WO2008051512A3 - Patterned printing plates and processes for printing electrical elements - Google Patents

Patterned printing plates and processes for printing electrical elements Download PDF

Info

Publication number
WO2008051512A3
WO2008051512A3 PCT/US2007/022415 US2007022415W WO2008051512A3 WO 2008051512 A3 WO2008051512 A3 WO 2008051512A3 US 2007022415 W US2007022415 W US 2007022415W WO 2008051512 A3 WO2008051512 A3 WO 2008051512A3
Authority
WO
WIPO (PCT)
Prior art keywords
printing
patterned
electrical circuits
processes
devices
Prior art date
Application number
PCT/US2007/022415
Other languages
French (fr)
Other versions
WO2008051512A2 (en
Inventor
John M Heitzinger
Original Assignee
Soligie Inc
John M Heitzinger
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Soligie Inc, John M Heitzinger filed Critical Soligie Inc
Priority to CA002667278A priority Critical patent/CA2667278A1/en
Priority to EP07861476A priority patent/EP2073973A4/en
Publication of WO2008051512A2 publication Critical patent/WO2008051512A2/en
Publication of WO2008051512A3 publication Critical patent/WO2008051512A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/40—Treatment after imagewise removal, e.g. baking
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0002—Apparatus or processes for manufacturing printed circuits for manufacturing artworks for printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49156—Manufacturing circuit on or in base with selective destruction of conductive paths
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Abstract

Printing plates, printing system and method for printing electrical circuits. According to embodiments of the invention, patterned layers of conductive, insulating, semi-conductive materials, and other materials can be additively print deposited on a substrate to form electrical circuits. The electrical circuits so formed of single or multiple printed layers can comprise or compose transistor devices, including thin film transistors, multiple transistor circuits or assemblies, or other electrical devices, for example batteries, sensors, displays, memory arrays, and the like. The invention further provides a patterned printing plate imaged by a photolithography and etch process, and a printing system and methods using the patterned plate by which such high resolution, precise registration electrical circuits and circuit devices can be produced.
PCT/US2007/022415 2006-10-20 2007-10-22 Patterned printing plates and processes for printing electrical elements WO2008051512A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CA002667278A CA2667278A1 (en) 2006-10-20 2007-10-22 Patterned printing plates and processes for printing electrical elements
EP07861476A EP2073973A4 (en) 2006-10-20 2007-10-22 Patterned printing plates and processes for printing electrical elements

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US86234706P 2006-10-20 2006-10-20
US60/862,347 2006-10-20

Publications (2)

Publication Number Publication Date
WO2008051512A2 WO2008051512A2 (en) 2008-05-02
WO2008051512A3 true WO2008051512A3 (en) 2008-06-26

Family

ID=39325149

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2007/022415 WO2008051512A2 (en) 2006-10-20 2007-10-22 Patterned printing plates and processes for printing electrical elements

Country Status (4)

Country Link
US (1) US7913382B2 (en)
EP (1) EP2073973A4 (en)
CA (1) CA2667278A1 (en)
WO (1) WO2008051512A2 (en)

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GB0225290D0 (en) * 2002-10-30 2002-12-11 Secretary Trade Ind Brit Anti-counterfeiting apparatus and method
TW201001624A (en) * 2008-01-24 2010-01-01 Soligie Inc Silicon thin film transistors, systems, and methods of making same
US9892663B2 (en) * 2008-07-03 2018-02-13 Chromera, Inc. Intelligent label device and method
US9471862B2 (en) * 2010-12-30 2016-10-18 Chromera, Inc. Intelligent label device and method
US10002359B2 (en) * 2008-07-03 2018-06-19 Chromera, Inc. Intelligent adaptive label device and method
TWI430722B (en) * 2008-09-05 2014-03-11 Unimicron Technology Corp Circuit structure of circuit board and process thereof
US8408674B1 (en) * 2008-10-21 2013-04-02 H. W. Crowley System and method for incorporating inkjet printing into a printing press process
EP2562599B1 (en) 2009-01-29 2014-12-10 Digiflex Ltd. Process for producing a photomask on a photopolymeric surface
US10002360B2 (en) * 2010-01-15 2018-06-19 Chromera, Inc. Intelligent adaptive label device and method
US9375916B2 (en) * 2010-06-18 2016-06-28 Esko-Graphics Imaging Gmbh Non-printing registration marks on a printing plate
US8836533B2 (en) 2010-08-24 2014-09-16 Soligie, Inc. Dynamic electronic communication device
US10147125B2 (en) 2010-08-24 2018-12-04 Molex, Llc Dynamic electronic communication device
KR101093075B1 (en) * 2011-04-04 2011-12-13 한국기계연구원 Pattern printing apparatus
EP2934768B1 (en) 2012-12-20 2017-08-23 3M Innovative Properties Company Printing of multiple inks to achieve precision registration during subsequent processing
US9275916B2 (en) * 2013-05-03 2016-03-01 Infineon Technologies Ag Removable indicator structure in electronic chips of a common substrate for process adjustment
US20150235169A1 (en) * 2013-12-30 2015-08-20 Chromera, Inc. Intelligent Label Processing System
US9213958B2 (en) * 2013-12-30 2015-12-15 Chromera, Inc. Intelligent label processing system
KR101674766B1 (en) * 2014-12-23 2016-11-10 주식회사 포스코 Method of the manufacturing transparent pattern print steel sheet
EP3580375A4 (en) * 2017-02-10 2020-12-02 Northeastern University Damascene template for nanoelement printing fabricated without chemomechanical planarizaton
CN106965580A (en) * 2017-03-23 2017-07-21 重庆宏声印务有限责任公司 The online code spraying method of Quick Response Code of reel-to-reel intaglio press
CN109829912B (en) * 2019-02-14 2020-09-08 深圳市华星光电半导体显示技术有限公司 Defect detection method of TFT array substrate

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US5895582A (en) * 1992-07-09 1999-04-20 Pilkington Plc Process of manufacturing a glass substrate for a magnetic disk
US20050185016A1 (en) * 2004-02-24 2005-08-25 Seiko Epson Corporation Wiping device, droplet discharge device, electro-optical device, method for manufacturing an electro-optical device, and electronic equipment
US20060166411A1 (en) * 2004-12-17 2006-07-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof

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US20060166411A1 (en) * 2004-12-17 2006-07-27 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and manufacturing method thereof

Also Published As

Publication number Publication date
CA2667278A1 (en) 2008-05-02
US20080092377A1 (en) 2008-04-24
WO2008051512A2 (en) 2008-05-02
US7913382B2 (en) 2011-03-29
EP2073973A2 (en) 2009-07-01
EP2073973A4 (en) 2009-12-16

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