WO2011087737A2 - Polishing pad and method of making the same - Google Patents
Polishing pad and method of making the same Download PDFInfo
- Publication number
- WO2011087737A2 WO2011087737A2 PCT/US2010/061199 US2010061199W WO2011087737A2 WO 2011087737 A2 WO2011087737 A2 WO 2011087737A2 US 2010061199 W US2010061199 W US 2010061199W WO 2011087737 A2 WO2011087737 A2 WO 2011087737A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- polishing
- layer
- polishing pad
- composition
- polymer particles
- Prior art date
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- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- HFHDHCJBZVLPGP-UHFFFAOYSA-N schardinger α-dextrin Chemical compound O1C(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC(C(O)C2O)C(CO)OC2OC(C(C2O)O)C(CO)OC2OC2C(O)C(O)C1OC2CO HFHDHCJBZVLPGP-UHFFFAOYSA-N 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000008107 starch Substances 0.000 description 1
- 235000019698 starch Nutrition 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- XLAIWHIOIFKLEO-UHFFFAOYSA-N stilbene-4,4'-diol Chemical compound C1=CC(O)=CC=C1C=CC1=CC=C(O)C=C1 XLAIWHIOIFKLEO-UHFFFAOYSA-N 0.000 description 1
- 125000005504 styryl group Chemical group 0.000 description 1
- PXQLVRUNWNTZOS-UHFFFAOYSA-N sulfanyl Chemical class [SH] PXQLVRUNWNTZOS-UHFFFAOYSA-N 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- KSBAEPSJVUENNK-UHFFFAOYSA-L tin(ii) 2-ethylhexanoate Chemical compound [Sn+2].CCCCC(CC)C([O-])=O.CCCCC(CC)C([O-])=O KSBAEPSJVUENNK-UHFFFAOYSA-L 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 1
- AVWRKZWQTYIKIY-UHFFFAOYSA-N urea-1-carboxylic acid Chemical compound NC(=O)NC(O)=O AVWRKZWQTYIKIY-UHFFFAOYSA-N 0.000 description 1
- 229940042596 viscoat Drugs 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- 239000002888 zwitterionic surfactant Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
- B24D3/28—Resins or natural or synthetic macromolecular compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/34—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties
- B24D3/342—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent
- B24D3/344—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents characterised by additives enhancing special physical properties, e.g. wear resistance, electric conductivity, self-cleaning properties incorporated in the bonding agent the bonding agent being organic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Polyurethanes Or Polyureas (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201080063912.3A CN102762340B (en) | 2009-12-22 | 2010-12-20 | Polishing pad and manufacture method thereof |
KR1020127019080A KR101855073B1 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of making the same |
JP2012546101A JP5728026B2 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of manufacturing the same |
SG2012046546A SG181890A1 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of making the same |
US13/518,475 US20130012108A1 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of making the same |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US28898209P | 2009-12-22 | 2009-12-22 | |
US61/288,982 | 2009-12-22 | ||
US42244210P | 2010-12-13 | 2010-12-13 | |
US61/422,442 | 2010-12-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2011087737A2 true WO2011087737A2 (en) | 2011-07-21 |
WO2011087737A3 WO2011087737A3 (en) | 2011-09-15 |
Family
ID=44247814
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2010/061199 WO2011087737A2 (en) | 2009-12-22 | 2010-12-20 | Polishing pad and method of making the same |
Country Status (6)
Country | Link |
---|---|
US (1) | US20130012108A1 (en) |
JP (1) | JP5728026B2 (en) |
KR (1) | KR101855073B1 (en) |
SG (1) | SG181890A1 (en) |
TW (1) | TWI517975B (en) |
WO (1) | WO2011087737A2 (en) |
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WO2013142134A1 (en) * | 2012-03-20 | 2013-09-26 | Jh Rhodes Company, Inc. | A self-conditioning polishing pad and a method of making the same |
CN105150120A (en) * | 2015-09-01 | 2015-12-16 | 河南科技学院 | Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer |
KR101847619B1 (en) * | 2012-01-12 | 2018-04-11 | 엠.씨.케이(주) | Polishing pad having a high-content of abrasive ingredients and method of manufacturing the same |
CN108789186A (en) * | 2017-05-01 | 2018-11-13 | 陶氏环球技术有限责任公司 | Manufacturing has the method for the chemical mechanical polishing layer for improving uniformity |
US20220119586A1 (en) * | 2020-10-19 | 2022-04-21 | Cmc Materials, Inc. | Uv-curable resins used for chemical mechanical polishing pads |
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US20120302148A1 (en) * | 2011-05-23 | 2012-11-29 | Rajeev Bajaj | Polishing pad with homogeneous body having discrete protrusions thereon |
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US10399201B2 (en) | 2014-10-17 | 2019-09-03 | Applied Materials, Inc. | Advanced polishing pads having compositional gradients by use of an additive manufacturing process |
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US10010106B2 (en) | 2015-04-30 | 2018-07-03 | Frito-Lay North America, Inc. | Method and apparatus for removing a portion of a food product with an abrasive stream |
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-
2010
- 2010-12-20 WO PCT/US2010/061199 patent/WO2011087737A2/en active Application Filing
- 2010-12-20 JP JP2012546101A patent/JP5728026B2/en active Active
- 2010-12-20 SG SG2012046546A patent/SG181890A1/en unknown
- 2010-12-20 US US13/518,475 patent/US20130012108A1/en not_active Abandoned
- 2010-12-20 KR KR1020127019080A patent/KR101855073B1/en active IP Right Grant
- 2010-12-21 TW TW099145034A patent/TWI517975B/en not_active IP Right Cessation
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WO1999056913A1 (en) * | 1998-05-01 | 1999-11-11 | Minnesota Mining And Manufacturing Company | Coated abrasive article |
WO2002022309A1 (en) * | 2000-09-15 | 2002-03-21 | Ppg Industries Ohio, Inc. | Polishing pad comprising particulate polymer and crosslinked polymer binder |
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Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101847619B1 (en) * | 2012-01-12 | 2018-04-11 | 엠.씨.케이(주) | Polishing pad having a high-content of abrasive ingredients and method of manufacturing the same |
WO2013142134A1 (en) * | 2012-03-20 | 2013-09-26 | Jh Rhodes Company, Inc. | A self-conditioning polishing pad and a method of making the same |
US9050697B2 (en) | 2012-03-20 | 2015-06-09 | Jh Rhodes Company, Inc. | Self-conditioning polishing pad and a method of making the same |
CN105150120A (en) * | 2015-09-01 | 2015-12-16 | 河南科技学院 | Rigid layer of fixed abrasive polishing roll for Roll-to-Roll chemical-mechanical polishing machine and preparation method of rigid layer |
CN105150120B (en) * | 2015-09-01 | 2018-03-30 | 河南科技学院 | A kind of Roll to Roll chemical-mechanical polishing mathings rigid layer of concretion abrasive polishing roll and preparation method thereof |
CN108789186A (en) * | 2017-05-01 | 2018-11-13 | 陶氏环球技术有限责任公司 | Manufacturing has the method for the chemical mechanical polishing layer for improving uniformity |
CN108789186B (en) * | 2017-05-01 | 2023-06-30 | 陶氏环球技术有限责任公司 | Method of manufacturing a chemical mechanical polishing layer with improved uniformity |
US20220119586A1 (en) * | 2020-10-19 | 2022-04-21 | Cmc Materials, Inc. | Uv-curable resins used for chemical mechanical polishing pads |
US11807710B2 (en) * | 2020-10-19 | 2023-11-07 | Cmc Materials, Inc. | UV-curable resins used for chemical mechanical polishing pads |
Also Published As
Publication number | Publication date |
---|---|
JP5728026B2 (en) | 2015-06-03 |
KR20120120247A (en) | 2012-11-01 |
US20130012108A1 (en) | 2013-01-10 |
TW201130656A (en) | 2011-09-16 |
KR101855073B1 (en) | 2018-05-09 |
TWI517975B (en) | 2016-01-21 |
WO2011087737A3 (en) | 2011-09-15 |
SG181890A1 (en) | 2012-07-30 |
JP2013515379A (en) | 2013-05-02 |
CN102762340A (en) | 2012-10-31 |
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