A lead of a lead frame cannot be made close to a very small semiconductor chip in view of processing dimensions. If a TAB technique is used to directly connect the semiconductor chip and the lead in order to improve in reliability, a device for forming a bump on an electrode of the chip is required,...http://www.google.co.uk/patents/US5196992?utm_source=gb-gplus-sharePatent US5196992 - Resin sealing type semiconductor device in which a very small semiconductor chip is sealed in package with resin
