Bumps (112) are formed to electrodes of semiconductor elements (111), and moreover the semiconductor elements with the bumps are electrically connected to metallic members (114) having installation members (114b), whereby wiring lines are eliminated. A stray inductance and a conduction resistance resulting...http://www.google.co.uk/patents/US20030106924?utm_source=gb-gplus-sharePatent US20030106924 - Electronic circuit device and method for manufacturing the same
