APPARATUS PROCESSING A GATE PORTION IN A SEMICONDUCTOR MANUFACTURING ...

(54) APPARATUS PROCESSING A GATE PORTION IN A SEMICONDUCTOR MANUFACTURING APPARATUS, WHICH REMOVE A GATE CORRESPONDENCE PORTION FROM A SEMICONDUCTOR PACKAGE CONNECTED TO A LEAD FRAME, AND A RESIN BURR DEPOSITED ON A LEAD PORTION ASSOCIATED WITH THE SEMICONDUCTOR PACKAGE

(75) Inventor: Takehiko Takahashi, Yamagata (JP)

(73) Assignee: NEC Corporation, Tokyo (JP)

( * ) Notice: Subject to any disclaimer, the term ol this patent is extended or adjusted under 35 U.S.C. 154(b) by 42 days.

(21) Appl. No.: 09/870,218

(22) Filed: May 30, 2001

(65) Prior Publication Data

US 2001/0049161 Al Dec. 6, 2001 (30) Foreign Application Priority Data

Jun. 2, 2000 (JP) 2000-166189

(51) Int. CI.7 B23K 26/38

(52) U.S. CI 219/121.67; 219/121.7

(58) Field of Search 438/940; 219/121.67,

219/121.68, 121.69, 121.7, 121.71, 121.72,

121.78, 121.8

(56) References Cited

U.S. PATENT DOCUMENTS

4,744,838 A * 5/1988 Lin et al 148/120

4,859,806 A * 8/1989 Smith 174/261

5,893,954 A * 4/1999 Nanataki et al 156/89.11

6,006,981 A * 12/1999 Madrid 228/180.5

6,355,505 Bl * 3/2002 Maeda et al 438/122

6,388,231 Bl * 5/2002 Andrews 219/121.69

FOREIGN PATENT DOCUMENTS

JP 07-201898 8/1995

JP 2000-021220 1/2000

* cited by examiner

Primary Examiner—-Tom Dunn

Assistant Examiner—-Jonathan Johnson

(74) Attorney, Agent, or Firm—Katten Muchin Zavis

Rose nm an

(57) ABSTRACT

An apparatus processing a gate portion in a semiconductor manulacturing apparatus includes a laser beam scanner unit and a cutter. The laser beam scanner unit is disposed along a carrying line on which a lead frame is carried. The laser beam scanner unit has an optical scanner unit seconddimensionally scanning laser beams, and a lens unit collecting the laser beams. The cutter has a punch. The punch mechanically pushes to cut a gate correspondence portion which is perfectly cut away or almost cut away from a semiconductor package body by the laser beams.

18 Claims, 6 Drawing Sheets