This invention relates to a method and a means for packaging integrated circuits, especially relates to a heat sink in the operating integrated circuit packages. The heat sink is bonded on the lead frame by a tap and take advantage of the length between the heat sink and the first mold packaged materials...http://www.google.co.uk/patents/US6545350?utm_source=gb-gplus-sharePatent US6545350 - Integrated circuit packages and the method for the same
