The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads...http://www.google.co.uk/patents/US20030127711?utm_source=gb-gplus-sharePatent US20030127711 - Lead frame, method for manufacturing the same, resin-encapsulated semiconductor device and method for manufacturing the same
