It is an object of the present invention to provide a peeling method that causes no damage to a layer to be peeled and to allow not only a layer to be peeled with a small surface area but also a layer to be peeled with a large surface area to be peeled entirely. Further, it is also an object of the present...http://www.google.co.uk/patents/US8012854?utm_source=gb-gplus-sharePatent US8012854 - Semiconductor device and manufacturing method thereof
