A semiconductor chip assembly is mounted to contact pads in a compact area array. An interposer is disposed between the chip and the substrate. The contacts on the chip are connected to terminals on the interposer by flexible leads extending through apertures in the interposer. The terminals on the interposer...http://www.google.co.uk/patents/US5346861?utm_source=gb-gplus-sharePatent US5346861 - Semiconductor chip assemblies and methods of making same
