WO2006096543A3 - Temperature sensing and prediction in ic sockets - Google Patents

Temperature sensing and prediction in ic sockets Download PDF

Info

Publication number
WO2006096543A3
WO2006096543A3 PCT/US2006/007687 US2006007687W WO2006096543A3 WO 2006096543 A3 WO2006096543 A3 WO 2006096543A3 US 2006007687 W US2006007687 W US 2006007687W WO 2006096543 A3 WO2006096543 A3 WO 2006096543A3
Authority
WO
WIPO (PCT)
Prior art keywords
temperature
prediction
temperature sensing
sockets
sensing
Prior art date
Application number
PCT/US2006/007687
Other languages
French (fr)
Other versions
WO2006096543A2 (en
Inventor
Christopher A Lopez
Brian J Denheyer
Original Assignee
Wells Cti Llc
Christopher A Lopez
Brian J Denheyer
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wells Cti Llc, Christopher A Lopez, Brian J Denheyer filed Critical Wells Cti Llc
Priority to JP2008500780A priority Critical patent/JP2008537637A/en
Priority to EP06736932A priority patent/EP1866656A2/en
Publication of WO2006096543A2 publication Critical patent/WO2006096543A2/en
Publication of WO2006096543A3 publication Critical patent/WO2006096543A3/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/42—Circuits effecting compensation of thermal inertia; Circuits for predicting the stationary value of a temperature
    • G01K7/425—Thermal management of integrated systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature

Abstract

An apparatus and method are provided which preferably combines temperature sensing and prediction for more accurate temperature control of integrated circuits. An IC temperature sensing and prediction device (20) includes a current sensing device (26) that measures current passing through an IC (24), and a temperature control apparatus (28) that measures a surface temperature of the IC (24). The device further includes an electronic controller (30) that calculates the power consumed by the IC (24) according to the measured current and adjusts the temperature of a heater or cooler (28) responsive to the measured surface temperature and power consumption.
PCT/US2006/007687 2005-03-08 2006-03-03 Temperature sensing and prediction in ic sockets WO2006096543A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008500780A JP2008537637A (en) 2005-03-08 2006-03-03 Temperature detection and prediction in IC sockets
EP06736932A EP1866656A2 (en) 2005-03-08 2006-03-03 Temperature sensing and prediction in ic sockets

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US65980805P 2005-03-08 2005-03-08
US60/659,808 2005-03-08

Publications (2)

Publication Number Publication Date
WO2006096543A2 WO2006096543A2 (en) 2006-09-14
WO2006096543A3 true WO2006096543A3 (en) 2009-04-16

Family

ID=36953894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/007687 WO2006096543A2 (en) 2005-03-08 2006-03-03 Temperature sensing and prediction in ic sockets

Country Status (5)

Country Link
EP (1) EP1866656A2 (en)
JP (1) JP2008537637A (en)
KR (1) KR20070114310A (en)
CN (1) CN101495821A (en)
WO (1) WO2006096543A2 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110106476A1 (en) * 2009-11-04 2011-05-05 Gm Global Technology Operations, Inc. Methods and systems for thermistor temperature processing
US8384395B2 (en) * 2010-05-06 2013-02-26 Texas Instrument Incorporated Circuit for controlling temperature and enabling testing of a semiconductor chip
JP4891423B2 (en) * 2010-06-01 2012-03-07 ファナック株式会社 Abnormality inspection system for cooling part of electronic circuit
CN102636291B (en) * 2011-02-15 2013-12-25 三一电气有限责任公司 IGBT (insulated gate bipolar transistor) conjunction temperature detection device and method thereof
US8547122B2 (en) * 2011-07-11 2013-10-01 Microchip Technology Incorporated Temperature measurement of active device under test on strip tester
JP5742642B2 (en) * 2011-10-06 2015-07-01 三菱電機株式会社 Semiconductor element junction temperature estimation method, estimation system, and estimation program
WO2013066292A1 (en) 2011-10-31 2013-05-10 Hewlett-Packard Development Company, L.P. Airflow block response in a system
KR101942027B1 (en) * 2012-03-28 2019-04-11 삼성전자 주식회사 Method for predicting temperature in device
CN103364739B (en) * 2012-03-29 2016-04-20 北京动力源科技股份有限公司 A kind of node method for testing temperature rise of Switching Power Supply breaker in middle pipe
KR101600176B1 (en) * 2014-04-11 2016-03-07 영남대학교 산학협력단 Using the thermal resistance of the heat sink LED module combines state inspection system and Using the thermal resistance of the heat sink LED module combines state inspection method
JP6417700B2 (en) 2014-04-23 2018-11-07 富士通株式会社 Semiconductor parts and electronic equipment
CN106546357B (en) * 2015-09-23 2020-06-02 中兴通讯股份有限公司 Method and device for detecting environment temperature and electronic equipment
US10782316B2 (en) 2017-01-09 2020-09-22 Delta Design, Inc. Socket side thermal system
CN110928340B (en) * 2018-09-19 2021-12-24 中车株洲电力机车研究所有限公司 Active junction temperature control system and method for power device
TWI701447B (en) * 2019-03-15 2020-08-11 鴻勁精密股份有限公司 Test device with temperature control unit and test classification equipment for its application
CN113182198B (en) * 2020-01-14 2023-08-29 鸿劲精密股份有限公司 Testing device with temperature control unit and testing classification equipment applied by same
CN111310362B (en) * 2020-04-01 2023-11-10 纬湃科技投资(中国)有限公司 Temperature estimation method for direct current bus connector and computer readable storage medium
CN111443278B (en) * 2020-04-21 2022-10-18 普源精电科技股份有限公司 Chip, chip temperature detection module and method
CN111883516A (en) * 2020-07-24 2020-11-03 青岛歌尔智能传感器有限公司 Packaging structure and packaging method of integrated module and electronic equipment
KR20240027784A (en) 2021-06-30 2024-03-04 델타 디자인, 인코포레이티드 Temperature control system including contactor assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US20040232933A1 (en) * 2001-12-19 2004-11-25 Fujitsu Limited Dynamic burn-in equipment

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000304804A (en) * 1999-04-26 2000-11-02 Denken Eng Kk Burn-in device and burn-in method

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6668570B2 (en) * 2001-05-31 2003-12-30 Kryotech, Inc. Apparatus and method for controlling the temperature of an electronic device under test
US20040232933A1 (en) * 2001-12-19 2004-11-25 Fujitsu Limited Dynamic burn-in equipment

Also Published As

Publication number Publication date
JP2008537637A (en) 2008-09-18
EP1866656A2 (en) 2007-12-19
WO2006096543A2 (en) 2006-09-14
CN101495821A (en) 2009-07-29
KR20070114310A (en) 2007-11-30

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