WO2008107230A1 - Process for manufacturing an rfid-type communication device - Google Patents

Process for manufacturing an rfid-type communication device Download PDF

Info

Publication number
WO2008107230A1
WO2008107230A1 PCT/EP2008/051006 EP2008051006W WO2008107230A1 WO 2008107230 A1 WO2008107230 A1 WO 2008107230A1 EP 2008051006 W EP2008051006 W EP 2008051006W WO 2008107230 A1 WO2008107230 A1 WO 2008107230A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic unit
coil
contact
support
wire
Prior art date
Application number
PCT/EP2008/051006
Other languages
French (fr)
Inventor
Hervé de Lambilly
Abdul-Hamid Kayal
Original Assignee
Em Microelectronic-Marin Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Em Microelectronic-Marin Sa filed Critical Em Microelectronic-Marin Sa
Publication of WO2008107230A1 publication Critical patent/WO2008107230A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/362—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith for broadside radiating helical antennas
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/10—Connecting leads to windings

Definitions

  • the present invention relates to a method of manufacturing an electromagnetic wave communication device comprising an antenna coil and an electronic unit provided with two pads or contact tab for receiving both ends of the coil.
  • the present invention also relates to a communication device that can be obtained by the manufacturing method of the invention.
  • This tool is arranged to hold the core of the coil in a specific position relative to the electronic circuit.
  • On the gripping tool of the electronic circuit and the coil core are arranged two pins for guiding the electric wire used to form the coil. It is expected that the electronic circuit is precisely positioned in the tool relative to the two guide pins so as to ensure that the ends of the coil in the winding installation are stretched over the two contact pads of the electronic circuit for allow then to establish the electrical connection by thermocompression.
  • This method of manufacture is relatively complex because it is necessary to bring and precisely position the electronic circuit in a gripping tool of the coil core, which must also be precisely grasped by this tool to allow to form the coil and connect its ends to the circuit pads while the electrical wire is held taut above the tool in the resulting configuration of the formation of the winding of the coil.
  • the object of the present invention is to provide a simplified method of manufacturing a communication device of the type mentioned above in the technical field of the invention.
  • the subject of the invention is therefore a method for manufacturing an electromagnetic wave communication device comprising an antenna coil and an electronic unit provided with two contact strips or tongues intended to receive the two ends of the coil, this method being characterized by the following steps:
  • the electronic unit is fixed on a support around which it is intended to carry out the winding of the coil, - An electric wire is brought against a first substantially vertical surface of a first portion of the electronic unit so that the wire is taut and remains in abutment against this first surface, which defines either a first contact area of said electronic unit , a first stop rising on the periphery of a first contact pad of this electronic unit,
  • the said winding is formed with the electric wire around the said core, the electric wire is brought against a second substantially vertical surface of a second portion of the said electronic unit so that the electric wire is stretched and remains in abutment against this second surface; which defines either a second contact pad of the electronic unit or a second stop rising on the periphery of a second contact pad of this electronic unit,
  • the electrical wire is maintained substantially tensioned in the configuration resulting from the preceding steps and this wire is fixed to said first and second contact pads of the electronic unit so as to establish an electrical connection between the coil and this electronic unit.
  • the fixing of the electric wire will be done after the production of the coil, although it is also conceivable, in the context of the present invention, to fix it on the first surface after it has been disposed against this first surface but before winding on the support and then on the second surface after the realization of the coil.
  • the characteristics of the method of the invention it is possible to dispense with guiding pins external to the manufactured communication device. Then, since the ends do not have to be stretched over the electronic unit as in the prior art, the positioning of the electronic unit relative to the core of the coil, i.e. on the common support to the circuit and to this coil, can be carried out with a wide tolerance.
  • the electronic unit is in particular fixed on its support with the aid of a drop of glue. If a light - AT -
  • substantially vertical surfaces of the electronic unit itself are used to guide and hold the wire taut during the formation of the coil.
  • the contact pads of the electronic unit so that the wire is in contact with them as soon as it is arranged against the first and second substantially vertical surfaces.
  • the wire can be kept taut in this configuration, in particular by means of anchoring pins or mooring pins known to those skilled in the art. Those skilled in the art thus have at their disposal several techniques for welding, or even bonding, the ends of the coil to the respective contact pads of the electronic unit.
  • the invention also relates to a communication device of the type described above and characterized in that the two pads or contact tabs respectively have two substantially vertical surfaces to which the two ends of the coil are respectively fixed.
  • FIG. 1 shows schematically a first embodiment of the method according to the invention
  • FIG. 2 represents a variant of the first mode of implementation of the invention
  • FIG. 3 is a partial section along line IM-III of Figure 2;
  • FIG. 4 schematically shows a second embodiment of the invention
  • FIG. 5 is a partial section along the line V-V of Figure 4.
  • FIGS. 6 and 7 respectively show two variants of the second mode of implementation of the invention.
  • FIG. 8 schematically shows a third mode of implementation of the method according to the invention.
  • FIG. 9 is a partial section along the line IX -IX of Figure 8.
  • FIG. 10 shows a variant combining the second and third modes of implementation of the method of the invention
  • - Figure 11 is a schematic sectional view of a fourth embodiment of the method according to the invention.
  • This device is formed essentially of a coil 4 wound around a support 6, defining a coil core, and an electronic unit 8 fixed on a flat surface 10 of the support.
  • the method comprises the following successive steps:
  • the electronic unit 8 is brought onto the support 6 and fixed thereto; - using a winding installation, bring an electric wire
  • the coil winding 5 is then formed with the electrical wire 12 around the part of the support 6 forming a core;
  • the electric wire 12 is then brought against a second substantially vertical surface 16, defining a second lateral wall of the unit 8 opposite to the side wall 14, so that the electric wire is taut and remains in abutment against this second surface which defines a second lateral contact pad 26;
  • the electrical wire 12 is kept substantially tensioned in the configuration resulting from the aforementioned steps and this wire is fixed to the first and second contact pads 24 and 26, in particular by means of an appropriate welding installation, so as to establish an electrical connection between the coil 4 and the unit 8.
  • the electronic unit 8 is formed for example of an electronic circuit encased by a protective material with external contact pads. It may, however, be formed by an integrated circuit with contact pads or pads at least partially defining vertical surfaces of this unit.
  • the electronic unit 8 fixed on the support core 6 defines a guide element for the electrical wire 12 while allowing the ends 20 and 22 to be arranged during the formation of the coil against the respective contact pads. 24 and 26 of the electronic unit.
  • the electrical wire is kept taut in this configuration by means of anchoring pins, also called pins, around which the wire 12 is wound at the beginning and at the end of the winding operation. The wire can then be cut beyond these pins.
  • anchoring pins also called pins
  • FIG. 2 shows a variant of the method described with reference to FIG. 1.
  • This variant is essentially distinguished by the fact that the support 7 forming the core of the winding 5 has on either side of this core annular walls 28 and 29 which form circular stops defining the zone for the winding 5.
  • the annular wall 28 located on the side of the electronic element has a central groove 30 inside which the electric wire 12 passes.
  • groove 30 serves as guide means for the wire and makes it possible to maintain the ends 20 and 22 of the coil against the lateral contact pads 24 and 26 of the unit 8 before being fixedly connected to this unit. It will be noted that, in this variant, it is possible to produce a communication device 32 in which the ends 20 and 22 do not intersect between the winding 5 and the electronic unit 8.
  • the electronic unit is fixed on the flat surface 10 of the support 7 by means of a glue layer 18.
  • the contact pads 24 and 26 are provided on the side of this layer of adhesive. glue, that is to say at the bottom of the electronic unit so that the electric wire 12 bears against the lateral parts of these contact pads when it is stretched against the side walls 14 and 16 of the unit electronic.
  • glue that is to say at the bottom of the electronic unit so that the electric wire 12 bears against the lateral parts of these contact pads when it is stretched against the side walls 14 and 16 of the unit electronic.
  • substantially vertical surface of the electronic unit there are surfaces which are generally orthogonal to the flat surface of the support on which the electronic unit is attached.
  • an S-profile is included in this definition, as will be apparent hereinafter.
  • the electronic unit 38 is formed of a body comprising at least one electronic circuit and two contact tabs 40 and 42 projecting from this body.
  • the unit 38 is an electronic module of the type SMD (English: Surface Mounting Device).
  • SMD Surface Mounting Device
  • the unit 38 is arranged on a flat surface 10 of the support 7A of the communication device 36 in production.
  • the unit 38 is arranged on the support in a standard configuration with the two tongues 40 and 42 folded downwards in the direction of this support, as is clear from FIG. 5.
  • the inner annular wall 28A of the support 7A presents a guide groove of the electrical wire 12 located at a distance from a central plane perpendicular to the surface 10.
  • the unit 38 is arranged obliquely or in an oblique direction on the support with its central axis substantially oriented towards the 30.
  • Such an arrangement has several advantages. First, it is possible to provide the flat surface 10 at a level below the upper center line of the winding 5. The input and output of the electric wire through a groove 30 located on one side of the device 36, in a projection corresponding to that of Figure 4, and allows to arrange the electronic unit within a geometric cylinder defined substantially by the outer surface of the winding 5.
  • Such an arrangement also allows to easily tension the electrical wire in upstream of the unit 38 in oblique directions while ensuring that the wire is held in abutment against the surfaces substantially 44 and 46 vertical of the two tabs 40 and 42.
  • the support 7A may have a circular end portion or another form without this poses a problem to the manufacturing method according to the invention.
  • an electric wire 12 is brought into a winding installation against the first tongue 40 which has a profile developing at a certain height.
  • the wire is placed against this tongue in contact with a portion thereof defining a substantially vertical surface 44.
  • the tongue 40 has an S-shaped profile and that the wire 12 forming the first end 20 of the coil is arranged in the lower recess of this S-shaped profile; This makes it possible to guarantee its positioning during the formation of the subsequent winding and to prevent it from sliding along the tongue before being fixed by welding thereto.
  • the contact surface with the end 20 defines a cylindrical portion. Such a surface 44 is considered in the present description as being a substantially vertical surface.
  • the contact tab 40 defines a means for guiding the electrical wire between the groove 30 and a point of attachment of this wire in the winding installation. After having formed the winding 5, the electric wire is pulled out by the groove 30 and brought against a part of the second contact tab 42 while holding the wire taut. As described above for the first end, the second end 22 of the coil is thus arranged in a recess of the tongue 42 against a substantially vertical surface 46. The ends 20 and 22 of the coil are held in the configuration resulting from the preceding steps for attaching these ends to the two contact tabs of the electronic unit 38, so as to establish an electrical connection between the coil and these contact tabs.
  • an external guide pin 48 is provided.
  • the use of such a pin is not essential to the method of the invention.
  • the unit 38 itself serves to guide the electrical wire to maintain it against the contact pads of the electronic unit, it is possible to wind directly, at the beginning of the winding process and at the end of this process, the electrical wire around anchoring pins so as to allow this wire to be cut beyond these pins while maintaining the ends 20 and 22 stretched and resting against the tabs 40 and 42 until the fixing of these ends to these tongues using including a suitable welding tool.
  • FIG 6 is shown a section, similar to that of Figure 5, an alternative embodiment of the electronic unit.
  • the contact tabs 4OA and 42A of the unit 38A are folded against two opposite side walls of the body of this unit.
  • the ends of these tongues extend partially under the body of the unit which is fixed to the support 7A by an adhesive layer 18.
  • the two ends 20 and 22 of the coil are easily arranged against the substantially vertical contact surfaces 44 and 46 defined respectively by the two tabs.
  • FIG. 7 is shown another interesting variant for the implementation of the method of the invention.
  • the SMD type module 38 forming the electronic unit of the communication device is fixed on the support 7A in an inverted configuration, with the two contact tabs 44 and 46 folded upwards, that is to say said having a development that moves away from the surface 10 of the support 7A away from the side walls of the body of the unit 38 from which the tabs 40 and 42 come out.
  • the substantially vertical surfaces 44 and 46 against which the wire 12 are held in abutment are defined by respective upper parts of the tongues.
  • the substantially horizontal development of the end of each tongue allows to maintain the position of the ends 20 and 22 against the surfaces 44 and 46, defining the contact pads of the electronic unit for the coil, until their final final fixing.
  • FIGS. 8 and 9 a third embodiment of the method according to the invention will be briefly described below.
  • This embodiment differs from the previous ones essentially in that the electrical wire 12 passes between each tab 4OB, 42B and the body of the electronic unit 38B.
  • the substantially vertical surfaces 44 and 46 against which the ends 20 and 22 are respectively in abutment are located here on the inner side of the tabs which rise vertically upwards relative to the support 7B.
  • the support 7B has two guide grooves 30 and 31 in the annular wall 28B defining the winding 5.
  • a single groove 30 in a central configuration as in Figure 2 is also possible here .
  • the two outer grooves 30 and 31 make it possible to provide the surface 10 at a lower level while allowing the ends 20 and 22 to be arranged substantially horizontally, or even slightly obliquely downwards between the tongues 40B, 42B and the respective grooves. 30, 31.
  • the device 50 after the formation of the coil 4 has an advantageous arrangement for the subsequent step of fixing the ends 20 and 22 to the electronic unit.
  • FIG. 10 is shown an alternative embodiment combining the second and third modes of implementation of the method described above.
  • the electronic unit 38C has an additional tab 54 without electrical function.
  • the unit 38C is arranged in the same configuration as the unit 38 in FIG. 7.
  • the electric wire 12 is brought to the outside of the tongues 40 and 54 so that the end 20 is arranged against an external surface of the tongue 40 as in Figure 7.
  • the electric wire is pulled towards the tongue 42 and this wire is passed behind the S portion of this tongue. It is pressed against an inner surface of this tongue.
  • Unit 38C is arranged obliquely.
  • the configuration provided in FIG. 10 makes it easy to bring and pull out the electric wire 12 on the same side of the support 7B of the device 52 during manufacture.
  • the device 56 in manufacture may have an arrangement similar to that of FIG. 1, 2 or 4.
  • the difference lies in the arrangement of the electronic unit 58.
  • This unit is formed of a box 60 in which a circuit is arranged. electronics and having contact pads on its underside.
  • the module 60 is arranged on a substrate 62 of the PCB type having two contact pads 64 and 66 to which the pads of the module 60 are connected. Horizontal lands 64 and 66 are arranged to extend beyond module 60.
  • Substrate 62 is bonded to support 7C.
  • the electrical wire 12 is arranged against a first side wall 68 of the module 60 which defines an abutment rising on the periphery of a first contact pad 64 of the electronic unit 58. After formation of the winding of the coil, the electric wire is brought against a second side wall 69 of the module 60 opposite the first side wall. The ends 20 and 22 of the coil are thus arranged on the contact pads 64 and 66 during the formation of the coil.
  • the vertical surfaces against which the electrical wire is supported are at least partially defined by the contact pads of the electronic unit. The ends of the coil are thus attached to lateral electrical contact surfaces.
  • the contact pads are horizontal and arranged on a PCB.
  • the side walls of the module 60 against which the electric wire is arranged define stops arranged so that the wire 12 is superimposed on the contact pads of the unit 58 when it bears against these side walls.
  • FIGs 12 to 16 are schematically shown various welding techniques of the ends 20 and 22 of the coil to the pads or contact tongues of the electronic unit of the communication device manufactured in the context of the present invention.
  • Figure 12 schematically shows a thermocompression welding technique.
  • the thermocompression device 72 comprises two branches 73 and 74 which are pressed towards each other so as to effect the welding of the ends of the coil against the lateral contact pads 24 and 26 of the unit 8.
  • Fig. 13 is an electric discharge welding technique.
  • the electric welding device 76 comprises two electrodes 77 and 78 which are brought against the ends 20 and 22 facing the contact pads 24 and 26.
  • FIG. 14 schematically represents a soldering using a soldering iron 80.
  • solder in particular tin, is provided for carrying out the welding.
  • solder may also be provided in the other variants or may be previously deposited on the surface of the contact pads.
  • FIG. 15 schematically represents a welding technique using a jet of hot air 82 directed against the beaches or tongues of contact and the electrical wire by means of a nozzle 84.
  • FIG. 16 schematically represents an attachment of the ends 20 and 22 to the tongues 40 and 42 by a laser beam welding 86.
  • the tongues 40 and 42 may have a surface on the surface layer of solder or a pre-deposited solder paste.

Abstract

The invention relates to a process for manufacturing a communication device (36) formed from an electronic unit (38) placed on a support (7A) and from a coil (4) wound around a core defined by this support. To produce such a communication device automatically, provision is made to use the electronic unit as means for guiding the electrical wire serving to form the coil. The electrical wire is thus pressed against two approximately vertical surfaces of the electronic unit so as to be in contact with respective areas of this unit. In particular, these contact areas are defined by tabs (40, 42) which have a development at the top and against which the electrical wire is pressed. Once the coil has been formed, the ends (20, 22) of the latter are held under tension in the configuration resulting from the winding and are soldered to the contact tabs or areas of the electronic unit. No manual reworking of the ends is required. In addition, the electrical wire does not have to be precisely positioned relative to the electronic unit during winding, given that the wire is simply pressed against lateral parts of the electronic unit.

Description

Procédé de fabrication d'un d ispositif de commun ication du type Method of manufacturing a communication device of the type
RF I DRF I D
Domaine techniqueTechnical area
La présente invention concerne un procédé de fabrication d'un dispositif de communication par ondes électromagnétiques comprenant une bobine formant antenne et une unité électronique munie de deux plages ou languette de contact destinées à recevoir les deux extrémités de la bobine. La présente invention concerne également un dispositif de communication pouvant être obtenu par le procédé de fabrication de l'invention.The present invention relates to a method of manufacturing an electromagnetic wave communication device comprising an antenna coil and an electronic unit provided with two pads or contact tab for receiving both ends of the coil. The present invention also relates to a communication device that can be obtained by the manufacturing method of the invention.
Arrière plan technologiqueTechnological background
On connaît du document US 5,572,410 un procédé de fabrication de transpondeurs formés par une bobine enroulée autour d'un noyau et d'un circuit intégré relié électriquement aux deux extrémités de cette bobine. Dans le cadre de l'enseignement de ce document, il est prévu que le circuit électronique présente deux plages de contact horizontales sur sa face supérieure. Ces plages de contact sont notamment formées par des plots métalliques auxquels les extrémités de la bobine sont fixées par thermocompression. La fixation des extrémités de la bobine aux plages du circuit intégré constitue dans ce document la seule liaison mécanique entre l'ensemble formé par la bobine et le noyau d'une part et le circuit intégré d'autre part. Ce document US 5,572,410 décrit un procédé permettant de réaliser de manière automatique des transpondeurs. Pour ce faire, le circuit électronique est agencé précisément dans un outil de l'installation de bobinage. Cet outil est agencé de manière à permettre de tenir le noyau de la bobine dans une position déterminée relativement au circuit électronique. Sur l'outil de préhension du circuit électronique et du noyau de bobine sont agencées deux goupilles de guidage du fil électrique servant à former la bobine. Il est prévu que le circuit électronique soit précisément positionné dans l'outil relativement aux deux goupilles de guidage de manière à garantir que les extrémités de la bobine dans l'installation de bobinage soient tendues au-dessus des deux plages de contact du circuit électronique pour permettre alors d'établir la liaison électrique par thermocompression. Ce procédé de fabrication est relativement complexe car il est nécessaire d'apporter et de positionner précisément le circuit électronique dans un outil de préhension du noyau de bobine, lequel doit également être saisi précisément par cet outil pour permettre de former la bobine et de relier ses extrémités aux plages du circuit alors que le fil électrique est maintenu tendu au-dessus de l'outil dans la configuration résultante de la formation de l'enroulement de la bobine.Document US Pat. No. 5,572,410 discloses a method of manufacturing transponders formed by a coil wound around a core and an integrated circuit electrically connected to both ends of this coil. As part of the teaching of this document, it is expected that the electronic circuit has two horizontal contact pads on its upper face. These contact pads are in particular formed by metal pads to which the ends of the coil are fixed by thermocompression. Fixing the ends of the coil to the integrated circuit ranges is in this document the only mechanical connection between the assembly formed by the coil and the core on the one hand and the integrated circuit on the other. US 5,572,410 discloses a method for automatically performing transponders. To do this, the circuit electronics is arranged precisely in a tool of the winding installation. This tool is arranged to hold the core of the coil in a specific position relative to the electronic circuit. On the gripping tool of the electronic circuit and the coil core are arranged two pins for guiding the electric wire used to form the coil. It is expected that the electronic circuit is precisely positioned in the tool relative to the two guide pins so as to ensure that the ends of the coil in the winding installation are stretched over the two contact pads of the electronic circuit for allow then to establish the electrical connection by thermocompression. This method of manufacture is relatively complex because it is necessary to bring and precisely position the electronic circuit in a gripping tool of the coil core, which must also be precisely grasped by this tool to allow to form the coil and connect its ends to the circuit pads while the electrical wire is held taut above the tool in the resulting configuration of the formation of the winding of the coil.
Résumé de l'inventionSummary of the invention
La présente invention a pour but un procédé de fabrication simplifié d'un dispositif de communication de type mentionné ci-avant dans le domaine technique de l'invention.The object of the present invention is to provide a simplified method of manufacturing a communication device of the type mentioned above in the technical field of the invention.
L'invention a donc pour objet un procédé de fabrication d'un dispositif de communication par ondes électromagnétiques comprenant une bobine formant antenne et une unité électronique munie de deux plages ou languette de contact destinées à recevoir les deux extrémités de la bobine, ce procédé étant caractérisé par les étapes suivantes :The subject of the invention is therefore a method for manufacturing an electromagnetic wave communication device comprising an antenna coil and an electronic unit provided with two contact strips or tongues intended to receive the two ends of the coil, this method being characterized by the following steps:
- On fixe l'unité électronique sur un support autour duquel il est prévu de réaliser l'enroulement de la bobine, - On apporte un fil électrique contre une première surface sensiblement verticale d'une première partie de l'unité électronique de manière que ce fil soit tendu et demeure en appui contre cette première surface, laquelle définit soit une première plage de contact de ladite unité électronique, soit une première butée s'élevant en périphérie d'une première plage de contact de cette unité électronique,- The electronic unit is fixed on a support around which it is intended to carry out the winding of the coil, - An electric wire is brought against a first substantially vertical surface of a first portion of the electronic unit so that the wire is taut and remains in abutment against this first surface, which defines either a first contact area of said electronic unit , a first stop rising on the periphery of a first contact pad of this electronic unit,
- on forme avec le fil électrique ledit enroulement autour dudit noyau, - on apporte le fil électrique contre une deuxième surface sensiblement verticale d'une deuxième partie de ladite unité électronique de manière que ce fil électrique soit tendu et demeure en appui contre cette deuxième surface, laquelle définit soit une deuxième plage de contact de l'unité électronique, soit une deuxième butée s'élevant en périphérie d'une deuxième plage de contact de cette unité électronique,the said winding is formed with the electric wire around the said core, the electric wire is brought against a second substantially vertical surface of a second portion of the said electronic unit so that the electric wire is stretched and remains in abutment against this second surface; which defines either a second contact pad of the electronic unit or a second stop rising on the periphery of a second contact pad of this electronic unit,
- on maintient le fil électrique sensiblement tendu dans la configuration résultant des étapes précédentes et on fixe ce fil électrique auxdites première et deuxième plages de contact de l'unité électronique de manière à établir une connexion électrique entre la bobine et cette unité électronique.the electrical wire is maintained substantially tensioned in the configuration resulting from the preceding steps and this wire is fixed to said first and second contact pads of the electronic unit so as to establish an electrical connection between the coil and this electronic unit.
Avantageusement la fixation du fil électrique se fera après la réalisation de la bobine, bien qu'il soit aussi envisageable, dans le cadre de la présente invention, de le fixer sur la première surface après qu'il ait été disposé contre cette première surface mais avant son enroulement sur le support puis sur la deuxième surface après la réalisation de la bobine.Advantageously, the fixing of the electric wire will be done after the production of the coil, although it is also conceivable, in the context of the present invention, to fix it on the first surface after it has been disposed against this first surface but before winding on the support and then on the second surface after the realization of the coil.
Grâce aux caractéristiques du procédé de l'invention, il est possible de s'affranchir de goupilles de guidage externes au dispositif de communication fabriqué. Ensuite, étant donné que les extrémités ne doivent plus être tendues au-dessus de l'unité électronique comme dans l'art antérieur, le positionnement de l'unité électronique relativement au noyau de la bobine, c'est-à-dire sur le support commun au circuit et à cette bobine, peut être effectué avec une large tolérance. L'unité électronique est notamment fixée sur son support à l'aide d'une goutte de colle. Si un léger - A -Thanks to the characteristics of the method of the invention, it is possible to dispense with guiding pins external to the manufactured communication device. Then, since the ends do not have to be stretched over the electronic unit as in the prior art, the positioning of the electronic unit relative to the core of the coil, i.e. on the common support to the circuit and to this coil, can be carried out with a wide tolerance. The electronic unit is in particular fixed on its support with the aid of a drop of glue. If a light - AT -
déplacement de l'unité électronique intervient avant que la colle soit entièrement solidifiée, ceci n'aura pas d'influence sur l'efficacité du procédé de fabrication étant donné que l'unité électronique sert elle-même de guide pour le fil électrique servant à former la bobine. On utilise ainsi des surfaces sensiblement verticales de l'unité électronique elle-même pour guider et maintenir tendu le fil lors de la formation de la bobine. Par le fait qu'il est prévu selon l'invention d'agencer les plages de contact de l'unité électronique de manière que le fil soit en contact avec celles-ci dès qu'il est agencé contre les première et deuxième surfaces sensiblement verticales de cette unité électronique, on peut réaliser ensuite la connexion électrique directement dans la configuration du fil dans l'installation de bobinage notamment à l'aide de diverses techniques de soudage ou de brasage. Le fil peut être maintenu tendu dans cette configuration notamment à l'aide de goupilles d'ancrage ou d'amarrage connues de l'homme du métier. L'homme du métier a ainsi à sa disposition plusieurs techniques de soudage, voire de collage, des extrémités de la bobine aux plages de contact respectives de l'unité électronique.movement of the electronic unit occurs before the glue is fully solidified, this will have no influence on the efficiency of the manufacturing process since the electronic unit itself serves as a guide for the electric wire used to form the coil. Thus, substantially vertical surfaces of the electronic unit itself are used to guide and hold the wire taut during the formation of the coil. In that it is intended according to the invention to arrange the contact pads of the electronic unit so that the wire is in contact with them as soon as it is arranged against the first and second substantially vertical surfaces. of this electronic unit, one can then perform the electrical connection directly in the configuration of the wire in the winding installation including using various welding or soldering techniques. The wire can be kept taut in this configuration, in particular by means of anchoring pins or mooring pins known to those skilled in the art. Those skilled in the art thus have at their disposal several techniques for welding, or even bonding, the ends of the coil to the respective contact pads of the electronic unit.
L'invention a également pour objet un dispositif de communication du type décrit précédemment et caractérisé par le fait que les deux plages ou languettes de contact présentent respectivement deux surfaces sensiblement verticales auxquelles les deux extrémités de la bobine sont respectivement fixées.The invention also relates to a communication device of the type described above and characterized in that the two pads or contact tabs respectively have two substantially vertical surfaces to which the two ends of the coil are respectively fixed.
Description sommaire des dessins Divers modes de mise en œuvre du procédé de fabrication d'un dispositif de communication selon l'invention ainsi que les dispositifs de communication résultant seront décrits en détail ci-après en référence aux dessins, donnés à titre d'exemples nullement limitatifs, dans lesquels :Brief Description of the Drawings Various modes of implementation of the method of manufacturing a communication device according to the invention as well as the resulting communication devices will be described in detail below with reference to the drawings, given by way of examples in no way in which:
- la figure 1 montre schématiquement un premier mode de mise en œuvre du procédé selon l'invention; - la figure 2 représente une variante du premier mode de mise en œuvre de l'invention;- Figure 1 shows schematically a first embodiment of the method according to the invention; FIG. 2 represents a variant of the first mode of implementation of the invention;
- la figure 3 est une coupe partielle selon la ligne IM-III de la figure 2;- Figure 3 is a partial section along line IM-III of Figure 2;
- la figure 4 montre schématiquement un deuxième mode de mise en œuvre de l'invention;FIG. 4 schematically shows a second embodiment of the invention;
- la figure 5 est une coupe partielle selon la ligne V-V de la figure 4;- Figure 5 is a partial section along the line V-V of Figure 4;
- les figures 6 et 7 montrent respectivement deux variantes du deuxième mode de mise en œuvre de l'invention;FIGS. 6 and 7 respectively show two variants of the second mode of implementation of the invention;
- la figure 8 montre schématiquement un troisième mode de mise en œuvre du procédé selon l'invention;FIG. 8 schematically shows a third mode of implementation of the method according to the invention;
- la figure 9 est une coupe partielle selon la ligne IX -IX de la figure 8;- Figure 9 is a partial section along the line IX -IX of Figure 8;
- la figure 10 montre une variante combinant les deuxième et troisième modes de mise en œuvre du procédé de l'invention; - la figure 11 est une vue schématique en coupe d'un quatrième mode de mise en œuvre du procédé selon l'invention;FIG. 10 shows a variant combining the second and third modes of implementation of the method of the invention; - Figure 11 is a schematic sectional view of a fourth embodiment of the method according to the invention;
- les figures 12 à 16 montrent schématiquement diverses techniques possibles pour souder les extrémités de la bobine à l'unité électronique dans le cadre du procédé de la présente invention.- Figures 12 to 16 show schematically various possible techniques for welding the ends of the coil to the electronic unit in the context of the method of the present invention.
Description détailléedetailed description
A l'aide de la figure 1 on décrira ci-après un premier mode de mise en œuvre général du procédé de fabrication d'un dispositif de communication 2 selon l'invention. Ce dispositif est formé essentiellement d'une bobine 4 enroulée autour d'un support 6, définissant un noyau de bobine, et d'une unité électronique 8 fixée sur une surface plane 10 du support.With the help of Figure 1 will be described hereinafter a first general implementation of the method of manufacturing a communication device 2 according to the invention. This device is formed essentially of a coil 4 wound around a support 6, defining a coil core, and an electronic unit 8 fixed on a flat surface 10 of the support.
Le procédé comprend les étapes successives suivantes :The method comprises the following successive steps:
- on apporte l'unité électronique 8 sur le support 6 et on la fixe à celui-ci; - à l'aide d'une installation de bobinage, on apporte un fil électriquethe electronic unit 8 is brought onto the support 6 and fixed thereto; - using a winding installation, bring an electric wire
12 contre une première surface sensiblement verticale 14, définissant une première paroi latérale de l'unité 8, de manière que ce fil soit tendu et demeure en appui contre cette première surface qui définit une première plage de contact latérale 24;12 against a first substantially vertical surface 14, defining a first side wall of the unit 8, so that the wire is taut and remains in abutment against this first surface which defines a first lateral contact area 24;
- on forme ensuite avec le fil électrique 12 l'enroulement 5 de la bobine autour de la partie du support 6 formant un noyau;the coil winding 5 is then formed with the electrical wire 12 around the part of the support 6 forming a core;
- on apporte ensuite le fil électrique 12 contre une deuxième surface sensiblement verticale 16, définissant une deuxième paroi latérale de l'unité 8 opposée à la paroi latérale 14, de manière que le fil électrique soit tendu et demeure en appui contre cette deuxième surface qui définit une deuxième plage de contact latérale 26;the electric wire 12 is then brought against a second substantially vertical surface 16, defining a second lateral wall of the unit 8 opposite to the side wall 14, so that the electric wire is taut and remains in abutment against this second surface which defines a second lateral contact pad 26;
- on maintient le fil électrique 12 sensiblement tendu dans la configuration résultant des étapes susmentionnées et on fixe ce fil électrique aux première et deuxième plages de contact 24 et 26, notamment à l'aide d'une installation de soudage appropriée, de manière à établir une connexion électrique entre la bobine 4 et l'unité 8.the electrical wire 12 is kept substantially tensioned in the configuration resulting from the aforementioned steps and this wire is fixed to the first and second contact pads 24 and 26, in particular by means of an appropriate welding installation, so as to establish an electrical connection between the coil 4 and the unit 8.
L'unité électronique 8 est formée par exemple d'un circuit électronique enrobé par un matériau de protection avec des plages de contact externes. Elle peut cependant être formée par un circuit intégré avec des plages ou plots de contact définissant au moins partiellement des surfaces verticales de cette unité.The electronic unit 8 is formed for example of an electronic circuit encased by a protective material with external contact pads. It may, however, be formed by an integrated circuit with contact pads or pads at least partially defining vertical surfaces of this unit.
On observe ainsi que l'unité électronique 8 fixée sur le noyau- support 6 définit un élément de guidage pour le fil électrique 12 tout en permettant d'agencer lors de la formation de la bobine ses extrémités 20 et 22 contre les plages de contact respectives 24 et 26 de l'unité électronique. Ceci permet aisément de relier électriquement la bobine à l'unité électronique en maintenant simplement le fil électrique 12 tendu dans la configuration résultant de la formation de la bobine dans l'installation prévue à cet effet. Le fil électrique est notamment maintenu tendu dans cette configuration au moyen de goupilles d'ancrage, nommées également picots, autour desquelles le fil 12 est enroulé au début et à la fin de l'opération de bobinage. Le fil peut ensuite être sectionné au-delà de ces picots. Ceci permet de transférer aisément le dispositif 2 en formation dans une installation de soudage des extrémités de la bobine à l'unité électronique. On peut dans une autre variante envisager de laisser le dispositif en formation dans l'installation de bobinage et prévoir un dispositif de soudage dans cette installation pour effectuer la connexion électrique entre la bobine et l'unité électronique. Diverses possibilités d'effectuer cette connexion électrique seront décrites brièvement à la fin de la présente description.It is thus observed that the electronic unit 8 fixed on the support core 6 defines a guide element for the electrical wire 12 while allowing the ends 20 and 22 to be arranged during the formation of the coil against the respective contact pads. 24 and 26 of the electronic unit. This makes it easy to electrically connect the coil to the electronic unit simply by keeping the electrical wire 12 taut in the configuration resulting from the formation of the coil in the installation provided for this purpose. In particular, the electrical wire is kept taut in this configuration by means of anchoring pins, also called pins, around which the wire 12 is wound at the beginning and at the end of the winding operation. The wire can then be cut beyond these pins. This makes it easy to transfer the device 2 in formation in a welding installation from the ends of the coil to the electronic unit. In another variant, it is possible to envisage leaving the device in formation in the winding installation and to provide a welding device in this installation for making the electrical connection between the coil and the electronic unit. Various possibilities of making this electrical connection will be briefly described at the end of this description.
A la figure 2 est représentée une variante du procédé décrit à l'aide de la figure 1. Cette variante se distingue essentiellement par le fait que le support 7 formant le noyau de l'enroulement 5 présente de part et d'autre de ce noyau des parois annulaires 28 et 29 qui forment des butées circulaires délimitant la zone pour l'enroulement 5. La paroi annulaire 28 située du côté de l'élément électronique présente une gorge centrale 30 à l'intérieur de laquelle passe le fil électrique 12. Cette gorge 30 sert de moyen de guidage pour le fil et permet d'assurer le maintien des extrémités 20 et 22 de la bobine contre les plages de contact latérales 24 et 26 de l'unité 8 avant de les relier fixement à cette unité. On remarquera que, dans cette variante, il est possible de réaliser un dispositif de communication 32 dans lequel les extrémités 20 et 22 ne se croisent pas entre l'enroulement 5 et l'unité électronique 8.FIG. 2 shows a variant of the method described with reference to FIG. 1. This variant is essentially distinguished by the fact that the support 7 forming the core of the winding 5 has on either side of this core annular walls 28 and 29 which form circular stops defining the zone for the winding 5. The annular wall 28 located on the side of the electronic element has a central groove 30 inside which the electric wire 12 passes. groove 30 serves as guide means for the wire and makes it possible to maintain the ends 20 and 22 of the coil against the lateral contact pads 24 and 26 of the unit 8 before being fixedly connected to this unit. It will be noted that, in this variant, it is possible to produce a communication device 32 in which the ends 20 and 22 do not intersect between the winding 5 and the electronic unit 8.
Sur la coupe de la figure 3, on observe que l'unité électronique est fixée sur la surface plane 10 du support 7 au moyen d'une couche de colle 18. Les plages de contact 24 et 26 sont prévues du côté de cette couche de colle, c'est-à-dire en bas de l'unité électronique pour que le fil électrique 12 soit en appui contre les parties latérales de ces plages de contact lorsqu'il est tendu contre les parois latérales 14 et 16 de l'unité électronique. Par surface sensiblement verticale de l'unité électronique, on comprend des surfaces qui sont globalement orthogonales à la surface plane 10 du support sur laquelle l'unité électronique est fixée. Ainsi un profil en S est par exemple compris dans cette définition, comme cela ressortira ci-après.On the section of FIG. 3, it is observed that the electronic unit is fixed on the flat surface 10 of the support 7 by means of a glue layer 18. The contact pads 24 and 26 are provided on the side of this layer of adhesive. glue, that is to say at the bottom of the electronic unit so that the electric wire 12 bears against the lateral parts of these contact pads when it is stretched against the side walls 14 and 16 of the unit electronic. By substantially vertical surface of the electronic unit, there are surfaces which are generally orthogonal to the flat surface of the support on which the electronic unit is attached. Thus, for example, an S-profile is included in this definition, as will be apparent hereinafter.
A l'aide des figures 4 et 5 on décrira ci-après un deuxième mode de mise en œuvre du procédé de fabrication selon l'invention. Le procédé et les divers éléments intervenant ne seront pas décrits ici à nouveau en détail. Ce deuxième mode de mise en œuvre se distingue premièrement par le fait que l'unité électronique 38 est formée d'un corps comprenant au moins un circuit électronique et de deux languettes de contact 40 et 42 faisant saillie de ce corps. L'unité 38 est un module électronique du type SMD (de l'anglais : Surface Mounting Device). L'unité 38 est agencée sur une surface plane 10 du support 7A du dispositif de communication 36 en fabrication. L'unité 38 est agencée sur le support dans une configuration standard avec les deux languettes 40 et 42 pliées vers le bas en direction de ce support, comme cela ressort clairement à la figure 5. Ensuite, la paroi annulaire intérieure 28A du support 7A présente une gorge de guidage du fil électrique 12 située à une certaine distance d'un plan central perpendiculaire à la surface 10. L'unité 38 est agencée de biais ou selon une direction oblique sur le support avec son axe central sensiblement orienté en direction de la gorge 30. Un tel agencement présente plusieurs avantages. Premièrement, il est possible de prévoir la surface plane 10 à un niveau inférieur à la ligne centrale supérieure de l'enroulement 5. L'entrée et la sortie du fil électrique par une gorge 30 située sur un côté du dispositif 36, dans une projection correspondant à celle de la figure 4, permet ainsi d'agencer l'unité électronique à l'intérieur d'un cylindre géométrique défini sensiblement par la surface extérieure de l'enroulement 5. Un tel agencement permet aussi de tendre aisément le fil électrique en amont de l'unité 38 selon des directions obliques tout en assurant que ce fil soit maintenu en appui contre les surfaces sensiblement verticales 44 et 46 des deux languettes 40 et 42. Ainsi le support 7A peut présenter une partie terminale circulaire ou d'une autre forme sans que cela pose un problème au procédé de fabrication selon l'invention.With the help of Figures 4 and 5 will be described hereinafter a second embodiment of the manufacturing method according to the invention. The process and the various intervening elements will not be described here again in detail. This second embodiment is distinguished firstly by the fact that the electronic unit 38 is formed of a body comprising at least one electronic circuit and two contact tabs 40 and 42 projecting from this body. The unit 38 is an electronic module of the type SMD (English: Surface Mounting Device). The unit 38 is arranged on a flat surface 10 of the support 7A of the communication device 36 in production. The unit 38 is arranged on the support in a standard configuration with the two tongues 40 and 42 folded downwards in the direction of this support, as is clear from FIG. 5. Then, the inner annular wall 28A of the support 7A presents a guide groove of the electrical wire 12 located at a distance from a central plane perpendicular to the surface 10. The unit 38 is arranged obliquely or in an oblique direction on the support with its central axis substantially oriented towards the 30. Such an arrangement has several advantages. First, it is possible to provide the flat surface 10 at a level below the upper center line of the winding 5. The input and output of the electric wire through a groove 30 located on one side of the device 36, in a projection corresponding to that of Figure 4, and allows to arrange the electronic unit within a geometric cylinder defined substantially by the outer surface of the winding 5. Such an arrangement also allows to easily tension the electrical wire in upstream of the unit 38 in oblique directions while ensuring that the wire is held in abutment against the surfaces substantially 44 and 46 vertical of the two tabs 40 and 42. Thus the support 7A may have a circular end portion or another form without this poses a problem to the manufacturing method according to the invention.
Après avoir fixé le module SMD 38 sur le support 7A, un fil électrique 12 est apporté dans une installation de bobinage contre la première languette 40 qui présente un profil se développant sur une certaine hauteur. Le fil est placé contre cette languette en contact avec une partie de celle-ci définissant une surface 44 sensiblement verticale. De fait, on observe à la figure 5 que la languette 40 présente un profil en S et que le fil 12 formant la première extrémité 20 de la bobine est agencé dans le creux inférieur de ce profil en S; ce qui permet de garantir son positionnement au cours de la formation de l'enroulement 5 ultérieur et d'éviter qu'il glisse le long de la languette avant d'être fixé par soudage à celle-ci. On notera que la surface de contact avec l'extrémité 20 définit une portion cylindrique. Une telle surface 44 est considérée dans la présente description comme étant une surface sensiblement verticale. Par sensiblement vertical, il faut donc comprendre une surface présentant un certain développement en hauteur relativement à la surface 10 sur laquelle l'unité 38 est fixée. La languette de contact 40 définit un moyen de guidage du fil électrique entre la gorge 30 et un point d'attache de ce fil dans l'installation de bobinage. Après avoir formé l'enroulement 5, on sort le fil électrique par la gorge 30 et on l'apporte contre une partie de la deuxième languette de contact 42 en maintenant le fil tendu. Comme décrit précédemment pour la première extrémité, la deuxième extrémité 22 de la bobine est ainsi agencée dans un creux de la languette 42 contre une surface sensiblement verticale 46. On maintient les extrémités 20 et 22 de la bobine dans la configuration résultant des étapes précédentes pour fixer ces extrémités aux deux languettes de contact de l'unité électronique 38, de manière à établir une connexion électrique entre la bobine et ces languettes de contact. On remarquera qu'à la figure 4 une goupille de guidage externe 48 est prévue. L'utilisation d'une telle goupille n'est pas indispensable au procédé de l'invention. Par ailleurs, il est possible d'utiliser deux goupilles de guidage au lieu d'une seule. Comme l'unité 38 sert elle-même au guidage du fil électrique pour le maintenir contre les plages de contact de l'unité électronique, il est possible d'enrouler directement, au début du procédé de bobinage et à la fin de ce procédé, le fil électrique autour de goupilles d'ancrage de manière à permettre de sectionner ce fil au-delà de ces goupilles tout en maintenant les extrémités 20 et 22 tendues et en appui contre les languettes 40 et 42 jusqu'à la fixation de ces extrémités à ces languettes à l'aide notamment d'un outil de soudage approprié.After fixing the SMD module 38 on the support 7A, an electric wire 12 is brought into a winding installation against the first tongue 40 which has a profile developing at a certain height. The wire is placed against this tongue in contact with a portion thereof defining a substantially vertical surface 44. In fact, it is observed in FIG. 5 that the tongue 40 has an S-shaped profile and that the wire 12 forming the first end 20 of the coil is arranged in the lower recess of this S-shaped profile; This makes it possible to guarantee its positioning during the formation of the subsequent winding and to prevent it from sliding along the tongue before being fixed by welding thereto. It will be noted that the contact surface with the end 20 defines a cylindrical portion. Such a surface 44 is considered in the present description as being a substantially vertical surface. By substantially vertical, it is therefore necessary to understand a surface having a certain development in height relative to the surface 10 on which the unit 38 is fixed. The contact tab 40 defines a means for guiding the electrical wire between the groove 30 and a point of attachment of this wire in the winding installation. After having formed the winding 5, the electric wire is pulled out by the groove 30 and brought against a part of the second contact tab 42 while holding the wire taut. As described above for the first end, the second end 22 of the coil is thus arranged in a recess of the tongue 42 against a substantially vertical surface 46. The ends 20 and 22 of the coil are held in the configuration resulting from the preceding steps for attaching these ends to the two contact tabs of the electronic unit 38, so as to establish an electrical connection between the coil and these contact tabs. Note that in Figure 4 an external guide pin 48 is provided. The use of such a pin is not essential to the method of the invention. In addition, it is possible to use two guide pins instead of one. As the unit 38 itself serves to guide the electrical wire to maintain it against the contact pads of the electronic unit, it is possible to wind directly, at the beginning of the winding process and at the end of this process, the electrical wire around anchoring pins so as to allow this wire to be cut beyond these pins while maintaining the ends 20 and 22 stretched and resting against the tabs 40 and 42 until the fixing of these ends to these tongues using including a suitable welding tool.
A la figure 6 est représentée une coupe, similaire à celle de la figure 5, d'une variante de réalisation de l'unité électronique. Les languettes de contact 4OA et 42A de l'unité 38A sont rabattues contre deux parois latérales opposées du corps de cette unité. Les extrémités de ces languettes s'étendent partiellement sous le corps de l'unité qui est fixée au support 7A par une couche de colle 18. Les deux extrémités 20 et 22 de la bobine sont aisément agencées contre les surfaces de contact sensiblement verticales 44 et 46 définies respectivement par les deux languettes.In Figure 6 is shown a section, similar to that of Figure 5, an alternative embodiment of the electronic unit. The contact tabs 4OA and 42A of the unit 38A are folded against two opposite side walls of the body of this unit. The ends of these tongues extend partially under the body of the unit which is fixed to the support 7A by an adhesive layer 18. The two ends 20 and 22 of the coil are easily arranged against the substantially vertical contact surfaces 44 and 46 defined respectively by the two tabs.
A la figure 7 est représentée une autre variante intéressante pour la mise en œuvre du procédé de l'invention. Dans cette variante, le module du type SMD 38 formant l'unité électronique du dispositif de communication est fixé sur le support 7A dans une configuration retournée, avec les deux languettes de contact 44 et 46 pliées vers le haut, c'est-à-dire présentant un développement qui s'éloigne de la surface 10 du support 7A en s'éloignant des parois latérales du corps de l'unité 38 d'où sortent les languettes 40 et 42. Les surfaces sensiblement verticales 44 et 46 contre lesquelles le fil électrique 12 est maintenu en appui sont définies par des parties supérieures respectives des languettes. Le développement sensiblement horizontal de l'extrémité de chaque languette permet d'assurer le maintien en position des extrémités 20 et 22 contre les surfaces 44 et 46, définissant les plages de contact de l'unité électronique pour la bobine, jusqu'à leur fixation définitive ultérieure.In Figure 7 is shown another interesting variant for the implementation of the method of the invention. In this variant, the SMD type module 38 forming the electronic unit of the communication device is fixed on the support 7A in an inverted configuration, with the two contact tabs 44 and 46 folded upwards, that is to say said having a development that moves away from the surface 10 of the support 7A away from the side walls of the body of the unit 38 from which the tabs 40 and 42 come out. The substantially vertical surfaces 44 and 46 against which the wire 12 are held in abutment are defined by respective upper parts of the tongues. The substantially horizontal development of the end of each tongue allows to maintain the position of the ends 20 and 22 against the surfaces 44 and 46, defining the contact pads of the electronic unit for the coil, until their final final fixing.
A l'aide des figures 8 et 9, on décrira brièvement ci-après un troisième mode de mise en œuvre du procédé selon l'invention. Ce mode de mise en œuvre se distingue des précédents essentiellement par le fait que le fil électrique 12 passe entre chaque languette 4OB, 42B et le corps de l'unité électronique 38B. Les surfaces sensiblement verticales 44 et 46 contre lesquelles les extrémités 20 et 22 sont respectivement en appui sont situées ici du côté intérieur des languettes qui s'élèvent verticalement vers le haut relativement au support 7B. Ceci permet d'agencer l'unité 38B avec une orientation alignée sur l'axe longitudinal du support 7B et d'entrer ou de sortir avec le fil électrique 12 du côté de la languette 44, respectivement 46. Ceci permet d'éviter tout croisement du fil 12. Avantageusement, le support 7B présente deux gorges de guidage 30 et 31 dans la paroi annulaire 28B délimitant l'enroulement 5. On remarquera toutefois qu'une seule gorge 30 dans une configuration centrale comme à la figure 2 est également envisageable ici. Cependant, les deux gorges externes 30 et 31 permettent de prévoir la surface 10 à un niveau inférieur tout en permettant aux extrémités 20 et 22 d'être agencées sensiblement horizontalement, voire légèrement obliquement vers le bas entre les languettes 4OB, 42B et les gorges respectives 30, 31. On remarquera que, dans une variante, il est possible de prendre le module SMD 38 agencé dans la configuration de la figure 7 pour mettre en œuvre ce troisième mode du procédé. Le dispositif 50 après la formation de la bobine 4 présente un agencement avantageux pour l'étape ultérieure de fixation des extrémités 20 et 22 à l'unité électronique.With the aid of FIGS. 8 and 9, a third embodiment of the method according to the invention will be briefly described below. This embodiment differs from the previous ones essentially in that the electrical wire 12 passes between each tab 4OB, 42B and the body of the electronic unit 38B. The substantially vertical surfaces 44 and 46 against which the ends 20 and 22 are respectively in abutment are located here on the inner side of the tabs which rise vertically upwards relative to the support 7B. This makes it possible to arrange the unit 38B with an orientation aligned on the longitudinal axis of the support 7B and to enter or exit with the electrical wire 12 on the side of the tongue 44, respectively 46. This makes it possible to avoid any crossover. Advantageously, the support 7B has two guide grooves 30 and 31 in the annular wall 28B defining the winding 5. Note however that a single groove 30 in a central configuration as in Figure 2 is also possible here . However, the two outer grooves 30 and 31 make it possible to provide the surface 10 at a lower level while allowing the ends 20 and 22 to be arranged substantially horizontally, or even slightly obliquely downwards between the tongues 40B, 42B and the respective grooves. 30, 31. It will be noted that, in a variant, it is possible to take the SMD module 38 arranged in the configuration of FIG. 7 to implement this third mode of the method. The device 50 after the formation of the coil 4 has an advantageous arrangement for the subsequent step of fixing the ends 20 and 22 to the electronic unit.
On remarquera qu'aux figures 7 et 9 le plan horizontal médian de contact des extrémités 20 et 22 respectivement avec les surfaces 44 et 46 est plus haut et distant de la surface 10 sur laquelle l'unité 38 est fixée.It will be noted that in FIGS. 7 and 9 the horizontal median contact plane of the ends 20 and 22 respectively with the surfaces 44 and 46 is higher and remote from the surface 10 on which the unit 38 is fixed.
Ceci facilitera la réalisation de la connexion avec un apport thermique (soudure ou brasure) en réduisant l'effet thermique sur la surface 10 du support et le collage 18 de l'unité électronique.This will facilitate the realization of the connection with a thermal contribution (solder or solder) by reducing the thermal effect on the surface of the support and the bonding 18 of the electronic unit.
A la figure 10 est représentée une variante de réalisation combinant les deuxième et troisième modes de mise en œuvre du procédé décrit ci- avant. L'unité électronique 38C comporte une languette supplémentaire 54 sans fonction électrique. L'unité 38C est agencée dans la même configuration que l'unité 38 à la figure 7. Le fil électrique 12 est apporté à l'extérieur des languettes 40 et 54 de manière que l'extrémité 20 soit agencée contre une surface externe de la languette 40 comme à la figure 7. Après formation de l'enroulement 5, le fil électrique est tiré en direction de la languette 42 et ce fil est passé derrière la partie en S de cette languette. Il est donc appuyé contre une surface interne de cette languette. L'unité 38C est agencée obliquement. La configuration prévue à la figure 10 permet aisément d'amener et de sortir le fil électrique 12 d'un même côté du support 7B du dispositif 52 en fabrication.In Figure 10 is shown an alternative embodiment combining the second and third modes of implementation of the method described above. The electronic unit 38C has an additional tab 54 without electrical function. The unit 38C is arranged in the same configuration as the unit 38 in FIG. 7. The electric wire 12 is brought to the outside of the tongues 40 and 54 so that the end 20 is arranged against an external surface of the tongue 40 as in Figure 7. After forming the winding 5, the electric wire is pulled towards the tongue 42 and this wire is passed behind the S portion of this tongue. It is pressed against an inner surface of this tongue. Unit 38C is arranged obliquely. The configuration provided in FIG. 10 makes it easy to bring and pull out the electric wire 12 on the same side of the support 7B of the device 52 during manufacture.
A l'aide de la coupe de la figure 11 , on décrira ci-après brièvement un quatrième mode de mise en œuvre du procédé de l'invention. Le dispositif 56 en fabrication peut présenter un arrangement similaire à celui de la figure 1 , 2 ou 4. La différence réside dans l'agencement de l'unité électronique 58. Cette unité est formée d'un boitier 60 dans lequel est agencé un circuit électronique et présentant des plots de contact sur sa face inférieure. Le module 60 est agencé sur un substrat 62 du type PCB présentant deux plages de contact 64 et 66 auxquelles les plots du module 60 sont connectés. Les plages horizontales 64 et 66 sont agencées de manière à s'étendre au-delà du module 60. Le substrat 62 est collé sur le support 7C. Le fil électrique 12 est agencé contre une première paroi latérale 68 du module 60 qui définit une butée s'élevant à la périphérie d'une première plage de contact 64 de l'unité électronique 58. Après formation de l'enroulement de la bobine, le fil électrique est apporté contre une deuxième paroi latérale 69 du module 60 opposée à la première paroi latérale. Les extrémités 20 et 22 de la bobine sont ainsi agencées sur les plages de contact 64 et 66 lors de la formation de la bobine. Dans les modes de mise en œuvre précédents, les surfaces verticales contre lesquelles le fil électrique est en appui sont définies au moins partiellement par les plages de contact de l'unité électronique. Les extrémités de la bobine sont ainsi fixées à des surfaces de contact électrique latérales. Par contre, dans le cas de la figure 11 , les plages de contact sont horizontales et agencées sur un PCB. Les parois latérales du module 60 contre lesquelles le fil électrique est agencé définissent des butées agencées de manière que le fil 12 soit superposé aux plages de contact de l'unité 58 lorsqu'il est en appui contre ces parois latérales.With the aid of the section of FIG. 11, a fourth embodiment of the method of the invention will be briefly described below. The device 56 in manufacture may have an arrangement similar to that of FIG. 1, 2 or 4. The difference lies in the arrangement of the electronic unit 58. This unit is formed of a box 60 in which a circuit is arranged. electronics and having contact pads on its underside. The module 60 is arranged on a substrate 62 of the PCB type having two contact pads 64 and 66 to which the pads of the module 60 are connected. Horizontal lands 64 and 66 are arranged to extend beyond module 60. Substrate 62 is bonded to support 7C. The electrical wire 12 is arranged against a first side wall 68 of the module 60 which defines an abutment rising on the periphery of a first contact pad 64 of the electronic unit 58. After formation of the winding of the coil, the electric wire is brought against a second side wall 69 of the module 60 opposite the first side wall. The ends 20 and 22 of the coil are thus arranged on the contact pads 64 and 66 during the formation of the coil. In the preceding embodiments, the vertical surfaces against which the electrical wire is supported are at least partially defined by the contact pads of the electronic unit. The ends of the coil are thus attached to lateral electrical contact surfaces. On the other hand, in the case of FIG. 11, the contact pads are horizontal and arranged on a PCB. The side walls of the module 60 against which the electric wire is arranged define stops arranged so that the wire 12 is superimposed on the contact pads of the unit 58 when it bears against these side walls.
Aux figures 12 à 16 sont représentées schématiquement diverses techniques de soudage des extrémités 20 et 22 de la bobine aux plages ou languettes de contact de l'unité électronique du dispositif de communication fabriqué dans le cadre de la présente invention. La figure 12 présente schématiquement une technique de soudage par thermocompression. Le dispositif de thermocompression 72 comprend deux branches 73 et 74 qui sont pressées l'une en direction de l'autre de manière à effectuer le soudage des extrémités de la bobine contre les plages de contact latérales 24 et 26 de l'unité 8. A la figure 13 est représentée une technique de soudage par décharge électrique. Le dispositif de soudage électrique 76 comprend deux électrodes 77 et 78 qui sont apportées contre les extrémités 20 et 22 en regard des plages de contact 24 et 26.In Figures 12 to 16 are schematically shown various welding techniques of the ends 20 and 22 of the coil to the pads or contact tongues of the electronic unit of the communication device manufactured in the context of the present invention. Figure 12 schematically shows a thermocompression welding technique. The thermocompression device 72 comprises two branches 73 and 74 which are pressed towards each other so as to effect the welding of the ends of the coil against the lateral contact pads 24 and 26 of the unit 8. Fig. 13 is an electric discharge welding technique. The electric welding device 76 comprises two electrodes 77 and 78 which are brought against the ends 20 and 22 facing the contact pads 24 and 26.
La figure 14 représente schématiquement un soudage à l'aide d'un fer à souder 80. En particulier dans cette variante, un apport de brasure, notamment de l'étain, est prévu pour effectuer le soudage. Une telle brasure peut également être apportée dans les autres variantes ou être préalablement déposée à la surface des plages de contact.FIG. 14 schematically represents a soldering using a soldering iron 80. In particular in this variant, an addition of solder, in particular tin, is provided for carrying out the welding. Such solder may also be provided in the other variants or may be previously deposited on the surface of the contact pads.
La figure 15 représente schématiquement une technique de soudage à l'aide d'un jet d'air chaud 82 dirigé contre les plages ou languettes de contact et le fil électrique au moyen d'une buse 84. Finalement, la figure 16 représente schématiquement une fixation des extrémités 20 et 22 aux languettes 40 et 42 par un soudage au faisceau laser 86. Les languettes 40 et 42 peuvent avoir en surface une couche de brasure ou une pâte de soudage pré-déposée. FIG. 15 schematically represents a welding technique using a jet of hot air 82 directed against the beaches or tongues of contact and the electrical wire by means of a nozzle 84. Finally, FIG. 16 schematically represents an attachment of the ends 20 and 22 to the tongues 40 and 42 by a laser beam welding 86. The tongues 40 and 42 may have a surface on the surface layer of solder or a pre-deposited solder paste.

Claims

REVEN DICATIONS REVEN DICATIONS
1. Procédé de fabrication d'un dispositif de communication par ondes électromagnétiques comprenant une bobine (4) formant antenne et une unité électronique (8; 38; 38A; 38B; 38C; 58) munie de deux plages (24, 26; 64, 66) ou languettes (40, 42; 4OA, 42A; 4OB, 42B) de contact destinées à recevoir les deux extrémités (20, 22) de la bobine, caractérisé par les étapes successives suivantes :A method of manufacturing an electromagnetic wave communication device comprising an antenna coil (4) and an electronic unit (8; 38; 38A; 38B; 38C; 58) provided with two lands (24,26; 64; 66) or contact tongues (40, 42; 40A, 42A, 40B, 42B) for receiving both ends (20, 22) of the coil, characterized by the following successive steps:
A) on fixe ladite unité électronique sur un support (6; 7; 7A; 7B; 7C) autour d'une partie duquel il est prévu de réaliser l'enroulement (5) de ladite bobine,A) fixing said electronic unit on a support (6; 7; 7A; 7B; 7C) around a part of which it is intended to carry out the winding (5) of said coil,
B) on apporte un fil électrique (12) contre une première surface sensiblement verticale (14; 44) d'une première partie de ladite unité électronique de manière que ce fil soit tendu et demeure en appui contre cette première surface, laquelle définit soit une première plage de contact (24) de ladite unité électronique, soit une première butée (68) s'élevant en périphérie d'une première plage de contact (64) de cette unité électronique,B) an electric wire (12) is brought against a first substantially vertical surface (14; 44) of a first portion of said electronic unit so that the wire is taut and remains in abutment against this first surface, which defines either a first contact pad (24) of said electronic unit, ie a first stop (68) rising at the periphery of a first contact pad (64) of this electronic unit,
C) on forme avec ledit fil électrique ledit enroulement autour de ladite partie dudit support définissant un noyau de bobine; D) on apporte ledit fil électrique contre une deuxième surface sensiblement verticale (16; 46) d'une deuxième partie de ladite unité électronique de manière que ce fil électrique soit tendu et demeure en appui contre ladite deuxième surface, laquelle définit soit une deuxième plage de contact (26) de ladite unité électronique, soit une deuxième butée (69) s'élevant en périphérie d'une deuxième plage de contact (66) de cette unité électronique ;C) forming with said electrical wire said winding around said portion of said support defining a coil core; D) said electric wire is brought against a second substantially vertical surface (16; 46) of a second portion of said electronic unit so that the electric wire is taut and remains in abutment against said second surface, which defines a second range; contacting (26) said electronic unit, a second stop (69) rising at the periphery of a second contact pad (66) of said electronic unit;
E) on maintient ledit fil électrique sensiblement tendu dans la configuration résultant des étapes précédentes et on fixe ce fil électrique à ladite deuxième plage de contact de ladite unité électronique ainsi qu'à ladite première plage de contact si cela n'a pas déjà été réalisé lors d'une étape précédente, de manière à établir une connexion électrique entre ladite bobine et cette unité électronique.E) said electrical wire is maintained substantially tensioned in the configuration resulting from the preceding steps and this wire is fixed to said second contact pad of said electronic unit as well as to said first contact pad if it has not already been realized in a previous step, so as to establish an electrical connection between said coil and this electronic unit.
2. Procédé selon la revendication 1 , caractérisé en ce que lesdites première et deuxième surfaces sont des parois latérales opposées d'un circuit électronique enrobé avec deux plages de contact externes (24, 26) définissant respectivement partiellement ces deux parois latérales.2. Method according to claim 1, characterized in that said first and second surfaces are opposite side walls of an electronic circuit coated with two outer contact pads (24, 26) defining respectively these two side walls.
3. Procédé selon la revendication 1 , caractérisé en ce que lesdites première et deuxième surfaces sont définies respectivement par deux languettes de contact (40, 42; 4OA, 42A; 4OB, 42B) faisant saillie d'un corps de ladite unité électronique dans lequel est agencé un circuit électronique.3. Method according to claim 1, characterized in that said first and second surfaces are respectively defined by two contact tabs (40, 42; 40A, 42A, 40B, 42B) projecting from a body of said electronic unit in which is arranged an electronic circuit.
4. Procédé selon la revendication 3, caractérisé en ce que ladite unité électronique (38) est un module du type SMD fixé sur ledit support dans une configuration standard avec les deux languettes pliées vers le bas en direction de ce support.4. Method according to claim 3, characterized in that said electronic unit (38) is a SMD type module fixed on said support in a standard configuration with the two tabs folded down towards the support.
5. Procédé selon la revendication 3, caractérisé en ce que ladite unité électronique (38) est un module du type SMD fixé sur ledit support dans une configuration retournée avec les deux languettes pliées vers le haut et s'éloignant de ce support depuis ledit corps de cette unité.5. Method according to claim 3, characterized in that said electronic unit (38) is a module of the SMD type fixed on said support in an inverted configuration with the two tabs folded upwards and away from this support from said body from this unit.
6. Dispositif de communication (2, 32, 36, 50, 52) par ondes électromagnétiques comprenant une bobine (4) formant antenne et une unité électronique (8, 38, 38A, 38B, 38C) munie de deux plages ou languettes de contact reliées aux deux extrémités (20, 22) de la bobine, caractérisé en ce que ces deux plages (24, 26; 64, 66) ou languettes (40, 42; 4OA, 42A; 4OB, 42B) de contact présentent respectivement deux surfaces sensiblement verticales (14, 16; 44, 46) auxquelles les deux extrémités de la bobine sont respectivement fixées. An electromagnetic wave communication device (2, 32, 36, 50, 52) comprising an antenna coil (4) and an electronic unit (8, 38, 38A, 38B, 38C) provided with two contact pads or tabs. connected to the two ends (20, 22) of the coil, characterized in that these two contact strips (24, 26; 64, 66) or tongues (40, 42; 40A, 42A, 40B, 42B) respectively have two surfaces. substantially vertical (14, 16; 44, 46) to which both ends of the coil are respectively fixed.
7. Dispositif de communication selon la revendication 6, caractérisé en ce que ladite unité électronique est du type SMD avec ses deux languettes de contact faisant saillie d'un corps de cette unité électronique et pliées de manière à définir les deux dites surfaces sensiblement verticales, les deux extrémités étant soudées respectivement à ces languettes de manière à établir une connexion électrique entre la bobine et l'unité électronique. 7. Communication device according to claim 6, characterized in that said electronic unit is of SMD type with its two contact tabs protruding from a body of this electronic unit and folded so as to define the two said substantially vertical surfaces, the two ends being respectively welded to these tabs so as to establish an electrical connection between the coil and the electronic unit.
PCT/EP2008/051006 2007-02-21 2008-01-29 Process for manufacturing an rfid-type communication device WO2008107230A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP07102832 2007-02-21
EP07102832.8 2007-02-21

Publications (1)

Publication Number Publication Date
WO2008107230A1 true WO2008107230A1 (en) 2008-09-12

Family

ID=38171117

Family Applications (2)

Application Number Title Priority Date Filing Date
PCT/EP2008/051006 WO2008107230A1 (en) 2007-02-21 2008-01-29 Process for manufacturing an rfid-type communication device
PCT/EP2008/051736 WO2008107274A1 (en) 2007-02-21 2008-02-13 Process for manufacturing a device comprising an integrated circuit and an antenna coil connected to it

Family Applications After (1)

Application Number Title Priority Date Filing Date
PCT/EP2008/051736 WO2008107274A1 (en) 2007-02-21 2008-02-13 Process for manufacturing a device comprising an integrated circuit and an antenna coil connected to it

Country Status (1)

Country Link
WO (2) WO2008107230A1 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0405671A1 (en) * 1989-06-30 1991-01-02 Koninklijke Philips Electronics N.V. Winding support and method of forming an assembly comprising an electric coil and an electronic component by means of such a support
US5025550A (en) * 1990-05-25 1991-06-25 Trovan Limited Automated method for the manufacture of small implantable transponder devices
US5050292A (en) * 1990-05-25 1991-09-24 Trovan Limited Automated method for the manufacture of transponder devices by winding around a bobbin
US5281855A (en) * 1991-06-05 1994-01-25 Trovan Limited Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
DE19509999A1 (en) * 1995-03-22 1996-09-26 David Finn Method and device for producing a transponder unit and transponder unit

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0405671A1 (en) * 1989-06-30 1991-01-02 Koninklijke Philips Electronics N.V. Winding support and method of forming an assembly comprising an electric coil and an electronic component by means of such a support
US5025550A (en) * 1990-05-25 1991-06-25 Trovan Limited Automated method for the manufacture of small implantable transponder devices
US5050292A (en) * 1990-05-25 1991-09-24 Trovan Limited Automated method for the manufacture of transponder devices by winding around a bobbin
US5281855A (en) * 1991-06-05 1994-01-25 Trovan Limited Integrated circuit device including means for facilitating connection of antenna lead wires to an integrated circuit die
DE19509999A1 (en) * 1995-03-22 1996-09-26 David Finn Method and device for producing a transponder unit and transponder unit

Also Published As

Publication number Publication date
WO2008107274A1 (en) 2008-09-12

Similar Documents

Publication Publication Date Title
EP0526484B1 (en) Method for assembling a coil on a printed circuit
WO2004034779A1 (en) Electronic button tag for tagging and identifying cattle
EP0883177A1 (en) Semiconductor device with heat sink
EP2341471B1 (en) Method for manufacturing electronic cards
FR3040535A1 (en) ELECTRONIC DEVICE WITH INTEGRATED CONDUCTIVE ELEMENT AND METHOD OF MANUFACTURE
EP0790667B1 (en) Method for realisation of a portable object with a coil antenna
FR2772983A1 (en) ELECTRIC DISCHARGE BULB DEVICE
EP2636000B1 (en) Federverbindungsverfahren von einer leitfähigen öberflache mit einem elektrischen koktaktelement und entsprechende vorrichtung
EP0883181A1 (en) Semiconductor device and process for connecting internal ground wires with such a device
EP0735582B1 (en) Package for mounting an IC-chip
FR3004579A1 (en)
EP2850562B1 (en) Method for manufacturing an electronic card with an external connector
WO2008107230A1 (en) Process for manufacturing an rfid-type communication device
EP1263042A1 (en) Semiconductor package with recessed lead frame and recessed lead frame
FR2571154A1 (en) METHOD FOR MANUFACTURING AN END COMPONENT FOR OPTICAL FIBER, AND COMPONENT THUS OBTAINED
FR2494898A1 (en) THERMAL BREAKER
FR2965139A1 (en) CIRCUIT CARRIER AND METHOD OF MANUFACTURING SUCH A CIRCUIT CARRIER
EP0178977A1 (en) Semiconductor component mounted in a plastic housing, and method for its manufacture
EP3922511B1 (en) Method for attachment by welding of an interface support on a profile of a vehicle seat rail
FR2779851A1 (en) METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT CARD AND CARD OBTAINED
EP2175400A1 (en) Method of manufacturing an RF communication device made up of an antenna cable connected to an electronic unit
FR2861217A1 (en) Semiconductor casing for optical detector includes stacked transparent pastille and lens within opaque supporting sleeve
FR2727541A1 (en) CARD INCORPORATING AT LEAST ONE COIL
FR2906890A1 (en) High frequency or hyper frequency ball grid array type electronic box testing interface for monolithic microwave integrated circuit, has pin intercalated between box and board and including conductor elements and holes to assure connections
FR2855329A1 (en) Electrical contact e.g. pin, has welding charge that is fixed along elongated body and is provided such that it contacts with socket port during insertion of body in port, before being subjected to welding operation

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 08708323

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 2008708323

Country of ref document: EP

NENP Non-entry into the national phase

Ref country code: DE