A semiconductor-wafer chuck for heating and cooling a device-under-test includes a heat-spreader plate with a clamping surface for a semiconductor wafer. A heater is disposed within the heat-spreader plate and provides for temperature elevations. A chiller heat-exchanger independent of the heat-spreader...http://www.google.co.uk/patents/US20030155939?utm_source=gb-gplus-sharePatent US20030155939 - Hot/cold chuck system
