WO2007061963A3 - Method of making an x-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging - Google Patents
Method of making an x-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging Download PDFInfo
- Publication number
- WO2007061963A3 WO2007061963A3 PCT/US2006/044919 US2006044919W WO2007061963A3 WO 2007061963 A3 WO2007061963 A3 WO 2007061963A3 US 2006044919 W US2006044919 W US 2006044919W WO 2007061963 A3 WO2007061963 A3 WO 2007061963A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- wafer
- making
- tuning fork
- vertically integrated
- integrated electronics
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000004806 packaging method and process Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
- G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
- G01C19/5733—Structural details or topology
- G01C19/574—Structural details or topology the devices having two sensing masses in anti-phase motion
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008541409A JP5567272B2 (en) | 2005-11-18 | 2006-11-17 | XY-axis double mass tuning fork gyroscope manufacturing method by vertically integrated electronic equipment and wafer scale hermetic sealing |
KR1020087014745A KR101105059B1 (en) | 2005-11-18 | 2006-11-17 | Method of making an x-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
CN2006800489191A CN101663586B (en) | 2005-11-18 | 2006-11-17 | Method of making an x-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/283,083 | 2005-11-18 | ||
US11/283,083 US7458263B2 (en) | 2003-10-20 | 2005-11-18 | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2007061963A2 WO2007061963A2 (en) | 2007-05-31 |
WO2007061963A3 true WO2007061963A3 (en) | 2009-05-07 |
Family
ID=38067829
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2006/044919 WO2007061963A2 (en) | 2005-11-18 | 2006-11-17 | Method of making an x-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
PCT/IB2009/005063 WO2009130554A2 (en) | 2005-11-18 | 2009-02-05 | X-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/IB2009/005063 WO2009130554A2 (en) | 2005-11-18 | 2009-02-05 | X-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Country Status (5)
Country | Link |
---|---|
US (1) | US7458263B2 (en) |
JP (1) | JP5567272B2 (en) |
KR (1) | KR101105059B1 (en) |
CN (1) | CN101663586B (en) |
WO (2) | WO2007061963A2 (en) |
Families Citing this family (106)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7813634B2 (en) * | 2005-02-28 | 2010-10-12 | Tessera MEMS Technologies, Inc. | Autofocus camera |
US7458263B2 (en) * | 2003-10-20 | 2008-12-02 | Invensense Inc. | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
FI116543B (en) * | 2004-12-31 | 2005-12-15 | Vti Technologies Oy | Oscillating micro-mechanical angular velocity sensor, for vehicle, has seismic masses that are connected to support areas using springs or auxiliary structures |
JP4740678B2 (en) * | 2005-07-27 | 2011-08-03 | Okiセミコンダクタ株式会社 | Semiconductor device |
US7621183B2 (en) * | 2005-11-18 | 2009-11-24 | Invensense Inc. | X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
JP2008008820A (en) * | 2006-06-30 | 2008-01-17 | Hitachi Ltd | Inertia sensor and its manufacturing method |
US8768157B2 (en) | 2011-09-28 | 2014-07-01 | DigitalOptics Corporation MEMS | Multiple degree of freedom actuator |
US8619378B2 (en) | 2010-11-15 | 2013-12-31 | DigitalOptics Corporation MEMS | Rotational comb drive Z-stage |
US8952832B2 (en) | 2008-01-18 | 2015-02-10 | Invensense, Inc. | Interfacing application programs and motion sensors of a device |
US8020441B2 (en) | 2008-02-05 | 2011-09-20 | Invensense, Inc. | Dual mode sensing for vibratory gyroscope |
US8508039B1 (en) | 2008-05-08 | 2013-08-13 | Invensense, Inc. | Wafer scale chip scale packaging of vertically integrated MEMS sensors with electronics |
US8250921B2 (en) | 2007-07-06 | 2012-08-28 | Invensense, Inc. | Integrated motion processing unit (MPU) with MEMS inertial sensing and embedded digital electronics |
US8141424B2 (en) | 2008-09-12 | 2012-03-27 | Invensense, Inc. | Low inertia frame for detecting coriolis acceleration |
US7796872B2 (en) | 2007-01-05 | 2010-09-14 | Invensense, Inc. | Method and apparatus for producing a sharp image from a handheld device containing a gyroscope |
US8047075B2 (en) | 2007-06-21 | 2011-11-01 | Invensense, Inc. | Vertically integrated 3-axis MEMS accelerometer with electronics |
US8462109B2 (en) | 2007-01-05 | 2013-06-11 | Invensense, Inc. | Controlling and accessing content using motion processing on mobile devices |
US7934423B2 (en) | 2007-12-10 | 2011-05-03 | Invensense, Inc. | Vertically integrated 3-axis MEMS angular accelerometer with integrated electronics |
US8390912B2 (en) | 2007-01-10 | 2013-03-05 | Seiko Epson Corporation | Actuator, optical scanner and image forming device |
US7779689B2 (en) * | 2007-02-21 | 2010-08-24 | Freescale Semiconductor, Inc. | Multiple axis transducer with multiple sensing range capability |
US7677099B2 (en) * | 2007-11-05 | 2010-03-16 | Invensense Inc. | Integrated microelectromechanical systems (MEMS) vibrating mass Z-axis rate sensor |
KR101301157B1 (en) * | 2007-11-09 | 2013-09-03 | 삼성전자주식회사 | Method of multi-stage substrate etching and terahertz oscillator manufactured using the same method |
DE102007054505B4 (en) | 2007-11-15 | 2016-12-22 | Robert Bosch Gmbh | Yaw rate sensor |
US7971483B2 (en) * | 2008-03-28 | 2011-07-05 | Honeywell International Inc. | Systems and methods for acceleration and rotational determination from an out-of-plane MEMS device |
US7984648B2 (en) | 2008-04-10 | 2011-07-26 | Honeywell International Inc. | Systems and methods for acceleration and rotational determination from an in-plane and out-of-plane MEMS device |
US8215151B2 (en) * | 2008-06-26 | 2012-07-10 | Analog Devices, Inc. | MEMS stiction testing apparatus and method |
KR101001666B1 (en) * | 2008-07-08 | 2010-12-15 | 광주과학기술원 | The method for fabricating micro vertical structure |
JP5470767B2 (en) * | 2008-07-28 | 2014-04-16 | 富士通株式会社 | Micro movable element manufacturing method |
US7943411B2 (en) * | 2008-09-10 | 2011-05-17 | Analog Devices, Inc. | Apparatus and method of wafer bonding using compatible alloy |
US8956904B2 (en) | 2008-09-10 | 2015-02-17 | Analog Devices, Inc. | Apparatus and method of wafer bonding using compatible alloy |
DE102008042369B4 (en) * | 2008-09-25 | 2018-05-24 | Robert Bosch Gmbh | Coupling structure for a rotation rate sensor device, rotation rate sensor device and manufacturing method |
US8499629B2 (en) * | 2008-10-10 | 2013-08-06 | Honeywell International Inc. | Mounting system for torsional suspension of a MEMS device |
DE102008043796B4 (en) | 2008-11-17 | 2023-12-21 | Robert Bosch Gmbh | Rotation rate sensor |
US8220330B2 (en) * | 2009-03-24 | 2012-07-17 | Freescale Semiconductor, Inc. | Vertically integrated MEMS sensor device with multi-stimulus sensing |
WO2010138717A1 (en) * | 2009-05-27 | 2010-12-02 | King Abdullah University Of Science And Technology | Mems mass spring damper systems using an out-of-plane suspension scheme |
US9097524B2 (en) | 2009-09-11 | 2015-08-04 | Invensense, Inc. | MEMS device with improved spring system |
US8534127B2 (en) | 2009-09-11 | 2013-09-17 | Invensense, Inc. | Extension-mode angular velocity sensor |
US8421481B2 (en) * | 2009-10-20 | 2013-04-16 | Analog Devices, Inc. | Detection and mitigation of particle contaminants in MEMS devices |
US8217474B2 (en) * | 2009-12-28 | 2012-07-10 | Solid State System Co., Ltd. | Hermetic MEMS device and method for fabricating hermetic MEMS device and package structure of MEMS device |
US8030112B2 (en) * | 2010-01-22 | 2011-10-04 | Solid State System Co., Ltd. | Method for fabricating MEMS device |
JP5627669B2 (en) * | 2010-03-09 | 2014-11-19 | アルプス電気株式会社 | MEMS sensor |
JP2011209002A (en) * | 2010-03-29 | 2011-10-20 | Seiko Epson Corp | Vibration piece, angular velocity sensor, and electronic apparatus |
US8966400B2 (en) | 2010-06-07 | 2015-02-24 | Empire Technology Development Llc | User movement interpretation in computer generated reality |
US8337103B2 (en) | 2010-11-15 | 2012-12-25 | DigitalOptics Corporation MEMS | Long hinge actuator snubbing |
US8604663B2 (en) | 2010-11-15 | 2013-12-10 | DigitalOptics Corporation MEMS | Motion controlled actuator |
US8547627B2 (en) | 2010-11-15 | 2013-10-01 | DigitalOptics Corporation MEMS | Electrical routing |
US9352962B2 (en) | 2010-11-15 | 2016-05-31 | DigitalOptics Corporation MEMS | MEMS isolation structures |
US8941192B2 (en) | 2010-11-15 | 2015-01-27 | DigitalOptics Corporation MEMS | MEMS actuator device deployment |
US9061883B2 (en) | 2010-11-15 | 2015-06-23 | DigitalOptics Corporation MEMS | Actuator motion control features |
US8884381B2 (en) | 2010-11-15 | 2014-11-11 | DigitalOptics Corporation MEMS | Guard trench |
US9515579B2 (en) | 2010-11-15 | 2016-12-06 | Digitaloptics Corporation | MEMS electrical contact systems and methods |
US8947797B2 (en) | 2010-11-15 | 2015-02-03 | DigitalOptics Corporation MEMS | Miniature MEMS actuator assemblies |
US8803256B2 (en) | 2010-11-15 | 2014-08-12 | DigitalOptics Corporation MEMS | Linearly deployed actuators |
US8608393B2 (en) | 2010-11-15 | 2013-12-17 | DigitalOptics Corporation MEMS | Capillary actuator deployment |
US8521017B2 (en) | 2010-11-15 | 2013-08-27 | DigitalOptics Corporation MEMS | MEMS actuator alignment |
US8358925B2 (en) | 2010-11-15 | 2013-01-22 | DigitalOptics Corporation MEMS | Lens barrel with MEMS actuators |
US8430580B2 (en) | 2010-11-15 | 2013-04-30 | DigitalOptics Corporation MEMS | Rotationally deployed actuators |
US8637961B2 (en) | 2010-11-15 | 2014-01-28 | DigitalOptics Corporation MEMS | MEMS actuator device |
US8605375B2 (en) | 2010-11-15 | 2013-12-10 | DigitalOptics Corporation MEMS | Mounting flexure contacts |
US9052567B2 (en) | 2010-11-15 | 2015-06-09 | DigitalOptics Corporation MEMS | Actuator inside of motion control |
US9019390B2 (en) | 2011-09-28 | 2015-04-28 | DigitalOptics Corporation MEMS | Optical image stabilization using tangentially actuated MEMS devices |
US9171964B2 (en) | 2010-11-23 | 2015-10-27 | Honeywell International Inc. | Systems and methods for a three-layer chip-scale MEMS device |
US8748206B2 (en) * | 2010-11-23 | 2014-06-10 | Honeywell International Inc. | Systems and methods for a four-layer chip-scale MEMS device |
US9714842B2 (en) * | 2011-09-16 | 2017-07-25 | Invensense, Inc. | Gyroscope self test by applying rotation on coriolis sense mass |
US10914584B2 (en) | 2011-09-16 | 2021-02-09 | Invensense, Inc. | Drive and sense balanced, semi-coupled 3-axis gyroscope |
US9170107B2 (en) * | 2011-09-16 | 2015-10-27 | Invensense, Inc. | Micromachined gyroscope including a guided mass system |
US8833162B2 (en) * | 2011-09-16 | 2014-09-16 | Invensense, Inc. | Micromachined gyroscope including a guided mass system |
US9863769B2 (en) | 2011-09-16 | 2018-01-09 | Invensense, Inc. | MEMS sensor with decoupled drive system |
US9350271B2 (en) | 2011-09-28 | 2016-05-24 | DigitalOptics Corporation MEMS | Cascaded electrostatic actuator |
US8853975B2 (en) | 2011-09-28 | 2014-10-07 | DigitalOptics Corporation MEMS | Electrostatic actuator control |
US8616791B2 (en) | 2011-09-28 | 2013-12-31 | DigitalOptics Corporation MEMS | Rotationally deployed actuator devices |
US9281763B2 (en) | 2011-09-28 | 2016-03-08 | DigitalOptics Corporation MEMS | Row and column actuator control |
US8571405B2 (en) | 2011-09-28 | 2013-10-29 | DigitalOptics Corporation MEMS | Surface mount actuator |
US8869625B2 (en) | 2011-09-28 | 2014-10-28 | DigitalOptics Corporation MEMS | MEMS actuator/sensor |
US8855476B2 (en) | 2011-09-28 | 2014-10-07 | DigitalOptics Corporation MEMS | MEMS-based optical image stabilization |
JP5708535B2 (en) | 2012-03-13 | 2015-04-30 | 株式会社デンソー | Angular velocity sensor |
US8875576B2 (en) * | 2012-03-21 | 2014-11-04 | The United States Of America As Represented By The Secretary Of The Navy | Apparatus and method for providing an in-plane inertial device with integrated clock |
JP2013232626A (en) | 2012-04-04 | 2013-11-14 | Seiko Epson Corp | Electronic device, manufacturing method of the same, electronic apparatus and movable body |
US20130264755A1 (en) * | 2012-04-05 | 2013-10-10 | Honeywell International Inc. | Methods and systems for limiting sensor motion |
JP6061064B2 (en) | 2012-05-14 | 2017-01-18 | セイコーエプソン株式会社 | Gyro sensor and electronic equipment |
KR101388814B1 (en) * | 2012-09-11 | 2014-04-23 | 삼성전기주식회사 | Angular Velocity Sensor |
US9327965B2 (en) | 2013-03-15 | 2016-05-03 | Versana Micro Inc | Transportation device having a monolithically integrated multi-sensor device on a semiconductor substrate and method therefor |
WO2015042700A1 (en) | 2013-09-24 | 2015-04-02 | Motion Engine Inc. | Mems components and method of wafer-level manufacturing thereof |
EP3019442A4 (en) | 2013-07-08 | 2017-01-25 | Motion Engine Inc. | Mems device and method of manufacturing |
EP3028007A4 (en) | 2013-08-02 | 2017-07-12 | Motion Engine Inc. | Mems motion sensor and method of manufacturing |
EP3184961B1 (en) * | 2013-09-30 | 2021-01-06 | Invensense, Inc. | Micromachined gyroscope including a guided mass system |
JP6590812B2 (en) | 2014-01-09 | 2019-10-16 | モーション・エンジン・インコーポレーテッド | Integrated MEMS system |
US9958271B2 (en) | 2014-01-21 | 2018-05-01 | Invensense, Inc. | Configuration to reduce non-linear motion |
US20170030788A1 (en) | 2014-04-10 | 2017-02-02 | Motion Engine Inc. | Mems pressure sensor |
JP6344033B2 (en) | 2014-04-22 | 2018-06-20 | セイコーエプソン株式会社 | Angular velocity sensor, electronic device and moving object |
EP4166902A1 (en) * | 2014-05-21 | 2023-04-19 | InvenSense, Inc. | Mems sensor with decoupled drive system |
US11674803B2 (en) | 2014-06-02 | 2023-06-13 | Motion Engine, Inc. | Multi-mass MEMS motion sensor |
WO2016090467A1 (en) | 2014-12-09 | 2016-06-16 | Motion Engine Inc. | 3d mems magnetometer and associated methods |
US10231337B2 (en) | 2014-12-16 | 2019-03-12 | Inertial Sense, Inc. | Folded printed circuit assemblies and related methods |
US10407299B2 (en) | 2015-01-15 | 2019-09-10 | Motion Engine Inc. | 3D MEMS device with hermetic cavity |
US20160371664A1 (en) * | 2015-06-19 | 2016-12-22 | Ncr Corporation | Slotted rotatable drum and method of using same |
KR101915954B1 (en) * | 2016-06-29 | 2018-11-08 | 주식회사 신성씨앤티 | MEMS based 3-axis accelerometer |
KR101886134B1 (en) * | 2016-07-26 | 2018-08-07 | 주식회사 신성씨앤티 | MEMS sensor and Method for fabricating of the same |
JP6639377B2 (en) | 2016-12-08 | 2020-02-05 | 株式会社東芝 | Vibration device |
US10466053B2 (en) * | 2017-04-04 | 2019-11-05 | Invensense, Inc. | Out-of-plane sensing gyroscope robust to external acceleration and rotation |
EP3671116B1 (en) * | 2018-12-19 | 2021-11-17 | Murata Manufacturing Co., Ltd. | Synchronized multi-axis gyroscope |
JP6849042B2 (en) | 2018-12-19 | 2021-03-24 | 株式会社村田製作所 | Vibration-resistant multi-axis gyroscope |
US11656077B2 (en) | 2019-01-31 | 2023-05-23 | Analog Devices, Inc. | Pseudo-extensional mode MEMS ring gyroscope |
DE102020205372A1 (en) * | 2020-04-28 | 2021-10-28 | Robert Bosch Gesellschaft mit beschränkter Haftung | Micromechanical component for a yaw rate sensor and a corresponding manufacturing process |
US11125580B1 (en) * | 2020-05-14 | 2021-09-21 | Invensense, Inc. | MEMS sensor modulation and multiplexing |
US11609091B2 (en) * | 2020-11-16 | 2023-03-21 | Knowles Electronics, Llc | Microelectromechanical systems device including a proof mass and movable plate |
CN113125792B (en) * | 2021-04-22 | 2023-01-31 | 长春工业大学 | Piezoelectric-electromagnetic combined sensing device for measuring rotating speed |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020051258A1 (en) * | 2000-06-23 | 2002-05-02 | Murata Manufacturing Co., Ltd. | Composite sensor device and method of producing the same |
US20050081633A1 (en) * | 2003-10-20 | 2005-04-21 | Nasiri Steven S. | X-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Family Cites Families (45)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5083466A (en) * | 1988-07-14 | 1992-01-28 | University Of Hawaii | Multidimensional force sensor |
US5359893A (en) | 1991-12-19 | 1994-11-01 | Motorola, Inc. | Multi-axes gyroscope |
US5377544A (en) * | 1991-12-19 | 1995-01-03 | Motorola, Inc. | Rotational vibration gyroscope |
US5426970A (en) * | 1993-08-02 | 1995-06-27 | New Sd, Inc. | Rotation rate sensor with built in test circuit |
DE4332944A1 (en) * | 1993-09-28 | 1995-03-30 | Bosch Gmbh Robert | Sensor with a quartz tuning fork |
JP3402742B2 (en) * | 1994-03-31 | 2003-05-06 | キヤノン株式会社 | Mounting device for run-out detection means |
DE4414237A1 (en) | 1994-04-23 | 1995-10-26 | Bosch Gmbh Robert | Micromechanical vibrator of an oscillation gyrometer |
JPH0894654A (en) * | 1994-09-21 | 1996-04-12 | Murata Mfg Co Ltd | Data input device |
DE19519488B4 (en) * | 1995-05-27 | 2005-03-10 | Bosch Gmbh Robert | Rate of rotation sensor with two acceleration sensors |
KR100363246B1 (en) | 1995-10-27 | 2003-02-14 | 삼성전자 주식회사 | Oscillating structure and method for controlling natural frequency thereof |
US5992233A (en) * | 1996-05-31 | 1999-11-30 | The Regents Of The University Of California | Micromachined Z-axis vibratory rate gyroscope |
JPH1038578A (en) | 1996-07-17 | 1998-02-13 | Tokin Corp | Angular speed sensor |
JPH116738A (en) * | 1997-04-22 | 1999-01-12 | Denso Corp | Angular velocity sensor |
DE19719780B4 (en) * | 1997-05-10 | 2006-09-07 | Robert Bosch Gmbh | Acceleration detecting means |
US6122961A (en) | 1997-09-02 | 2000-09-26 | Analog Devices, Inc. | Micromachined gyros |
JP3882973B2 (en) | 1998-06-22 | 2007-02-21 | アイシン精機株式会社 | Angular velocity sensor |
JP2000046862A (en) * | 1998-07-28 | 2000-02-18 | Matsushita Electric Works Ltd | Semiconductor acceleration sensor |
JP2000283765A (en) * | 1999-03-30 | 2000-10-13 | Matsushita Electric Ind Co Ltd | Tripod tuning fork oscillator and angular speed sensor |
US6481283B1 (en) | 1999-04-05 | 2002-11-19 | Milli Sensor Systems & Actuators, Inc. | Coriolis oscillating gyroscopic instrument |
US6481285B1 (en) | 1999-04-21 | 2002-11-19 | Andrei M. Shkel | Micro-machined angle-measuring gyroscope |
US6189381B1 (en) | 1999-04-26 | 2001-02-20 | Sitek, Inc. | Angular rate sensor made from a structural wafer of single crystal silicon |
JP3020496B1 (en) * | 1999-04-30 | 2000-03-15 | 日本遠隔制御株式会社 | Anti-vibration device for angular velocity sensor and angular velocity sensor device |
US6487907B1 (en) | 1999-07-08 | 2002-12-03 | California Institute Of Technology | Microgyroscope with integrated vibratory element |
US6508122B1 (en) | 1999-09-16 | 2003-01-21 | American Gnc Corporation | Microelectromechanical system for measuring angular rate |
KR100343211B1 (en) * | 1999-11-04 | 2002-07-10 | 윤종용 | Fablication method of Micro Electromechanical System structure which can be packaged in the state of wafer level |
US6430998B2 (en) * | 1999-12-03 | 2002-08-13 | Murata Manufacturing Co., Ltd. | Resonant element |
JP2002148048A (en) | 2000-11-08 | 2002-05-22 | Murata Mfg Co Ltd | Angular speed detecting element |
US6462530B1 (en) * | 2001-01-25 | 2002-10-08 | Bei Technologies, Inc. | Redundant rate sensor and method |
US6480320B2 (en) * | 2001-02-07 | 2002-11-12 | Transparent Optical, Inc. | Microelectromechanical mirror and mirror array |
KR20030004387A (en) * | 2001-03-06 | 2003-01-14 | 마이크로스톤 가부시키가이샤 | Body motion detector |
US6513380B2 (en) | 2001-06-19 | 2003-02-04 | Microsensors, Inc. | MEMS sensor with single central anchor and motion-limiting connection geometry |
US6794272B2 (en) * | 2001-10-26 | 2004-09-21 | Ifire Technologies, Inc. | Wafer thinning using magnetic mirror plasma |
KR100436367B1 (en) | 2001-12-14 | 2004-06-19 | 삼성전자주식회사 | MEMS gyroscpoe having inertial masses vibrating vertically on a substrate |
US6853315B2 (en) * | 2002-01-23 | 2005-02-08 | Triad Sensors, Inc. | Piezoelectric rate sensor system and method |
KR100431004B1 (en) * | 2002-02-08 | 2004-05-12 | 삼성전자주식회사 | Rotation type MEMS gyroscpoe of a decoupled structure |
US7040163B2 (en) | 2002-08-12 | 2006-05-09 | The Boeing Company | Isolated planar gyroscope with internal radial sensing and actuation |
US6918297B2 (en) * | 2003-02-28 | 2005-07-19 | Honeywell International, Inc. | Miniature 3-dimensional package for MEMS sensors |
JP2004361388A (en) * | 2003-05-15 | 2004-12-24 | Mitsubishi Electric Corp | Capacitive type inertial force detection device |
US7045868B2 (en) * | 2003-07-31 | 2006-05-16 | Motorola, Inc. | Wafer-level sealed microdevice having trench isolation and methods for making the same |
JP2005055377A (en) * | 2003-08-07 | 2005-03-03 | Sony Corp | Speed detection system |
US7458263B2 (en) * | 2003-10-20 | 2008-12-02 | Invensense Inc. | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
US6939473B2 (en) | 2003-10-20 | 2005-09-06 | Invensense Inc. | Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
KR100575363B1 (en) * | 2004-04-13 | 2006-05-03 | 재단법인서울대학교산학협력재단 | Method of packaging of mems device at the vacuum state and vacuum packaged mems device using the same |
US7196404B2 (en) * | 2004-05-20 | 2007-03-27 | Analog Devices, Inc. | Motion detector and method of producing the same |
JP2007024864A (en) * | 2005-06-16 | 2007-02-01 | Mitsubishi Electric Corp | Oscillating gyroscope |
-
2005
- 2005-11-18 US US11/283,083 patent/US7458263B2/en not_active Expired - Lifetime
-
2006
- 2006-11-17 CN CN2006800489191A patent/CN101663586B/en active Active
- 2006-11-17 KR KR1020087014745A patent/KR101105059B1/en active IP Right Grant
- 2006-11-17 JP JP2008541409A patent/JP5567272B2/en not_active Expired - Fee Related
- 2006-11-17 WO PCT/US2006/044919 patent/WO2007061963A2/en active Application Filing
-
2009
- 2009-02-05 WO PCT/IB2009/005063 patent/WO2009130554A2/en active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020051258A1 (en) * | 2000-06-23 | 2002-05-02 | Murata Manufacturing Co., Ltd. | Composite sensor device and method of producing the same |
US20050081633A1 (en) * | 2003-10-20 | 2005-04-21 | Nasiri Steven S. | X-y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging |
Also Published As
Publication number | Publication date |
---|---|
CN101663586A (en) | 2010-03-03 |
WO2007061963A2 (en) | 2007-05-31 |
JP2009520950A (en) | 2009-05-28 |
US20060219006A1 (en) | 2006-10-05 |
WO2009130554A3 (en) | 2010-01-14 |
JP5567272B2 (en) | 2014-08-06 |
WO2009130554A2 (en) | 2009-10-29 |
KR101105059B1 (en) | 2012-01-17 |
CN101663586B (en) | 2013-02-13 |
US7458263B2 (en) | 2008-12-02 |
KR20080074989A (en) | 2008-08-13 |
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