WO2007005516A3 - Connector-to-pad pcb translator for a tester and method of fabricatio - Google Patents

Connector-to-pad pcb translator for a tester and method of fabricatio Download PDF

Info

Publication number
WO2007005516A3
WO2007005516A3 PCT/US2006/025354 US2006025354W WO2007005516A3 WO 2007005516 A3 WO2007005516 A3 WO 2007005516A3 US 2006025354 W US2006025354 W US 2006025354W WO 2007005516 A3 WO2007005516 A3 WO 2007005516A3
Authority
WO
WIPO (PCT)
Prior art keywords
board
receiving
translator
controlled depth
fabricatio
Prior art date
Application number
PCT/US2006/025354
Other languages
French (fr)
Other versions
WO2007005516A2 (en
Inventor
Arash Behziz
Roya Yaghmai
Original Assignee
Teradyne Inc
Arash Behziz
Roya Yaghmai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc, Arash Behziz, Roya Yaghmai filed Critical Teradyne Inc
Priority to JP2008520287A priority Critical patent/JP2008545248A/en
Priority to CN2006800240456A priority patent/CN101213464B/en
Priority to EP06785836A priority patent/EP1896861A2/en
Publication of WO2007005516A2 publication Critical patent/WO2007005516A2/en
Publication of WO2007005516A3 publication Critical patent/WO2007005516A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2889—Interfaces, e.g. between probe and tester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09472—Recessed pad for surface mounting; Recessed electrode of component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09481—Via in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H05K2201/09518—Deep blind vias, i.e. blind vias connecting the surface circuit to circuit layers deeper than the first buried circuit layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09627—Special connections between adjacent vias, not for grounding vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base

Abstract

In one embodiment, a laminated printed circuit board translator (100) is provided. In some embodiments, the translator includes a receiving board (110) adapted to receive a pin (55) , the receiving board includes a plated via (120) extending through the receiving board and has a hole (125) for receiving the pin. An interface board (130) laminated with the receiving board has a controlled depth via (160) extending through it to contact a conductive trace (140) . The conductive trace extends between the receiving board and the interface board to connect the plated via of the receiving board with the controlled depth via of the interface board. The controlled depth via is configured so that it is capable of being plated through a single sided drilled opening in the interface board. Some embodiments have a pad on the interface board connected to the controlled depth via.
PCT/US2006/025354 2005-06-30 2006-06-28 Connector-to-pad pcb translator for a tester and method of fabricatio WO2007005516A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2008520287A JP2008545248A (en) 2005-06-30 2006-06-28 Printed circuit board type translator for connector-pad conversion and manufacturing method
CN2006800240456A CN101213464B (en) 2005-06-30 2006-06-28 Connector-to-pad PCB translator for a tester and method of fabrication
EP06785836A EP1896861A2 (en) 2005-06-30 2006-06-28 Connector-to-pad printed circuit board translator and method of fabrication

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US69551605P 2005-06-30 2005-06-30
US60/695,516 2005-06-30
US11/474,921 US7649375B2 (en) 2005-06-30 2006-06-26 Connector-to-pad printed circuit board translator and method of fabrication
US11/474,921 2006-06-26

Publications (2)

Publication Number Publication Date
WO2007005516A2 WO2007005516A2 (en) 2007-01-11
WO2007005516A3 true WO2007005516A3 (en) 2007-03-29

Family

ID=37401571

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/025354 WO2007005516A2 (en) 2005-06-30 2006-06-28 Connector-to-pad pcb translator for a tester and method of fabricatio

Country Status (6)

Country Link
US (1) US7649375B2 (en)
EP (1) EP1896861A2 (en)
JP (1) JP2008545248A (en)
KR (1) KR101264126B1 (en)
CN (1) CN101213464B (en)
WO (1) WO2007005516A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7847570B2 (en) 2007-10-19 2010-12-07 Teradyne, Inc. Laser targeting mechanism
US7733081B2 (en) 2007-10-19 2010-06-08 Teradyne, Inc. Automated test equipment interface
KR101043468B1 (en) * 2009-05-06 2011-06-23 삼성전기주식회사 Probe substrate and probe card having the same
CN102621463B (en) * 2011-02-01 2014-12-10 致茂电子(苏州)有限公司 Support plate with airtight conducting holes used for semiconductor testing device and manufacture method thereof
US10080287B2 (en) 2012-09-27 2018-09-18 Dell Products L.P. Blind via printed circuit board fabrication supporting press fit connectors
US9179546B2 (en) 2012-09-27 2015-11-03 Dell Products L.P. Blind via printed circuit board fabrication supporting press fit connectors
CN104375076B (en) * 2014-11-12 2018-09-04 中国人民解放军第五三一一工厂 A kind of circuit module measurement switching device
US9564697B2 (en) * 2014-11-13 2017-02-07 Lear Corporation Press fit electrical terminal having a solder tab shorter than PCB thickness and method of using same
CN106973488B (en) * 2017-05-18 2019-03-26 台山市精诚达电路有限公司 A kind of FPC wiring board for electric test

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0971570A1 (en) * 1997-02-03 2000-01-12 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US6292006B1 (en) * 1995-10-10 2001-09-18 Xilinx, Inc. Method for preventing condensation on handler board during semiconductor device testing
US20040257098A1 (en) * 2003-06-19 2004-12-23 Katsuhiko Satou Probe card
US20050036374A1 (en) * 2003-08-12 2005-02-17 Masanari Nakashima Probe card substrate

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4771236A (en) * 1985-12-16 1988-09-13 Banks Sherman M Multilayered printed circuit board type resistor isolated tray for stress testing integrated circuits and method of making same
JPH0362547A (en) * 1989-02-03 1991-03-18 General Electric Co <Ge> Testing structure of integrated circuit and test thereof
US5262719A (en) * 1991-09-19 1993-11-16 International Business Machines Corporation Test structure for multi-layer, thin-film modules
US5600259A (en) * 1993-12-17 1997-02-04 International Business Machines Corporation Method and apparatus for reducing interference in a pin array
US5807767A (en) * 1996-01-02 1998-09-15 Micron Technology, Inc. Technique for attaching die to leads
US6034533A (en) * 1997-06-10 2000-03-07 Tervo; Paul A. Low-current pogo probe card
US6756797B2 (en) * 2001-01-31 2004-06-29 Wentworth Laboratories Inc. Planarizing interposer for thermal compensation of a probe card
US6924654B2 (en) * 2003-03-12 2005-08-02 Celerity Research, Inc. Structures for testing circuits and methods for fabricating the structures
US7388394B1 (en) * 2004-12-01 2008-06-17 Cardiac Pacemakers, Inc. Multiple layer printed circuit board having misregistration testing pattern

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6292006B1 (en) * 1995-10-10 2001-09-18 Xilinx, Inc. Method for preventing condensation on handler board during semiconductor device testing
EP0971570A1 (en) * 1997-02-03 2000-01-12 Ibiden Co., Ltd. Printed wiring board and its manufacturing method
US20040257098A1 (en) * 2003-06-19 2004-12-23 Katsuhiko Satou Probe card
US20050036374A1 (en) * 2003-08-12 2005-02-17 Masanari Nakashima Probe card substrate

Also Published As

Publication number Publication date
EP1896861A2 (en) 2008-03-12
US20070007034A1 (en) 2007-01-11
CN101213464A (en) 2008-07-02
KR101264126B1 (en) 2013-05-14
US7649375B2 (en) 2010-01-19
CN101213464B (en) 2012-08-29
KR20080034849A (en) 2008-04-22
WO2007005516A2 (en) 2007-01-11
JP2008545248A (en) 2008-12-11

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