A QFN semiconductor package comprises a semiconductor die, a lead frame, bonding wires and a molding compound. The die has an upward topside with a plurality of bonding pads. The lead frame consists of a plurality of inner leads, wherein each inner lead is divided into the front finger portion, the middle...http://www.google.co.uk/patents/US6459148?utm_source=gb-gplus-sharePatent US6459148 - QFN semiconductor package
