Singulation of individual electronic packages fabricated as part of a common matrix, is accomplished by mask patterning and chemical exposure in combination with physical sawing. In one embodiment of a singulation process in accordance with the present invention, an initial, shallow saw cut into inter-package...http://www.google.co.uk/patents/US7553700?utm_source=gb-gplus-sharePatent US7553700 - Chemical-enhanced package singulation process
