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HEAT SINK AND ELECTROMAGNETIC
INTERFERENCE REDUCTION DEVICE
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to an electrical assembly having heat dissipation and electromagnetic interference reduction features.
2. Description of Related Art 10 Electrical devices, and central processing units in particular, draw high power and produce more heat than can be convected away from the dies of the device. If the die temperature exceeds acceptable levels, the device will either cease functioning, not operate at acceptable levels, and/or 15 function in an unreliable manner. In addition, many electrical devices emit electromagnetic interference (EMI) that can adversely affect nearby electronics or electronic communication. The Federal Communication Commission of the U.S. government and industry agencies, such as Telcordia and 20 United Laboratories, have established and verified EMI limits for such electrical devices.
To address this problem, heat dissipation devices are used to convect heat away from electrical devices. Many heat dissipation devices also incorporate EMI reduction features 25 to ensure that government EMI limitations are complied with.
Heat dissipation devices of the prior art have several deficiencies. For example, prior art heat dissipation devices that use a matrix of fins incorporate fins that have inefficient 30 dimensions and that are inefficiently spaced for heat conduction and heat convection purposes. Moreover, many heat dissipation devices incorporate an inefficient cross sectional fin shape, such as an undesirable rectangular shape, that only permits satisfactory heat dissipation when positioned in a 35 first orthogonal orientation. Thus, these heat dissipation devices cannot adequately dissipate heat when positioned in a second orthogonal orientation. This prevents such heat dissipation devices from being used in systems that require the heat dissipation devices to be positioned in a second 40 orthogonal orientation. Moreover, heat dissipation devices of the prior art incorporate heat interface material to allow for thermal communication between the heat dissipation device and the electrical device. The thermal interface material used, however, is expensive. 45
Heat dissipation devices of the prior art that incorporate EMI reduction features incorporate a compliant member between the EMI reduction feature and the object to which the EMI reduction feature is grounded, such as a circuit board. The compliant member provides better contact 50 between the EMI reduction feature and the circuit board, and thus provides adequate grounding, which is required for acceptable EMI reduction. The complaint member, however, adds extra costs.
Therefore, it would be desirable to provide an electrical 55 assembly that includes heat dissipation and EMI reduction features that is not susceptible to one or more of the shortcomings of prior art devices.
SUMMARY OF THE INVENTION 60
The present invention relates to an electrical assembly having heat dissipation and EMI reduction features. The electrical assembly includes a heat dissipation device, an electrical device that is capable of emitting heat and EMI, 65 and a circuit board. A first embodiment of the electrical assembly of the invention includes a first embodiment of a
heat dissipation device of the invention. The first embodiment of the heat dissipation device has a plurality of fins disposed in matrix orientation that are efficiently spaced from one another and has fins that have a cross sectional shape that is symmetric about two orthogonal axes. The efficient spacing improves heat convection, and the symmetrical cross sectional shape allows for efficient convection in two orthogonal directions. Further, the first embodiment includes a solder ring instead of a compliant member for grounding. The heat dissipation device includes an EMI fence that has connector receiving portions that are offset from a bottom surface of the fence to ensure contact between a bottom surface of the EMI fence and the solder ring. This improves grounding between the heat dissipation device and the circuit board.
The first embodiment of the heat dissipation device includes top and bottom surfaces. A continuous EMI fence depends from the bottom surface, and a plurality of fins disposed in a matrix orientation extend from the top surface. The EMI fence surrounds the electrical device and is grounded to the circuit board. The fins are spaced from one another to allow for efficient heat dissipation and have a substantially square cross-sectional shape. In another embodiment of the heat dissipation device, a body portion of the fins have a substantially uniform cross sectional area, and a base that has a greater cross sectional area than the body portion.
In another embodiment of the electrical assembly, the electrical device is disposed in thermal communication with the heat dissipation device by way of a thermal interface pad, instead of a phase change thermal interface material.
A more complete understanding of the electrical assembly and heat dissipation device of the invention will be afforded to those skilled in the art, as well as a realization of additional advantages and objects thereof, by a consideration of the following detailed description of the preferred embodiment. Reference will be made to the appended sheets of drawings, which will first be described briefly.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an exploded view of a first embodiment of an electrical assembly incorporating aspects of the invention;
FIG. 2 is an isometric top view of a first embodiment of a heat dissipation device incorporating aspects of the invention;
FIG. 3 is a bottom view of a first embodiment of the heat dissipation device of FIG. 2;
FIG. 4 is a cross sectional view of section 4—4 of the heat dissipation device of FIG. 3;
FIG. 4a is a detailed view of a portion of the heat dissipation device of FIG. 3;
FIG. 4b is a cross sectional view of section 4b—4b of the detailed view shown in FIG. 4a; and,
FIG. 5 is an isometric view of the electrical assembly of FIG. 1 shown assembled.
DETAILED DESCRIPTION OF THE
The present invention pertains to an electrical assembly 2 that includes a heat dissipation device 4, an electrical device 6 capable of emitting thermal energy and electromagnetic interference, and a circuit board 8. A first embodiment of the electrical assembly 2, shown in FIG. 1, incorporates a first embodiment of a heat dissipation device 4 of the invention. The first embodiment of the heat dissipation device incor3
porates both heat dissipation features, such as a plurality of fins 34 disposed in a matrix orientation 32, and EMI reduction features, such as an EMI fence 12 grounded to the circuit.
The circuit board 8 is generally one that is used in a 5 computing device or system (not shown), such as a personal computer or a work station. Specific examples of systems in which electrical assemblies 2 and heat dissipation devices 4 of the invention are used include the CT 410, CT 810, CT 400, and CT 800 systems, all manufactured by Sun Micro- 10 systems. The heat dissipation device 4 may also be used in conjunction with circuit boards used in other applications. The electrical device 6 is one that can emit heat and EMI. A typical electrical device 6 is a processing unit, such as a central processing unit of a personal computer. Other 15 examples of electrical devices include memory chips used within a personal computer, or several chips within a personal computer that are used in combination.
The processing unit 6 may heat up and emit EMI. The first embodiment of the heat dissipation device 4 both transfers 20 heat away from the electrical device 6 and reduces EMI emission from the electrical device. Other embodiments of the invention that are not shown include a heat dissipation device that includes heat dissipation features but not EMI reduction features. Yet other embodiments of the invention 25 that are not shown include EMI reduction devices, such as an EMI fence, but not heat dissipation features.
In the first embodiment of the heat dissipation device 4, and in other embodiments that do not include EMI reduction features, the heat dissipation device is in thermal commu- 30 nication with the electrical device 6 to allow the transfer of heat away from the electrical device. As shown in FIG. 1, in the first embodiment of the electrical assembly 2, the heat dissipation device 4 is in thermal communication with the electrical device 6 by way of a thermal interface pad 10. 35
Other heat dissipation devices disadvantageously use thermal interface material that must be heated in order to change the phase of the material to a liquid form. After heating, the liquid then solidifies to provide thermal communication between thermal dissipation devices of the prior 40 art and electrical devices. Although such material may provide efficient thermal communication, the process is expensive, and thermal interface pads that are less costly to use provide adequate thermal communication.
The thermal interface pad 10 of the first embodiment of 45 the electrical assembly 2 is preferably compressible and expandable. Thus, the thermal interface pad 10 compresses and expands when the heat dissipation device 6 is secured to and tightened to the circuit board 8, allowing the first embodiment of the heat dissipation device to be in thermal 50 communication with electrical devices of varying heights. One acceptable thermal interface pad 10 comprises T-Putty, series 502, which is commercially available from Thermagon, Inc. located at 4707 Detroit Ave, Cleveland, Ohio 44102. Acceptable dimensions for the thermal interface pad 55 10, for use with an electrical device that is about 46 mm square, are about 40 mm square and about 1.27 mm thick. Note that other thermal interface pads having different dimensions may also be used. Also note that other embodiments of the invention that include heat dissipation features 60 may be in thermal communication with the electrical device in several manners, including not only the thermal interface pad, but also by way of the inefficient thermal interface material.
As shown in FIGS. 3 and 4, the first embodiment of the 65 heat dissipation device 4, and other embodiments of the invention (not shown) that do not include heat dissipation
features, includes an EMI fence 12. In the first embodiment, the EMI fence 12 depends from a bottom surface 14 of the heat dissipation device 4. The EMI fence 12 is configured to surround the electrical device 6 and is grounded to the circuit board 8 to reduce EMI emission from the electrical device 6 to other devices. In one embodiment, the EMI fence 12 is about 4.5 mm to about 4.9 mm in height (shown at 15 of FIG. 4a) so that the heat dissipation device 4 can accommodate electrical devices of varying heights. In another embodiment, the EMI fence 12 is about 0.8 mm thick (shown at 16 of FIG. 3) to attenuate 95% of EMI at 950 MHz.
The other embodiments include a wire mesh (not shown) that covers the electrical device and that is secured to a top surface of the EMI fence. The other embodiments are often used with memory devices because memory devices often do not require as much heat dissipation but do require EMI reduction.
For efficient EMI reduction, the EMI fence 12 should be grounded to the circuit board 8. The bottom surface 19 of the EMI fence 12 and the surface that the EMI fence is grounded to, usually a circuit board 8, are not perfectly flat and have variations, such as small bumps or indentations along the surface. Thus, measures should be taken to ensure that the EMI fence is properly grounded to the circuit board, despite the variations.
Some EMI reduction devices that use an EMI fence ground the EMI fence to the circuit board by way of a compliant member (not shown). The compliant member properly grounds the EMI fence to the circuit board, and can be made from rubber and include conductive materials within it to ensure proper grounding. However, using a compliant member in an electrical assembly for grounding purposes adds costs.
In the first embodiment of the electrical assembly 2, a solder ring 18 that is substantially the shape of, and wider than the thickness 16 of, the EMI fence 12 is on the circuit board 8. The first embodiment of the heat dissipation device 4, and other embodiments of the invention that include EMI reduction features, is then placed on the circuit board 8 so that the solder ring 8 is in contact with the circuit board 8 and a bottom surface 19 of the EMI fence 12. Because of the variations discussed above and because the thickness of the solder ring 18 may vary by about 0.1 mm at locations, in an alternate embodiment, connector receiving portions 20 (described below) are desirably offset 22 from the bottom surface 14 of the EMI fence 12, as shown in FIG. 4a. The offset 22 can be from about 0.05 mm to about 0.15 mm so that the connector receiving portions 20 are higher than the circuit board 8. As a result, when the heat dissipation device 4 is first placed onto the solder ring 18, the bottom surface 19 of the EMI fence 12 contacts the solder ring first. This provides greater EMI fence 12 contact with the solder ring 18.
Without the offset 22, because of the variations in the EMI fence, circuit board, and the solder ring, the securing locations 24 (described below) may disadvantageously contact the solder ring first. The non-offset securing locations could then reduce, or in extreme cases, eliminate, contact between the EMI fence and the solder ring.
In another embodiment, a conductive paste (not shown) is added to the bottom surface 19 of the EMI fence 12 so that it also contacts the solder ring 18. The conductive paste can function with the solder ring 18 to provide for even more secure grounding of the EMI fence 12 to the circuit board 8.
As shown in FIG. 1, in the first embodiment, the heat dissipation device 4 is secured to the circuit board 8 by a