WO2015011027A2 - Strahlungsemittierende vorrichtung - Google Patents
Strahlungsemittierende vorrichtung Download PDFInfo
- Publication number
- WO2015011027A2 WO2015011027A2 PCT/EP2014/065440 EP2014065440W WO2015011027A2 WO 2015011027 A2 WO2015011027 A2 WO 2015011027A2 EP 2014065440 W EP2014065440 W EP 2014065440W WO 2015011027 A2 WO2015011027 A2 WO 2015011027A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- layer
- radiation
- scattering
- region
- emitting device
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 262
- 230000005855 radiation Effects 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 43
- 239000002346 layers by function Substances 0.000 claims abstract description 39
- 230000005670 electromagnetic radiation Effects 0.000 claims abstract description 9
- 239000002245 particle Substances 0.000 claims description 34
- 239000011159 matrix material Substances 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 abstract 4
- 239000000463 material Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- CXKCTMHTOKXKQT-UHFFFAOYSA-N cadmium oxide Inorganic materials [Cd]=O CXKCTMHTOKXKQT-UHFFFAOYSA-N 0.000 description 1
- CFEAAQFZALKQPA-UHFFFAOYSA-N cadmium(2+);oxygen(2-) Chemical compound [O-2].[Cd+2] CFEAAQFZALKQPA-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005094 computer simulation Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
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- 239000011888 foil Substances 0.000 description 1
- -1 for example Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000002086 nanomaterial Substances 0.000 description 1
- 239000002073 nanorod Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/854—Arrangements for extracting light from the devices comprising scattering means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/856—Arrangements for extracting light from the devices comprising reflective means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/302—Details of OLEDs of OLED structures
- H10K2102/3023—Direction of light emission
- H10K2102/3031—Two-side emission, e.g. transparent OLEDs [TOLED]
Definitions
- Radiation-emitting device A radiation-emitting device is specified.
- OLEDs Organic light-emitting diodes
- OLEDs are suitable as large-area, thin lighting elements. In many applications, it is desirable that the device over the entire
- Radiation-emitting devices according to the prior art in some areas of the radiating surface does not emit radiation. This may be the case, for example, because these areas are covered by contacting elements or insulating elements, or because there is no active radiation-emitting layer in these areas
- At least one object of certain embodiments is to provide a radiation-emitting device which has a greater extent, in particular the entire Expansion of at least one of their surfaces
- Another object is to achieve the most homogeneous possible luminance over the
- radiation-emitting device is a substrate
- the layer sequence comprises at least one first electrode surface, at least one second electrode surface and at least one functional layer between the first electrode surface and the second
- the functional layer is suitable for generating electromagnetic radiation in the wavelength range in an activated operating state.
- Device further comprises a radiation-emitting
- Between two other layers or elements may be arranged and applied, here and in the following mean that the one layer or the one element is arranged directly in direct mechanical and / or electrical contact on the other layer or the other element It can also mean that the one layer or the one element is indirectly on
- the radiation-emitting device comprises a scattering layer comprising a first region and a second region, wherein in an orthogonal
- the scattering layer is arranged between the layer sequence and the substrate, in particular between the first electrode surface and the substrate.
- the first and second regions of the litter layer correspond to first and second regions of the device, which in one Top view of the litter layer with the first and second region of the litter layer come to coincide. That is, the first region of the device is that region of the device
- a device which is projected on the scattering layer on the first region of the scattering layer in an orthogonal projection, and the second region of the device is that region of the device which in a
- orthogonal projection on the litter layer is projected onto the second area of the litter layer.
- the wavelength range is preferably an area in the visible electromagnetic spectrum.
- the first area of the device preferably adjoins the second area of the device.
- the first area may be a central area
- the second area may be a
- the second region may at least partially enclose the first region, in particular enclose annularly and may have a substantially constant width.
- the shape of the first region may correspond to the shape of the entire device.
- the first area is larger than the second area.
- In the second region may be contact elements, insulating elements and other elements, which in a conventional radiation-emitting device according to the prior
- the Device may be a region in which the functional layer is formed, and the second region of the device may be a part in which no functional layer is formed.
- the second region can thus be free of radiation-generating elements.
- the radiation-emitting device may be transparent or at least translucent, and in particular as a transparent OLED, at least in a partial region or as a whole
- both the first region of the device and the second region of the device can be transparent or at least translucent.
- both the first region of the device and the second region of the device can be transparent or at least translucent.
- Insulation elements o.a. are also transparent or at least translucent in this case.
- the scattering layer is designed to at least partially scatter radiation incident on the first region of the scattering layer so that it is incident into the second region of the radiation layer
- the scattering layer is adapted to the first region of the scattering layer
- the scattered radiation can pass in a straight line from the scattering point into the second region of the scattering layer or be reflected at least once at an interface of the scattering layer before it reaches the second region of the scattering layer.
- the scattered radiation at at least one interface
- the scattering layer thus acts as a waveguide. Radiation scattered at an angle under which it is totally reflected at the interfaces of the litter layer is effectively optically isolated from the first and second electrode surfaces and the functional layer and no longer interacts with them. Depending on the angle, under the radiation from the functional layer
- Radiation-emitting device in the first region of the device, the functional layer is formed and is adapted to emit radiation in the direction of the litter layer, and that in the second
- the insulating elements may comprise a resist material, for example a polyimide, which is applied to electrically isolate different parts of the device, for example the first and second electrode surfaces. According to at least one embodiment of the
- Radiation-emitting device is provided that the substrate, the at least one first electrode surface, the at least one functional layer and the at least one second electrode surface are arranged in this order.
- Radiation-emitting device is provided that the Substrate and the first electrode surface are transparent, so that the radiation-emitting
- the radiation-emitting surface is preferably a surface of the substrate or of an encapsulation layer applied to the substrate
- the second electrode surface may be transparent, so that the radiation-emitting device is referred to as a so-called “top emitter” emitter "is executed.
- the top emitter emitter
- Radiation emitting surface preferably one
- the radiation-emitting device can be embodied both as a “top emitter” and as a “bottom emitter”; in this case, the radiation emitter includes
- the scattering layer acts by volume scattering.
- the scattering layer can be a matrix material and scattering particles with a different material to the matrix material
- the litter layer can act by interfacial scattering.
- the litter layer can act by interfacial scattering.
- the litter layer can act by interfacial scattering.
- the litter layer can act by interfacial scattering.
- volume spread has compared to Interfacial scattering the advantage that in this case the total reflection at the interfaces of the litter layer is not disturbed.
- Radiation-emitting device is provided that the radiation-emitting device further comprises a
- the low refractive index layer is a layer that is in the
- Wavelength range has a low refractive index, preferably a refractive index between 1 and 1.4, more preferably between 1.1 and 1.3.
- low refractive index polymers having a refractive index of about 1.3 in the visible wavelength range are commercially available.
- the low-refractive layer can also
- silica nanorod structures which have an effective refractive index close to 1 in the visible wavelength range, as they mostly from
- Cavities that may be filled with air or nitrogen.
- the low-refraction layer preferably adjoins the scattering layer and has a lower refractive index in the wavelength range than the scattering layer. This ensures that radiation which impinges on the low refractive index layer at a sufficiently flat angle from the litter layer is totally reflected and thus remains in the litter layer, so that the radiation in the
- the low-refractive-index layer is preferably arranged between the functional layer and the scattering layer. This prevents radiation that has been scattered by the litter layer at a sufficiently shallow angle, the Litter layer leaves in the direction of the functional layer.
- the refractive index of the low refractive index layer in the wavelength region is also lower than the refractive index of the first and second electrode surfaces and / or the functional layer.
- Electrode surface and the litter layer arranged.
- Radiation-emitting device is provided that the scattering layer is formed by the substrate. This ensures that no additional layer must be applied to provide a litter layer.
- the scattering layer is an additional layer different from the substrate.
- This additional layer is preferably arranged on the side of the substrate facing away from the radiation-emitting surface. This ensures that the litter layer is protected inside the device.
- the reflection or total reflection at the interfaces of the scattering layer in this case can not be disturbed by impurities, for example fingerprints, on the outer surfaces of the device.
- impurities for example fingerprints
- the litter layer is adjacent to the substrate.
- the scattering layer is preferably located directly between the Substrate and a low-refractive layer, and that
- Wavelength range a lower refractive index than the litter layer. This ensures that radiation which propagates at a sufficiently flat angle is totally reflected at both boundary surfaces of the litter layer and thus remains in the litter layer.
- the litter layer has a thickness of 1 ym to 5 mm, preferably 50 ym to 500 ym and more preferably 100 ym to 200 ym
- the thickness of the litter layer can over the
- Vary scatter layer This can be a
- Planarization to compensate for different layer thicknesses can be achieved.
- the litter layer has a matrix material and scattering particles having a diameter of 5 nm to 500 nm, preferably 200 nm to 400 nm and more preferably 250 nm to 350 nm.
- Wavelength range a different refractive index than the matrix material.
- the scattering particles may have a higher refractive index than the matrix material.
- scattering particles are the
- titanium oxide, titanium dioxide, aluminum oxide (sapphire) or zirconium oxide contain or consist of.
- the scattering particles may have a lower refractive index than the matrix material.
- the scattering particles may contain or consist of silicon dioxide, for example or be formed as pores, for example as air-filled pores.
- Radiation-emitting device that the concentration of the scattering particles in the first region of the scattering layer is lower than in the second region of the scattering layer.
- the radiation is increasingly scattered at angles at which they are from the second region of the
- Litter layer can escape and be emitted.
- the concentration of the scattering particles in the scattering layer may have a gradient, wherein the
- Concentration increases from the first region of the litter layer to the second region of the litter layer.
- concentration of the scattering particles may be constant in each case in the first region of the scattering layer and may be constant in the second region of the scattering layer.
- the thickness of the litter layer and the concentration of the scattering particles can be used to set how much light is scattered into the litter layer and how much light is scattered out of the litter layer.
- the scattering in the first area and in the second area must be coordinated with each other.
- the Spreading particles 0.1 to 20 volume percent of the litter layer.
- the scattering particles in the first region of the scattering layer occupy 0.1 to 5 percent by volume, more preferably 0.1 to 2 percent by volume, of the scattering layer.
- the scattering particles in the second region of the litter layer occupy 2 to 20 percent by volume, more preferably 10 to 15 percent by volume, of the litter layer.
- the concentration of scattering particles in the litter layer is significantly lower than in a typical one
- Coupling layer according to the prior art, ie a layer which is adapted to couple radiation by scattering from the device.
- the scattering layer is formed so that on the
- Radiation emitting surface gives a homogeneous luminance.
- the scattering layer can be designed so that the subjective impression of a homogeneous luminance arises. As the luminance on the edge of a luminous
- Radiation-emitting surface if required, a higher luminance can also be brought about at the edge of the radiation-emitting surface than in the middle. Since the luminance distribution on the radiation-emitting surface in a complicated manner on the geometry of the
- Litter layer depends, the properties of the Litter layer, for example the distribution of
- a mirror element is provided, for example, a reflective layer, which may for example consist of silver.
- Mirror element is preferably located between the first electrode surface and the second region of the scattering layer, more preferably between the first electrode surface and the low-refractive layer or between the
- the mirror element does not limit the radiation incident on the scattering layer. According to at least one embodiment of the
- Radiation-emitting device is provided that the device is at least partially mirrored on at least one surface which is not provided as a radiation-emitting surface. This ensures that
- Radiation-emitting device is provided that the radiation-emitting device a
- Discharge element for example, a decoupling layer comprises.
- the outcoupling element is as
- Discharge layer in the layer sequence executed. This ensures that radiation which is otherwise at low angles to an interface of the layer sequence, in particular an interface between the layer sequence and the
- the features according to the invention can be combined with the features of known radiation-emitting devices which have internal coupling-out.
- the radiation-emitting device is designed as a surface, which, however, does not have to be flat, but can also be flexible, for example.
- Electrode surface preferably contains or consists of a transparent conductive oxide (TCO).
- Transparent conductive oxides are transparent, conductive materials, usually metal oxides, such as zinc oxide, tin oxide, cadmium oxide,
- ITO indium tin oxide
- At least one functional layer preferably comprises an organic functional layer, in particular an organic electroluminescent layer.
- the radiation-emitting device may in particular be designed as an organic light-emitting diode (OLED) or comprise such.
- OLED organic light-emitting diode
- a functional region having one or more functional layers of organic materials can be applied over the first electrode surface.
- the functional layers can, for example, as
- Electron transport layers electroluminescent
- Layers and / or hole transport layers may be formed. Above the functional layers can be the second
- Layers can be electromagnetic in an active region by electron and hole injection and recombination
- Radiation can be generated with a single wavelength or a range of wavelengths.
- Functional layer may in particular an organic
- the organic functional layer stack can, for example, a
- Hole injection layer a hole transport layer, an electron blocking layer, a hole blocking layer, an electron transport layer and / or a
- the functional layers may be organic polymers, organic oligomers, organic monomers, organic small, non-polymeric molecules ("small molecules”) or
- Suitable materials as well as arrangements and structuring of the materials for functional layers are those skilled in the art are known and will therefore not be further elaborated at this point.
- the litter layer may preferably be a transparent one
- Material for example, glass or a transparent polymer, for example, a transparent epoxy resin, contain or consist of.
- the substrate may, for example, glass, quartz, a
- Figure 1 is a schematic cross-sectional view of a first embodiment of a
- FIG. 2 is a schematic cross-sectional view of a second embodiment of a radiation-emitting device
- FIG. 3 is a schematic representation of
- Figure 4 is a schematic representation of a beam path in the litter layer of the first
- Figure 5 is a schematic cross-sectional view of a third embodiment of a
- identical, identical or identically acting elements can each be provided with the same reference numerals.
- the illustrated elements and their proportions with each other are not to be regarded as true to scale; Rather, individual elements, such as layers, components, components and areas may be disproportionately large for better representability and / or better understanding; This can affect individual dimensions or all
- FIG. 1 shows a schematic cross-sectional view of a first exemplary embodiment of a total of 100
- Then-emitting device designated radiation-emitting device.
- Radiation-emitting device 100 comprises a substrate 10, for example a glass substrate. Furthermore, the substrate 10, for example a glass substrate. Furthermore, the
- Radiation-emitting device 100 a layer sequence comprising an anode 12 serving as a first electrode surface, a cathode 16 serving as a second electrode surface, and a function layer 14 disposed between the anode 12 and the cathode 16, which is suitable, in a switched-on operating state generate electromagnetic radiation in a wavelength range.
- An encapsulation layer 18 protects the cathode 16 as well as the lateral surfaces of the functional layer 14 against external influences.
- the radiation-emitting device 100 comprises a radiation-emitting surface 20 and a scattering layer 22.
- the refractive index in the wavelength range is lower than the refractive index of the scattering layer 22.
- the refractive index of Substrate 10 is in the
- the radiation-emitting device 100 comprises a first area designated as a whole by 26, and a second area designated as a whole by 28, in each of which first and second areas of the scattering layer also lie.
- the second area 28 encloses the first area 26
- the second region 28 disintegrates into two regions on both sides of the first region 26.
- the functional layer 14 and the cathode 16 are formed in the first region 26 of the device, but not in the second region 28.
- the substrate 10, the anode 12, the scattering layer 22 and the low refractive index layer 24 are for radiation in the
- Wavelength range essentially permeable. Radiation generated in the functional layer 14 can thus penetrate these layers and be emitted at the radiation-emitting surface 20. Since the functional layer 14 is formed only in the first region 26, this transmitted radiation is substantially only in the first Area 26 of the device emitted. However, part of the radiation is scattered at the scattering layer 22. Because the
- Litter layer 22 in the wavelength range has a lower refractive index than both the low-refractive index
- the scattering layer 22 thus serves as a waveguide.
- radiation incident on the scattering layer 22 and scattered there in the first region 26 can reach the second region 28, in which it in turn can be scattered on the scattering layer 22 and emitted in the second region 28 through the radiation-emitting surface 20.
- the second region 28 of the device is between the anode 12 and the low refractive layer 24 a
- Silver mirror 32 is provided, which serves as a mirror element and radiation, which in the second region 28 through the
- Litter layer 22 is scattered toward the anode 12, reflected, so that this radiation in the second region 28 can be emitted to the radiation-emitting surface 20.
- the silver mirror 32 also between the
- FIG. 2 shows a schematic cross-sectional view of a second exemplary embodiment of a total of 200
- Then-emitting device designated radiation-emitting device.
- Radiation-emitting device 200 has the same structure in many parts as the radiation-emitting
- Embodiment does not have a separate scattering layer; rather, in this case, the substrate 10 serves as
- Layer 24 is arranged. Since the air beyond the substrate 10 has a refractive index close to 1 in the wavelength region which is lower than the refractive index of the substrate, total reflection also occurs at the radiation-emitting surface 20 when radiation propagates at a sufficiently shallow angle in the substrate 10 serving as a scattering layer , Thus, also in this embodiment, radiation after repeated reflection at the interfaces of the substrate 10 serving as the scattering layer becomes the first one
- FIG. 3 shows a schematic representation of
- the scattering layer 22 acts by volume scattering on distributed in the litter layer 22 scattering particles 40. Radiation 42, which is not on
- Scattering particle 40 hits, passes through the low-refractive Layer 24, the scattering layer 22 and the substrate 10 and is emitted at the radiation-emitting surface 20.
- FIG. 3 shows radiation 44 which is scattered on a scattering particle 40 in such a way that the scattered radiation 46 impinges on the boundary surface between the scattering layer 22 and the substrate 10 at a sufficiently flat angle so that it is totally reflected there.
- FIG. 4 shows a schematic representation of a
- Section 26 of the device as well as a part of the second portion 28 of the device.
- radiation 44 which strikes a scattering particle 40 is scattered thereon so that the scattered radiation 46 impinges at a sufficiently shallow angle on the interface between the scattering layer 22 and the substrate 10 to be totally reflected there.
- the reflected radiation 48 propagates further in the scattering layer 22 and reaches the second region of the scattering layer 22. There, a significantly higher level is achieved
- FIG. 5 shows a schematic cross-sectional view of a third exemplary embodiment of a total of 300
- Then-emitting device designated radiation-emitting device.
- Radiation-emitting device 300 has the same structure in many parts as the radiation-emitting
- Embodiment is designed to be transparent overall or at least translucent, in particular as a transparent OLED.
- both the first region of the device 26 and the second region of the device 28 are transparent or at least translucent.
- no mirror elements 32 are arranged, but
- Radiation-emitting device 300 has two
- the radiation emitting device 300 does not have a separate low refractive index layer; however, in an embodiment not shown, it is provided as in the embodiment shown in Figure 1.
- Encapsulation element 34 is arranged, which is a
- Laminierklebertik and a cover glass comprises.
- the scattering layer 22 acting as a waveguide has a higher refractive index than the substrate 10.
- Light that can not leave the radiation-emitting device 300 passes through the scattering layer 22 until it is completely attenuated or a scattering event occurs in the scattering layer 22.
- Radiation-emitting device 300 By matching the scattering concentrations on the surface and the thickness of the
- Litter layer 22 a homogeneous brightness impression over the entire component can be achieved.
- a transparent, full-surface luminous OLED can be provided.
- the radiation-emitting device is also overall transparent or at least translucent, in particular as a transparent OLED. Similar to the embodiment shown in Figure 2, the
- a return of the light is prevented in the upper part of the radiation-emitting device, so that an absorption of the light is reduced and the light can travel longer distances in the radiation-emitting device.
- Litter layer for example, by selecting the concentration of scattering particles, it is possible to produce scattering, which is not perceived by the human eye when looking through the litter layer, since the light that passes through the litter layer, is scattered only to a small extent.
- the propagation length is higher than that of the scattering layer
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Optical Elements Other Than Lenses (AREA)
- Led Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480042247.8A CN105474423B (zh) | 2013-07-26 | 2014-07-17 | 发射辐射的设备 |
US14/907,628 US9774006B2 (en) | 2013-07-26 | 2014-07-17 | Radiation-emitting apparatus having a scatter layer |
DE112014003447.9T DE112014003447B4 (de) | 2013-07-26 | 2014-07-17 | Strahlungsemittierende Vorrichtung |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013108039.1A DE102013108039A1 (de) | 2013-07-26 | 2013-07-26 | Strahlungsemittierende Vorrichtung |
DE102013108039.1 | 2013-07-26 |
Publications (2)
Publication Number | Publication Date |
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WO2015011027A2 true WO2015011027A2 (de) | 2015-01-29 |
WO2015011027A3 WO2015011027A3 (de) | 2015-03-19 |
Family
ID=51210488
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/EP2014/065440 WO2015011027A2 (de) | 2013-07-26 | 2014-07-17 | Strahlungsemittierende vorrichtung |
Country Status (4)
Country | Link |
---|---|
US (1) | US9774006B2 (de) |
CN (1) | CN105474423B (de) |
DE (2) | DE102013108039A1 (de) |
WO (1) | WO2015011027A2 (de) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102015101683A1 (de) * | 2015-02-05 | 2016-08-11 | Osram Oled Gmbh | Lichtemittierende Vorrichtung und Verfahren zur Herstellung einer lichtemittierenden Vorrichtung |
DE102015118717A1 (de) * | 2015-11-02 | 2017-05-04 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
US20170322359A1 (en) * | 2016-05-04 | 2017-11-09 | Samsung Display Co., Ltd. | Display device |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6952079B2 (en) * | 2002-12-18 | 2005-10-04 | General Electric Company | Luminaire for light extraction from a flat light source |
WO2004089042A1 (ja) * | 2003-03-12 | 2004-10-14 | Mitsubishi Chemical Corporation | エレクトロルミネッセンス素子 |
JP2005038681A (ja) * | 2003-07-18 | 2005-02-10 | Toyota Industries Corp | ボトムエミッション型発光素子形成用の透明基板及び当該透明基板を用いた発光デバイス |
JP2005158665A (ja) * | 2003-11-24 | 2005-06-16 | Toyota Industries Corp | 照明装置 |
DE102004035965B4 (de) | 2004-07-23 | 2007-07-26 | Novaled Ag | Top-emittierendes, elektrolumineszierendes Bauelement mit zumindest einer organischen Schicht |
JP2008108439A (ja) * | 2006-10-23 | 2008-05-08 | Nec Lighting Ltd | 電界発光素子および電界発光パネル |
US7982396B2 (en) * | 2007-06-04 | 2011-07-19 | Global Oled Technology Llc | Light-emitting device with light-scattering particles and method of making the same |
JP2009211885A (ja) * | 2008-03-03 | 2009-09-17 | Rohm Co Ltd | 有機el装置 |
JP5850749B2 (ja) * | 2009-02-05 | 2016-02-03 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 有機エレクトロルミネッセンス装置 |
WO2010100584A2 (en) * | 2009-03-05 | 2010-09-10 | Koninklijke Philips Electronics N. V. | Oleds connected in series |
KR101789586B1 (ko) * | 2010-12-06 | 2017-10-26 | 삼성디스플레이 주식회사 | 광 산란 기판, 이의 제조 방법, 이를 포함하는 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
DE102011079012A1 (de) * | 2011-07-12 | 2013-01-17 | Ledon Oled Lighting Gmbh & Co. Kg | Leuchtmodul mit steuerbarer Lichtlenkung |
DE102011079797A1 (de) * | 2011-07-26 | 2013-01-31 | Ledon Oled Lighting Gmbh & Co. Kg | OLED/QLED-Leuchtmodul mit gleichmäßigem Erscheinungsbild |
TWI463717B (zh) * | 2011-07-29 | 2014-12-01 | Au Optronics Corp | 有機發光元件及其製造方法及使用其之照明裝置 |
DE102011086168B4 (de) * | 2011-11-11 | 2023-05-04 | Pictiva Displays International Limited | Organisches Licht emittierendes Bauelement und Verfahren zur Herstellung eines organischen optoelektronischen Bauelements |
US9543546B2 (en) * | 2013-06-18 | 2017-01-10 | Konica Minolta, Inc. | Organic light-emitting element |
-
2013
- 2013-07-26 DE DE102013108039.1A patent/DE102013108039A1/de not_active Withdrawn
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2014
- 2014-07-17 DE DE112014003447.9T patent/DE112014003447B4/de active Active
- 2014-07-17 WO PCT/EP2014/065440 patent/WO2015011027A2/de active Application Filing
- 2014-07-17 US US14/907,628 patent/US9774006B2/en active Active
- 2014-07-17 CN CN201480042247.8A patent/CN105474423B/zh active Active
Also Published As
Publication number | Publication date |
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DE112014003447B4 (de) | 2019-02-28 |
CN105474423B (zh) | 2018-01-09 |
DE112014003447A5 (de) | 2016-05-04 |
CN105474423A (zh) | 2016-04-06 |
US9774006B2 (en) | 2017-09-26 |
US20160164037A1 (en) | 2016-06-09 |
DE102013108039A1 (de) | 2015-01-29 |
WO2015011027A3 (de) | 2015-03-19 |
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