 is a flowchart showing the steps for manufacturing the third embodiment; [0039]
  • FIGS. 10, 11, [0040] 12, 13 a and 13 b are perspective views for explaining a method for manufacturing a light emitting element unit assembly;
  • FIG. 14 is a perspective view of a metal core assembly; [0041]
  • FIGS. 15, 16, [0042] 17 and 18 are perspective views for explaining a method for manufacturing a light emitting device;
  • FIG. 19 is a perspective view showing a method for combining a light emitting element unit and a cover member; [0043]
  • FIG. 20 is a plan view showing a white light emitting device according to a fourth embodiment of the present invention; [0044]
  • FIG. 21 is a sectional view of the device taken along a line A-A of FIG. 20; [0045]
  • FIGS. 22[0046] a to 22 c are perspective views for explaining a method of manufacturing a white light emitting device of a fourth embodiment;
  • FIG. 23 is a plan view of a white light emitting device according to a fifth embodiment of the present invention; [0047]
  • FIG. 24 is a sectional view of the device taken along a line B-B of FIG. 23; [0048]
  • FIG. 25 is a sectional view of a conventional LED device disclosed in U.S. Pat. No. 6,069,440; and [0049]
  • FIGS. 26 and 27 are graphs showing dispersion in chromaticity and luminance of LED devices.[0050]
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
  • FIG. 1 is a perspective view of a white light emitting device according to a first embodiment of the present invention, FIG. 2 is a perspective view of the white light emitting device in which a cover member in FIG. 1 is removed, FIG. 3 is a sectional view of the white light emitting device taken along a line III-III of FIG. 1, and FIG. 4 is a perspective view of a light emitting element unit. [0051]
  • Referring to FIGS. [0052] 1 to 3, a white light emitting LED device 10 comprises a cubic case 1 made of moldable metal having a high heat conductivity such as Mg group and formed by injection molding, and having a recess 1 c of an inverted truncated cone and having an inclined inside wall 1 k. The case 1 c comprises a pair of first and second half metal cores 3 a and 3 b, interposing an insulation layer 2 which is made of resin and charged in a slit 1 g. The inside wall of the recess 1 c and an upper surface 1 a of the case 1 c are processed into a light reflection surface by silver plating.
  • Referring to FIG. 4, a light emitting [0053] element unit 5 comprises a blue LED 6 of InGaN group, a substrate 7 made of ceramics and having upper electrodes 7 a and 7 b and lower electrodes 7 c and 7 d. The upper and lower electrodes 7 a and 7 c, and the upper and lower electrodes 7 b and 7 d are electrically connected with each other by a pair of through-holes 7 e, thereby forming a pair of wiring patterns. A pair of bumps 6 a (FIG. 3) are secured to a pair of electrodes (not shown) on the underside of the LED 6. The blue LED 6 as a light emitting element is mounted on the upper electrodes 7 a, 7 b through bumps 6 a by face down bonding. The underside of the LED 6 is encapsulated by a resin 8 to protect the bumps 6 a. Further, the LED 6 is encapsulated by a resin 9. The light emitting element unit 5 is mounted on the bottom of the recess 1 c by soldering the lower electrodes 7 c, 7 d to the metal cores 3 a, 3 b.
  • A [0054] cover member 11 made of transparent resin such as elastomer of silicon group has an outside shape so as to engage with the inclined wall 1 k of the recess 1 c. If required, the cover member 11 is secured to the recess 1 c by caulking or an adhesive. In the cover member 11,YAG phosphor particles 12 and a luminance reducing material particles 13 such as pigment and dye particles 7 f are mixed. The phosphor particle 12 and the pigment particle 13 are selected so that the chromaticity and luminance of the light emitted from the LED 6 are corrected to desired values.
  • As the phosphor particle is selected from fluorescent materials of YAG group where the ratio of Ga to Gd is variously changed. [0055]
  • As the luminance reducing material, pigments of black group in which graphite and carbon or red, green and blue pigments are mixed are used. [0056]
  • In operation, when the current is applied to the [0057] metal cores 3 a and 3 b, the current is applied to the blue LED 6 via the electrodes 7 a, 7 b, 7 c, 7 d and bumps 6 a. Thus the LED 6 is excited to emit blue light. When a part of the blue light impinges upon the phosphor particle 12, the blue light is absorbed in the phosphor particle 12 and the particle emits yellow light. When the yellow light and the blue light which does not impinge upon the phosphor particle are mixed, white light produces. Further, the chromaticity and luminance of the white light are corrected to desired chromaticity and luminance by the phosphor particles 12 and pigment particles 13.
  • Since the [0058] case 1 is made of a metal having a high heat conductivity, the case is superior in heat radiation. Therefore, the LED device can effectively be used for a light emitting device in which the case temperature rises highly because of a large current.
  • There is provided the [0059] cover member 11 in which the phosphor particles 12 and the luminance reducing particles 13 are mixed. A white light emitting device 1 satisfies both of the chromaticity and luminance in a desired range, thereby reducing the variation in characteristics. Since the luminance reducing member is used, initial luminance can be set to a large value, so that the luminance is adjusted by reducing the luminance. Therefore, luminance can be adjusted in a wide range.
  • Since the [0060] cover member 11 is made of the elastomer of silicon group, the phosphor particles 12 and the luminance reducing particles 13 are uniformly distributed in the cover member without depositing and biasing. Therefore, the LED device emits light uniform in chromaticity and luminance.
  • FIG. 5 is a sectional view showing a white light emitting device according to a second embodiment of the present invention. The white [0061] light emitting device 20 has the case 1 same as that of the first embodiment. A cover plate 14 made of glass or transparent solid plastic such as acrylic resin and silicon is secured to the upper surface 1 a to press the cover member 11 against the inside wall of the recess 1 c. Other parts are identified by the same reference numerals as FIG. 3.
  • Since the [0062] cover member 11 is held by the cover plate 14, it is not necessary to adhere the cover member 11 to the wall of the recess 1 k.
  • FIG. 6 is a perspective view showing a white light emitting device according to a third embodiment of the present invention. FIG. 7 is a perspective view of the white light emitting device as viewed from a reverse side thereof, FIG. 8 is a sectional view taken along a line VIII-VIII of FIG. 6. [0063]
  • Referring to FIGS. 6 and 7, the white [0064] light emitting device 30 comprises a case 21 having a cubic shape. The case 21 comprises a pair of metal cores 23 a and 23 b made of metal having a high heat conductivity, and a combining resin 24 of heat resistivity. The combining resin 24 is mounted on a step 21 f of the case 21 to form an upper shape of the case, charged in a slit 21 g between the metal cores 23 a and 23 b, and in grooves 23 c and 23 d formed in the side wall and the underside of the metal cores 23 a and 23 b, thereby combining the metal cores.
  • The undersides of the [0065] metal cores 23 a and 23 b form a pair of electrodes 25 and 26. A recess 21 c is formed in the metal cores 23 a and 23 b. The inside wall of the recess 21 c and the surfaces of the metal cores 23 a and 23 b are processed into light reflection surfaces by silver plating. A shoulder 21 e is formed in an upper portion of the recess 21 c, and a cover member 32 is mounted on the shoulder. Other parts are the same as the first embodiment and identified by the same reference numerals as the first embodiment.
  • FIG. 9 is a flowchart showing the steps for manufacturing the third embodiment, and FIGS. [0066] 10 ˜18 are perspective views showing the steps, whereby a plurality of light emitting element devices are manufactured at the same time.
  • At a step S[0067] 1, a substrate assembly for a light emitting element unit is manufactured.
  • FIG. 10 is a perspective view of a [0068] substrate assembly 107.
  • The [0069] substrate assembly 107 is divided into nine areas 24 for nine LED devices by dicing lines 26 and 27. On the upper surface and the underside of a substrate material, four sets of electrodes 107 b are secured.
  • In each area, a pair of through-[0070] holes 107 c are formed to electrically connect the upper and lower electrodes 107 b.
  • At a step S[0071] 2, the blue LED 6 is mounted on the upper electrodes 107 b through bumps (not shown) as shown in FIG. 11. Further, at a step S3, the underside of the LED 6 is encapsulated by the resin 8 and encapsulating resin 9 to form a light emitting element unit assembly 105 as shown in FIG. 12.
  • Next, at a step S[0072] 4, the light emitting element unit assembly 105 is cut off along the dicing lines 26 and 27 to produce the light emitting element unit 5 from the assembly 105 as shown in FIG. 13b.
  • The chromaticity and luminance of each of the produced lighting element units are measured. The measured units are classified into ranks dependent on the result of the measurement. [0073]
  • Next, at a step S[0074] 5, a metal core assembly is manufactured. As shown in FIG. 14, a metal core assembly 123 is formed by injection molding and divided into nine areas 30 for nine units 5 by dicing lines 31 and 32. A cylindrical portion 123 b having recess 21 c is formed in each area 30 at a central portion. Three slits 123 g are formed in parallel to the lines 32 except a peripheral frame 123 a.
  • Further, three [0075] grooves 123 c are formed.
  • At a step S[0076] 6, a resin is charged in a recess within the peripheral frame 123 a, slits 123 g and grooves 123 c to form a resin layer 104 as shown in FIG. 15. Thus, a case assembly 121 is produced.
  • Next, at a step S[0077] 7, light emitting element units 5 belonging to the same class are mounted on bottoms 21 d of recesses 21 c as shown in FIG. 16.
  • At a step S[0078] 8, cover members 32 belonging to the same rank are secured to the inside wall of the recesses 21 c, respectively, to form a light emitting element device assembly 130 as shown in FIG. 17.
  • At a step S[0079] 9, the assembly 130 is cut off along the dicing lines 31 and 32 to separate the independent light emitting device 30 as shown in FIG. 18.
  • Finally, at a step S[0080] 10, the test of the product is carried out.
  • FIG. 19 is a perspective view showing a method for combining a blue light emitting element unit and a cover member. [0081]
  • A method for combining the blue [0082] light emitting element 6 and the cover member 32 is described hereinafter with reference to FIG. 19.
  • The [0083] blue LED 6 in the unit 5 is measured about the chromaticity and the luminance by an LED tester, and measured LEDs are classified into classes, for example classes a, b, c, in accordance with the measured characteristics.
  • On the other hand, the [0084] cover members 32 are also classified into classes A, B and C so that the combinations a and A, b and B, c and C perform to emit desirable white lights. The combined sets are mounted in the case 21. Thus, white light emitting devices 30 are produced.
  • In accordance with the third embodiment, since the [0085] shoulder 21 e is formed in the recess 21 c, the cover member 32 can easily be set in the recess. On the inside wall of the recess 21 c, the vertical wall 21 m is formed, and the side wall 32 a of the cover member 32 is accordingly vertical. Therefore, when the cover member is set in the recess 21 c, it is not necessary to judge the distinction of both sides of the cover member.
  • FIG. 20 is a plan view showing a white light emitting device according to a fourth embodiment of the present invention, FIG. 21 is a sectional view of the device taken along a line A-A of FIG. 21. The white [0086] light emitting device 40 comprises a case 31 comprising a pair of metal cores 33 a and 33 b and a slit 33 c between the metal cores 33 a and 33 b. The device 40 is characterized in that four grooves 31 a are formed in the upper surfaces of the metal cores 33 a, 33 b radially extending from the recess 21 c. On the other hand, four arms 42 a are radially extending from a cover member 42, corresponding to the grooves 31 a. The arms 42 a are engaged in the grooves 31 a and secured thereto.
  • Since the method for manufacturing the white light emitting device of the fourth embodiment is substantially same as that of the third embodiment, only different method is described hereinafter. [0087]
  • FIGS. 22[0088] a ˜ 22 c are perspective views showing steps for manufacturing a light emitting device assembly. Referring to FIG. 22a, nine cover members 42 are assembled by connecting arms 42 a of each cover member 42, thereby forming a cover member assembly 142.
  • On the other hand, in a [0089] case assembly 131 as shown in FIG. 22b, nine recesses 21 c, grooves 131 a and slits 133 c are formed. The light emitting element unit 5 is mounted in each recess 21 c.
  • As shown in FIG. 22[0090] c, the cover member assembly 142 is mounted on the case assembly 131. Thus a light emitting device assembly 140 is formed.
  • In accordance with the fourth embodiment, a plurality of [0091] cover members 42 having the same characteristics are assembled. Therefore, light emitting devices of same characteristics can be produced. Further, constructing steps are reduced.
  • FIG. 23 is a plan view of a white light emitting device according to a fifth embodiment of the present invention, FIG. 24 is a sectional view of the device taken along a line B-B of FIG. 23. The white [0092] light emitting device 50 comprises a case 41 comprising a pair of metal cores 43 a and 43 b and a slit 43 c between the metal cores 43 a and 43 b. In the white light emitting device 50, four grooves 41 a are formed in the upper surfaces of the metal cores 43 a, 43 b, radially extending from the recess 21 c. In one of the grooves 41 a, an engaging hole 41 j is formed in the bottom of the groove. On the other hand, four arms 51 a are radially extending from a cover member 51 and a projection 51 c is formed on the underside of the arm 51 a corresponding to the hole 41 j of the groove 41 a. The arms 51 a are engaged in the grooves 41 a and the projection 51 c is engaged with hole 41 j and secured thereto.
  • In accordance with the fifth embodiment, the [0093] cover member 51 is strongly fixed to the case 41 by the engagement of the projection 51 c with the hole 41 j.
  • In accordance with the present invention, there is provided the cover member in which the phosphor particles and the luminance reducing particles are mixed. Therefore the white light emitting device produces white light which satisfies both of the chromaticity and luminance in a desired range by selecting the amount of the phosphor and luminance reducing particles, thereby reducing the dispersion in characteristics. [0094]
  • Since the luminance reducing member is used, initial luminance can be set to a large value, so that the luminance is adjusted by reducing the luminance. Therefore, luminance can be adjusted in a wide range. [0095]
  • Since the cover member is made of the elastomer of silicon group, the phosphor particles and the luminance reducing particles are uniformly distributed in the cover member without depositing and biasing. Therefore, the LED device emits light uniform in chromaticity and luminance. [0096]
  • While the invention has been described in conjunction with preferred specific embodiment thereof, it will be understood that this description is intended to illustrate and not limit the scope of the invention, which is defined by the following claims. [0097]

Claims (17)

What is claimed is:
1. A white light emitting device comprising:
a blue light emitting element;
a cover member for covering the blue light emitting element;
fluorescent material for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light being mixed in the cover member, and luminance reducing material for adjusting the luminance of the light being mixed in the cover member.
2. The white light emitting device according to claim 1 wherein the luminance reducing material is pigment or dye for reducing the luminance irrespective of the wavelength of the light emitting from the light emitting element.
3. The white light emitting device according to claim 1 wherein the cover member is formed from elastomer of silicon group in which the fluorescent material and the luminance reducing material are mixed.
4. A white light emitting device comprising:
a case body having a recess forming a reflection face;
a blue light emitting element mounted on a bottom of the recess;
a cover member including fluorescent material and covering a light emitting face of the case body;
fluorescent material for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light, and luminance reducing material for adjusting the luminance of the light being mixed in the cover member.
5. The white light emitting device according to claim 4 further comprising a cover member holding portion formed in the recess of the case body, the cover member being mounted on the cover member holding portion.
6. The white light emitting device according to claim 4 wherein the recess is formed into a cup shape having an inclination surface open to a light emitting direction, the cover member has an inclined peripheral wall so as to be engaged with the inclination surface of the recess.
7. The white light emitting device according to claim 5 further comprising a shoulder formed in the recess of the case body for holding the cover member.
8. The white light emitting device according to claim 4 wherein the blue light emitting element is mounted on the bottom of the recess by face down bonding.
9. The white light emitting device according to claim 4 wherein the blue light emitting element is mounted on a substrate by face down bonding to form a light emitting unit, and the substrate is mounted on the bottom of the recess.
10. The white light emitting device according to claim 1 wherein the blue light emitting element is an LED of InGaN group.
11. The white light emitting device according to claim 1 wherein the fluorescent material is a fluorescent material of YAG group.
12. The white light emitting device according to claim 1 wherein the luminance reducing material is a pigment of black.
13. A white light emitting device comprising:
a case body having a recess forming a reflection face, a blue light emitting element mounted on a bottom of the recess,
a cover member including fluorescent material and covering a light emitting face of the case body,
the case body comprising a pair of metal cores which are opposed to each other interposing an insulation member, the surface of each of the metal cores being coated with a metal plating having high reflectance,
fluorescent material for converting wavelength of light emitted from the blue light emitting element to adjust chromaticity of the light being mixed in the cover member, and luminance reducing material for adjusting the luminance of the light being mixed in the cover member.
14. The white light emitting device according to claim 13 wherein the metal core is made of a magnesium alloy, the surface of the metal core is coated with silver plating.
15. The white light emitting device according to claim 4 wherein the cover member has arms, the arms are engaged with grooves formed in the case body.
16. The white light emitting device according to claim 15 wherein a projection is formed on the arm of the cover member, the projection is engaged with an engaging hole formed in the groove of the case body.
17. The white light emitting device according to claim 15 wherein the cover member is provided by separating from a cover member assembly comprising a plurality of cover members which are connected by arms.
US10/679,490 2002-10-07 2003-10-07 White light emitting device having corrected distributions of chromaticity and luminance Active 2024-05-11 US7180240B2 (en)

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Cited By (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
US7012277B2 (en) 2003-01-06 2006-03-14 Sharp Kabushiki Kaisha Semiconductor light emitting device
US20060057753A1 (en) * 2004-09-11 2006-03-16 Schardt Craig R Methods for producing phosphor based light sources
US20060102918A1 (en) * 2004-11-16 2006-05-18 Wen-Lung Su Package Structure of a Surface Mount Device Light Emitting Diode
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US20070004065A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Phosphor tape article
US20070001182A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Structured phosphor tape article
EP1744376A2 (en) * 2005-07-13 2007-01-17 Shinko Electric Industries Co., Ltd. Semiconductor device and manufacturing method thereof
US20070019409A1 (en) * 2005-07-25 2007-01-25 Toyoda Gosei Co., Ltd. Light source device with equalized colors split, and method of making same
US20070194712A1 (en) * 2006-02-02 2007-08-23 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US20070235863A1 (en) * 2006-03-31 2007-10-11 Dicon Fiberoptics, Inc. LED chip array module
EP1848044A2 (en) * 2006-04-19 2007-10-24 Shinko Electric Industries Co., Ltd. Semiconductor device and seconductor device fabrication method
US20080080194A1 (en) * 2006-07-21 2008-04-03 Wen-Lung Su Frame structure for supporting a surface mount device light emitting diode used as a side light source
US20080123339A1 (en) * 2006-08-09 2008-05-29 Philips Lumileds Lighting Company Llc Illumination Device Including Wavelength Converting Element Side Holding Heat Sink
US20090146158A1 (en) * 2004-12-17 2009-06-11 Jun Seok Park Package for Light Emitting Device and Method for Packaging the Same
US20090212257A1 (en) * 2006-03-15 2009-08-27 Choong-Yong Sohn Photoluminescent Sheet
US20100133558A1 (en) * 2004-11-05 2010-06-03 Neobulb Technologies, Inc. Flip chip type led lighting device manufacturing method
EP2196724A2 (en) 2008-12-12 2010-06-16 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
US20100219435A1 (en) * 2009-03-02 2010-09-02 Kyung Jun Kim Light emitting device
US20100264438A1 (en) * 2009-04-20 2010-10-21 Nichia Corporation Light emitting device
KR200451231Y1 (en) 2007-09-27 2010-12-03 지잉 퉁 텍. 메탈 코., 엘티디. Thermal module
US20100320485A1 (en) * 2007-01-12 2010-12-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged led light source
CN102569600A (en) * 2011-11-11 2012-07-11 深圳市瑞丰光电子股份有限公司 LED (light emitting diode) packaging structure and reflection cup thereof
US20130027623A1 (en) * 2010-03-12 2013-01-31 Sharp Kabushiki Kaisha Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
US20130026911A1 (en) * 2011-07-31 2013-01-31 Walsin Lihwa Corporation Light emitting diode device
TWI425601B (en) * 2008-09-03 2014-02-01 Osram Opto Semiconductors Gmbh Optoelectronic device
US20150194578A1 (en) * 2011-09-21 2015-07-09 Citizen Electronics Co., Ltd. Light-emitting device, lighting device including the light-emitting device, and method of manufacturing the light-emitting device
US20160111606A1 (en) * 2012-03-05 2016-04-21 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
US20160240755A1 (en) * 2013-09-13 2016-08-18 Koninklijke Philips N.V. Frame based package for flip-chip led
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4788109B2 (en) * 2003-10-28 2011-10-05 パナソニック電工株式会社 Semiconductor light emitting device and manufacturing method thereof
WO2005073621A1 (en) * 2004-01-29 2005-08-11 Matsushita Electric Industrial Co., Ltd. Led illumination light source
TWI241034B (en) 2004-05-20 2005-10-01 Lighthouse Technology Co Ltd Light emitting diode package
JP4485856B2 (en) * 2004-06-10 2010-06-23 スタンレー電気株式会社 LED lamp for high power
WO2006005062A2 (en) * 2004-06-30 2006-01-12 Cree, Inc. Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
JP2006049442A (en) 2004-08-02 2006-02-16 Sharp Corp Semiconductor light emission device and its manufacturing method
KR100867515B1 (en) * 2004-12-06 2008-11-07 삼성전기주식회사 Light emitting device package
JP4591071B2 (en) * 2004-12-20 2010-12-01 日亜化学工業株式会社 Semiconductor device
TWI422044B (en) 2005-06-30 2014-01-01 Cree Inc Chip-scale methods for packaging light emitting devices and chip-scale packaged light emitting devices
KR101161383B1 (en) 2005-07-04 2012-07-02 서울반도체 주식회사 Light emitting diode and method for producing the same
US20070007542A1 (en) * 2005-07-07 2007-01-11 Sumitomo Electric Industries,Ltd. White-Light Emitting Device
KR100807015B1 (en) * 2005-08-16 2008-02-25 가부시끼가이샤 도시바 Light emitting device
JP2007073575A (en) * 2005-09-05 2007-03-22 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
DE102006004397A1 (en) 2005-09-30 2007-04-05 Osram Opto Semiconductors Gmbh Optoelectronic component, e.g. light emitting diode, has housing with housing material that is permeable for useful radiation and has radiation absorbing particles to adjust predetermined radiation or luminous intensity of radiation
GB2432967A (en) * 2005-11-30 2007-06-06 Unity Opto Technology Co Ltd White light LED with fluorescent powder containing wavelength converting plate
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2007194525A (en) * 2006-01-23 2007-08-02 Matsushita Electric Ind Co Ltd Semiconductor light emitting device
JP4749870B2 (en) * 2006-01-24 2011-08-17 新光電気工業株式会社 Method for manufacturing light emitting device
JP5956937B2 (en) * 2006-02-03 2016-07-27 日立化成株式会社 Method for manufacturing package substrate for mounting optical semiconductor element
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US7889421B2 (en) * 2006-11-17 2011-02-15 Rensselaer Polytechnic Institute High-power white LEDs and manufacturing method thereof
DE102007015474A1 (en) 2007-03-30 2008-10-02 Osram Opto Semiconductors Gmbh Electromagnetic radiation-emitting optoelectronic component and method for producing an optoelectronic component
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WO2015004577A1 (en) 2013-07-08 2015-01-15 Koninklijke Philips N.V. Wavelength converted semiconductor light emitting device
JP2015164234A (en) * 2015-06-17 2015-09-10 シチズン電子株式会社 LED light-emitting device and manufacturing method thereof
JP6632834B2 (en) 2015-08-24 2020-01-22 スタンレー電気株式会社 Light emitting device
JP6928424B2 (en) * 2016-02-24 2021-09-01 日亜化学工業株式会社 Fluorescent material and light emitting device
KR101902371B1 (en) 2017-03-02 2018-09-28 주식회사 이츠웰 Wavelength Selectable LED Package and LED Package Array with thereof
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JP2019046989A (en) 2017-09-04 2019-03-22 スタンレー電気株式会社 Semiconductor light emitting device and method of manufacturing the same
JP6675032B1 (en) * 2019-07-08 2020-04-01 御田 護 Semiconductor light emitting device

Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6184544B1 (en) * 1998-01-29 2001-02-06 Rohm Co., Ltd. Semiconductor light emitting device with light reflective current diffusion layer
US6319425B1 (en) * 1997-07-07 2001-11-20 Asahi Rubber Inc. Transparent coating member for light-emitting diodes and a fluorescent color light source
US20020139990A1 (en) * 2001-03-28 2002-10-03 Yoshinobu Suehiro Light emitting diode and manufacturing method thereof
US20030102481A1 (en) * 2001-11-26 2003-06-05 Citizen Electronics Co., Ltd. Light emitting diode device
US6576931B2 (en) * 2000-07-31 2003-06-10 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
US6576930B2 (en) * 1996-06-26 2003-06-10 Osram Opto Semiconductors Gmbh Light-radiating semiconductor component with a luminescence conversion element
US20030141563A1 (en) * 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
US6657382B2 (en) * 2000-07-21 2003-12-02 Nichia Corporation Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
US6828590B2 (en) * 2003-05-07 2004-12-07 Bear Hsiung Light emitting diode module device
US6841933B2 (en) * 2001-06-15 2005-01-11 Toyoda Gosei Co., Ltd. Light-emitting device
US6858880B2 (en) * 2001-11-22 2005-02-22 Citizen Electronics Co., Ltd. Light emitting diode device
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
US6936857B2 (en) * 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
US7019335B2 (en) * 2001-04-17 2006-03-28 Nichia Corporation Light-emitting apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3109472B2 (en) 1997-09-26 2000-11-13 松下電器産業株式会社 Light emitting diode
KR100345283B1 (en) 1998-05-15 2002-10-25 테스텍 주식회사 Contact led, manufacturing method thereof and contact input device using the same
US6504301B1 (en) * 1999-09-03 2003-01-07 Lumileds Lighting, U.S., Llc Non-incandescent lightbulb package using light emitting diodes
JP2002043625A (en) 2000-07-19 2002-02-08 Koha Co Ltd Led
EP1187226B1 (en) * 2000-09-01 2012-12-26 Citizen Electronics Co., Ltd. Surface-mount type light emitting diode and method of manufacturing same
JP3900848B2 (en) 2001-03-23 2007-04-04 シチズン電子株式会社 Light emitting diode
JP2003163378A (en) * 2001-11-26 2003-06-06 Citizen Electronics Co Ltd Surface mount light emitting diode and its manufacturing method

Patent Citations (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6576930B2 (en) * 1996-06-26 2003-06-10 Osram Opto Semiconductors Gmbh Light-radiating semiconductor component with a luminescence conversion element
US6319425B1 (en) * 1997-07-07 2001-11-20 Asahi Rubber Inc. Transparent coating member for light-emitting diodes and a fluorescent color light source
US6184544B1 (en) * 1998-01-29 2001-02-06 Rohm Co., Ltd. Semiconductor light emitting device with light reflective current diffusion layer
US5959316A (en) * 1998-09-01 1999-09-28 Hewlett-Packard Company Multiple encapsulation of phosphor-LED devices
US6657382B2 (en) * 2000-07-21 2003-12-02 Nichia Corporation Light emitting device, display apparatus with an array of light emitting devices, and display apparatus method of manufacture
US6576931B2 (en) * 2000-07-31 2003-06-10 Kabushiki Kaisha Toshiba Semiconductor light emitting device and method for manufacturing same
US20020139990A1 (en) * 2001-03-28 2002-10-03 Yoshinobu Suehiro Light emitting diode and manufacturing method thereof
US7019335B2 (en) * 2001-04-17 2006-03-28 Nichia Corporation Light-emitting apparatus
US6841933B2 (en) * 2001-06-15 2005-01-11 Toyoda Gosei Co., Ltd. Light-emitting device
US6858880B2 (en) * 2001-11-22 2005-02-22 Citizen Electronics Co., Ltd. Light emitting diode device
US20030102481A1 (en) * 2001-11-26 2003-06-05 Citizen Electronics Co., Ltd. Light emitting diode device
US20030141563A1 (en) * 2002-01-28 2003-07-31 Bily Wang Light emitting diode package with fluorescent cover
US6917057B2 (en) * 2002-12-31 2005-07-12 Gelcore Llc Layered phosphor coatings for LED devices
US6936857B2 (en) * 2003-02-18 2005-08-30 Gelcore, Llc White light LED device
US6828590B2 (en) * 2003-05-07 2004-12-07 Bear Hsiung Light emitting diode module device

Cited By (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7012277B2 (en) 2003-01-06 2006-03-14 Sharp Kabushiki Kaisha Semiconductor light emitting device
US20060006791A1 (en) * 2004-07-06 2006-01-12 Chia Chee W Light emitting diode display that does not require epoxy encapsulation of the light emitting diode
US7256057B2 (en) 2004-09-11 2007-08-14 3M Innovative Properties Company Methods for producing phosphor based light sources
US20060057753A1 (en) * 2004-09-11 2006-03-16 Schardt Craig R Methods for producing phosphor based light sources
US7795626B2 (en) 2004-11-05 2010-09-14 Neobulb Technologies, Inc. Flip chip type LED lighting device manufacturing method
US20100133558A1 (en) * 2004-11-05 2010-06-03 Neobulb Technologies, Inc. Flip chip type led lighting device manufacturing method
US8120052B2 (en) 2004-11-05 2012-02-21 Neobulb Technologies, Inc. Flip chip type LED lighting device manufacturing method
US20060102918A1 (en) * 2004-11-16 2006-05-18 Wen-Lung Su Package Structure of a Surface Mount Device Light Emitting Diode
US8035121B2 (en) 2004-12-17 2011-10-11 Lg Innotek Co., Ltd. Package for light emitting device having a lens spaced from a light emitting device module
US8076691B2 (en) 2004-12-17 2011-12-13 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US8357947B2 (en) 2004-12-17 2013-01-22 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US8415696B2 (en) 2004-12-17 2013-04-09 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US10677417B2 (en) 2004-12-17 2020-06-09 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US20100220474A1 (en) * 2004-12-17 2010-09-02 Jun Seok Park Package for light emitting device and method for packaging the same
US20100220473A1 (en) * 2004-12-17 2010-09-02 Jun Seok Park Package for light emitting device and method for packaging the same
US9671099B2 (en) 2004-12-17 2017-06-06 Lg Innotek Co., Ltd. Package for light emitting device and method for packaging the same
US20090146158A1 (en) * 2004-12-17 2009-06-11 Jun Seok Park Package for Light Emitting Device and Method for Packaging the Same
US20100220475A1 (en) * 2004-12-17 2010-09-02 Jun Seok Park Package for light emitting device and method for packaging the same
US20060157726A1 (en) * 2005-01-14 2006-07-20 Loh Ban P Semiconductor light emitting device mounting substrates including a conductive lead extending therein and methods of packaging same
US7777247B2 (en) * 2005-01-14 2010-08-17 Cree, Inc. Semiconductor light emitting device mounting substrates including a conductive lead extending therein
US7294861B2 (en) 2005-06-30 2007-11-13 3M Innovative Properties Company Phosphor tape article
US20070001182A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Structured phosphor tape article
US20070004065A1 (en) * 2005-06-30 2007-01-04 3M Innovative Properties Company Phosphor tape article
EP1744376A2 (en) * 2005-07-13 2007-01-17 Shinko Electric Industries Co., Ltd. Semiconductor device and manufacturing method thereof
EP1744376A3 (en) * 2005-07-13 2009-03-18 Shinko Electric Industries Co., Ltd. Semiconductor device and manufacturing method thereof
US20070015315A1 (en) * 2005-07-13 2007-01-18 Akinori Shiraishi Semiconductor device and manufacturing method thereof
US7556404B2 (en) * 2005-07-25 2009-07-07 Toyoda Gosei Co., Ltd. Light source device with equalized colors split, and method of making same
US20070019409A1 (en) * 2005-07-25 2007-01-25 Toyoda Gosei Co., Ltd. Light source device with equalized colors split, and method of making same
US7825423B2 (en) * 2006-02-02 2010-11-02 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US20070194712A1 (en) * 2006-02-02 2007-08-23 Shinko Electric Industries Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
US8723411B2 (en) 2006-03-15 2014-05-13 Lg Innotek Co., Ltd. Photoluminescent sheet
US8237352B2 (en) 2006-03-15 2012-08-07 Lg Innotek Co., Ltd. Photoluminescent sheet
US20090212257A1 (en) * 2006-03-15 2009-08-27 Choong-Yong Sohn Photoluminescent Sheet
US7683475B2 (en) * 2006-03-31 2010-03-23 Dicon Fiberoptics, Inc. LED chip array module
US20070235863A1 (en) * 2006-03-31 2007-10-11 Dicon Fiberoptics, Inc. LED chip array module
EP1848044A2 (en) * 2006-04-19 2007-10-24 Shinko Electric Industries Co., Ltd. Semiconductor device and seconductor device fabrication method
EP1848044A3 (en) * 2006-04-19 2012-12-19 Shinko Electric Industries Co., Ltd. Semiconductor device and seconductor device fabrication method
US7926984B2 (en) * 2006-07-21 2011-04-19 Lextar Electronics Corp. Light source having LED and frame structure
US20080080194A1 (en) * 2006-07-21 2008-04-03 Wen-Lung Su Frame structure for supporting a surface mount device light emitting diode used as a side light source
US7663152B2 (en) * 2006-08-09 2010-02-16 Philips Lumileds Lighting Company, Llc Illumination device including wavelength converting element side holding heat sink
TWI420054B (en) * 2006-08-09 2013-12-21 Philips Lumileds Lighting Co Illumination device with wavelength converting element side holding heat sink
US20080123339A1 (en) * 2006-08-09 2008-05-29 Philips Lumileds Lighting Company Llc Illumination Device Including Wavelength Converting Element Side Holding Heat Sink
US20100320485A1 (en) * 2007-01-12 2010-12-23 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged led light source
US8115385B2 (en) * 2007-01-12 2012-02-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. Multi-chip packaged LED light source
KR200451231Y1 (en) 2007-09-27 2010-12-03 지잉 퉁 텍. 메탈 코., 엘티디. Thermal module
US10115870B2 (en) 2008-09-03 2018-10-30 Nichia Corporation Light emitting device, resin package, resin-molded body, and methods for manufacturing light emitting device, resin package and resin-molded body
TWI425601B (en) * 2008-09-03 2014-02-01 Osram Opto Semiconductors Gmbh Optoelectronic device
EP2196724A2 (en) 2008-12-12 2010-06-16 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
EP2196724A3 (en) * 2008-12-12 2012-02-29 Toshiba Lighting & Technology Corporation Light-emitting module and illumination apparatus
US20100219435A1 (en) * 2009-03-02 2010-09-02 Kyung Jun Kim Light emitting device
US8860052B2 (en) 2009-03-02 2014-10-14 Lg Innotek Co., Ltd. Light emitting device
US8525218B2 (en) * 2009-04-20 2013-09-03 Nichia Corporation Light emitting device
US8330182B2 (en) * 2009-04-20 2012-12-11 Nichia Corporation Light emitting device
US20100264438A1 (en) * 2009-04-20 2010-10-21 Nichia Corporation Light emitting device
US20130056781A1 (en) * 2009-04-20 2013-03-07 Nichia Corporation Light emitting device
US20130313602A1 (en) * 2009-04-20 2013-11-28 Nichia Corporation Light emitting device
US8921882B2 (en) * 2009-04-20 2014-12-30 Nichia Corporation Light emitting device including light reflecting resin and translucent material
US9329433B2 (en) * 2010-03-12 2016-05-03 Sharp Kabushiki Kaisha Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
US20130027623A1 (en) * 2010-03-12 2013-01-31 Sharp Kabushiki Kaisha Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
US20130026911A1 (en) * 2011-07-31 2013-01-31 Walsin Lihwa Corporation Light emitting diode device
US8643273B2 (en) * 2011-07-31 2014-02-04 Walsin Lihwa Corporation Light emitting diode device having pillars disposed such that light efficiency of the device is improved
US9159887B2 (en) * 2011-09-21 2015-10-13 Citizen Electronics Co., Ltd. Light-emitting device, lighting device including the light-emitting device, and method of manufacturing the light-emitting device
US20150194578A1 (en) * 2011-09-21 2015-07-09 Citizen Electronics Co., Ltd. Light-emitting device, lighting device including the light-emitting device, and method of manufacturing the light-emitting device
CN102569600B (en) * 2011-11-11 2014-12-10 深圳市瑞丰光电子股份有限公司 LED (light emitting diode) packaging structure and reflection cup thereof
CN102569600A (en) * 2011-11-11 2012-07-11 深圳市瑞丰光电子股份有限公司 LED (light emitting diode) packaging structure and reflection cup thereof
US20160111606A1 (en) * 2012-03-05 2016-04-21 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
US9768362B2 (en) * 2012-03-05 2017-09-19 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
US10158050B2 (en) 2012-03-05 2018-12-18 Seoul Viosys Co., Ltd. Light-emitting device and method of manufacturing the same
US20160240755A1 (en) * 2013-09-13 2016-08-18 Koninklijke Philips N.V. Frame based package for flip-chip led
US9698323B2 (en) * 2013-09-13 2017-07-04 Koninklijke Philips N.V. Frame based package for flip-chip LED
US20170301841A1 (en) * 2013-09-13 2017-10-19 Lumileds Llc Frame based package for flip-chip led

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