A method of forming a copper interconnect, comprising forming an opening in a dielectric layer disposed on a substrate, forming a barrier layer over the opening, forming a seed layer over the metal layer, and forming a copper-noble metal alloy layer by electroplating and/or electroless deposition on...http://www.google.co.uk/patents/US20040108217?utm_source=gb-gplus-sharePatent US20040108217 - Methods for forming copper interconnect structures by co-plating of noble metals and structures formed thereby
