IIIH
US006911390B2
(12) United States Patent ao) Patent No.: us 6,911,390 B2
Brintzinger (45) Date of Patent: Jun. 28,2005
(54) FABRICATION METHOD FOR AN INTERCONNECT ON A SUBSTRATE
(75) Inventor: Axel Brintzinger, Dresden (DE)
(73) Assignee: Infineon Technologies AG, Munich (DE)
( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 251 days.
(21) Appl. No.: 10/292,621
(22) Filed: Nov. 13, 2002
(65) Prior Publication Data
US 2003/0092274 Al May 15, 2003 (30) Foreign Application Priority Data
Nov. 15, 2001 (DE) 101 56 054
(51) Int. CI.7 H01L 21/4763
(52) U.S. CI 438/637; 438/613; 438/638;
438/745
(58) Field of Search 438/613, 614,
438/616, 617, 624, 637, 638, 745, 751,
754; 216/100, 101, 108
