WO2011025241A3 - Bonding wire antenna communication module - Google Patents

Bonding wire antenna communication module Download PDF

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Publication number
WO2011025241A3
WO2011025241A3 PCT/KR2010/005668 KR2010005668W WO2011025241A3 WO 2011025241 A3 WO2011025241 A3 WO 2011025241A3 KR 2010005668 W KR2010005668 W KR 2010005668W WO 2011025241 A3 WO2011025241 A3 WO 2011025241A3
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WO
WIPO (PCT)
Prior art keywords
communication module
bonding wire
wire antenna
antenna communication
semiconductor chip
Prior art date
Application number
PCT/KR2010/005668
Other languages
French (fr)
Korean (ko)
Other versions
WO2011025241A2 (en
Inventor
김태욱
Original Assignee
연세대학교 산학협력단
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020090079220A external-priority patent/KR20110021427A/en
Priority claimed from KR1020090079208A external-priority patent/KR101133146B1/en
Priority claimed from KR20100007502A external-priority patent/KR101129553B1/en
Application filed by 연세대학교 산학협력단 filed Critical 연세대학교 산학협력단
Publication of WO2011025241A2 publication Critical patent/WO2011025241A2/en
Publication of WO2011025241A3 publication Critical patent/WO2011025241A3/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
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    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73257—Bump and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/91—Methods for connecting semiconductor or solid state bodies including different methods provided for in two or more of groups H01L2224/80 - H01L2224/90
    • H01L2224/92—Specific sequence of method steps
    • H01L2224/9202—Forming additional connectors after the connecting process
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    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/04—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers
    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/0651—Wire or wire-like electrical connections from device to substrate
    • H—ELECTRICITY
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    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
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    • H01L2225/065—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices not having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/06503—Stacked arrangements of devices
    • H01L2225/06541—Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV]
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Abstract

Provided is a bonding wire antenna communication module. The bonding wire antenna communication module comprises: a semiconductor chip including bonding pads arranged on a substrate; and bonding wire antennas electrically connected to the bonding pads. The semiconductor chip of the communication module comprises inexpensive CMOS amplifiers, and each of the amplifiers operates at the highest efficiency, thereby providing an inexpensive, high-efficiency and optimized highly integrated communication module.
PCT/KR2010/005668 2009-08-26 2010-08-24 Bonding wire antenna communication module WO2011025241A2 (en)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
KR10-2009-0079208 2009-08-26
KR1020090079220A KR20110021427A (en) 2009-08-26 2009-08-26 Monopole bonding wire antenna communication module
KR1020090079208A KR101133146B1 (en) 2009-08-26 2009-08-26 Bonding Wire Antenna Communication Module
KR10-2009-0079220 2009-08-26
KR10-2010-0007502 2010-01-27
KR20100007502A KR101129553B1 (en) 2010-01-27 2010-01-27 Communication Module

Publications (2)

Publication Number Publication Date
WO2011025241A2 WO2011025241A2 (en) 2011-03-03
WO2011025241A3 true WO2011025241A3 (en) 2011-06-23

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017200130A1 (en) 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Ribbon Bond antennas
DE102017200132A1 (en) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Antenna device with bonding wires
CN108963420A (en) * 2018-04-23 2018-12-07 易力声科技(深圳)有限公司 A kind of high resiliency antenna being made by closing line
CN108538823B (en) * 2018-04-25 2020-06-19 成都聚利中宇科技有限公司 Packaging chip of integrated monopole antenna and processing method thereof
CN112420526A (en) * 2019-08-20 2021-02-26 江苏长电科技股份有限公司 Double-substrate laminated structure and packaging method thereof
US11233017B2 (en) * 2019-10-03 2022-01-25 Texas Instruments Incorporated Ex-situ manufacture of metal micro-wires and FIB placement in IC circuits

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US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
JP2005182330A (en) * 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing semiconductor device
WO2006022836A1 (en) * 2004-08-06 2006-03-02 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR20090063166A (en) * 2007-12-12 2009-06-17 브로드콤 코포레이션 Method and system for a phased array antenna embedded in an integrated circuit package

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US5682143A (en) * 1994-09-09 1997-10-28 International Business Machines Corporation Radio frequency identification tag
JP2005182330A (en) * 2003-12-18 2005-07-07 Matsushita Electric Ind Co Ltd Semiconductor device and method for manufacturing semiconductor device
WO2006022836A1 (en) * 2004-08-06 2006-03-02 International Business Machines Corporation Apparatus and methods for constructing antennas using wire bonds as radiating elements
KR20090063166A (en) * 2007-12-12 2009-06-17 브로드콤 코포레이션 Method and system for a phased array antenna embedded in an integrated circuit package

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