A linear image sensor chip is manufactured by forming an image pickup section, peripheral circuit sections, a plurality of bonding pads, and a light-suppressing layer on a semiconductor substrate having an elongated shape. In this case, each of the bonding pads is formed outer than photodiode groups...http://www.google.co.uk/patents/US7227575?utm_source=gb-gplus-sharePatent US7227575 - Linear image sensor chip and linear image sensor
