WO2006089026A3 - Printed conductive connectors - Google Patents

Printed conductive connectors Download PDF

Info

Publication number
WO2006089026A3
WO2006089026A3 PCT/US2006/005478 US2006005478W WO2006089026A3 WO 2006089026 A3 WO2006089026 A3 WO 2006089026A3 US 2006005478 W US2006005478 W US 2006005478W WO 2006089026 A3 WO2006089026 A3 WO 2006089026A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact pad
semiconductor substrate
methods
elongate strip
conductive
Prior art date
Application number
PCT/US2006/005478
Other languages
French (fr)
Other versions
WO2006089026A2 (en
Inventor
Frank E Anderson
Richard E Croley Jr
Paul T Spivey
Carl E Sullivan
Original Assignee
Lexmark Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lexmark Int Inc filed Critical Lexmark Int Inc
Publication of WO2006089026A2 publication Critical patent/WO2006089026A2/en
Publication of WO2006089026A3 publication Critical patent/WO2006089026A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14016—Structure of bubble jet print heads
    • B41J2/14072—Electrical connections, e.g. details on electrodes, connecting the chip to the outside...
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49401—Fluid pattern dispersing device making, e.g., ink jet

Abstract

Methods of connecting a circuit device (54) to a semiconductor substrate and micro- fluid ejection devices made by the methods. One method includes printing an elongate strip (48) of an electrically conductive fluid to electrically interconnect a first contact pad (50) on a semiconductor substrate containing fluid ejection actuator devices with a second contact pad (52) on an electrical trace circuit (54), wherein the electrical trace circuit (54) is disposed adjacent to and spaced-apart from the semiconductor substrate. The electrically conductive fluid contains a liquid component and a conductive particle component. The liquid component is removed from the conductive particle component to provide a solid elongate strip (48) of conductive material interconnecting the first contact pad (50) and the second contact pad (52).
PCT/US2006/005478 2005-02-18 2006-02-16 Printed conductive connectors WO2006089026A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/062,019 US7354794B2 (en) 2005-02-18 2005-02-18 Printed conductive connectors
US11/062,019 2005-02-18

Publications (2)

Publication Number Publication Date
WO2006089026A2 WO2006089026A2 (en) 2006-08-24
WO2006089026A3 true WO2006089026A3 (en) 2007-09-20

Family

ID=36912232

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2006/005478 WO2006089026A2 (en) 2005-02-18 2006-02-16 Printed conductive connectors

Country Status (3)

Country Link
US (1) US7354794B2 (en)
TW (1) TW200640693A (en)
WO (1) WO2006089026A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080041269A1 (en) * 2006-08-16 2008-02-21 Rahel Bekru Bogale Silver ink containing humectant mixture for inkjet printing
JP5008451B2 (en) 2007-05-08 2012-08-22 キヤノン株式会社 Liquid discharge head and method of manufacturing liquid discharge head
US7681991B2 (en) * 2007-06-04 2010-03-23 Lexmark International, Inc. Composite ceramic substrate for micro-fluid ejection head
US20170356640A1 (en) 2016-06-10 2017-12-14 Innotec, Corp. Illumination assembly including thermal energy management
CN110770031A (en) * 2017-07-26 2020-02-07 惠普发展公司，有限责任合伙企业 Die contact structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6449831B1 (en) * 1998-06-19 2002-09-17 Lexmark International, Inc Process for making a heater chip module
US20030083203A1 (en) * 2001-10-22 2003-05-01 Seiko Epson Corporation Apparatus and methods for forming film pattern
US6750547B2 (en) * 2001-12-26 2004-06-15 Micron Technology, Inc. Multi-substrate microelectronic packages and methods for manufacture

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US3800020A (en) * 1972-03-23 1974-03-26 Cramer P Co Method of making a circuit board
US4532152A (en) * 1982-03-05 1985-07-30 Elarde Vito D Fabrication of a printed circuit board with metal-filled channels
US4604678A (en) * 1983-07-18 1986-08-05 Frederick Parker Circuit board with high density electrical tracers
US4614837A (en) * 1985-04-03 1986-09-30 Allied Corporation Method for placing electrically conductive paths on a substrate
JPS63291493A (en) 1987-05-22 1988-11-29 Sharp Corp Jumper connection of circuit pattern
JPS6464290A (en) 1987-09-03 1989-03-10 Murata Manufacturing Co Conductor pattern forming method
US4985601A (en) * 1989-05-02 1991-01-15 Hagner George R Circuit boards with recessed traces
US5114744A (en) * 1989-08-21 1992-05-19 Hewlett-Packard Company Method for applying a conductive trace pattern to a substrate
US5142444A (en) * 1989-08-31 1992-08-25 Hewlett-Packard Company Demountable tape-automated bonding system
US5250758A (en) * 1991-05-21 1993-10-05 Elf Technologies, Inc. Methods and systems of preparing extended length flexible harnesses
JPH06252532A (en) 1993-02-25 1994-09-09 Sega Enterp Ltd Manufacture of wiring board
JP2665134B2 (en) * 1993-09-03 1997-10-22 日本黒鉛工業株式会社 Flexible circuit board and method of manufacturing the same
KR100339767B1 (en) * 1993-12-09 2002-11-30 메소드 일렉트로닉스 인코포레이티드 Electrical connector for electric signal transmission and its manufacturing method
US5758575A (en) * 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
US6639578B1 (en) * 1995-07-20 2003-10-28 E Ink Corporation Flexible displays
CA2224236A1 (en) * 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
US6177921B1 (en) * 1997-08-28 2001-01-23 E Ink Corporation Printable electrode structures for displays
CA2306384A1 (en) * 1997-10-14 1999-04-22 Patterning Technologies Limited Method of forming an electronic device
US6697694B2 (en) * 1998-08-26 2004-02-24 Electronic Materials, L.L.C. Apparatus and method for creating flexible circuits
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JP4212691B2 (en) 1998-11-24 2009-01-21 大日本印刷株式会社 Non-contact IC card and manufacturing method thereof
JP2000174400A (en) * 1998-12-10 2000-06-23 Alps Electric Co Ltd Flexible printed board
DE19931113A1 (en) 1999-07-06 2001-01-25 Ekra Eduard Kraft Gmbh Method for applying connecting materials for a connection between a microchip and a substrate, method for producing an electrical and mechanical connection between a microchip and a substrate and use of a printhead which works according to the ink printing principle
JP2001243836A (en) * 1999-12-21 2001-09-07 Murata Mfg Co Ltd Conductive paste and printed circuit board using it
SE519904C2 (en) 2000-12-29 2003-04-22 Amc Centurion Ab Manufacture of antenna devices
JP3774638B2 (en) 2001-04-24 2006-05-17 ハリマ化成株式会社 Circuit pattern forming method using inkjet printing method
US6619786B2 (en) * 2001-06-08 2003-09-16 Lexmark International, Inc. Tab circuit for ink jet printer cartridges
JP2003152299A (en) * 2001-07-10 2003-05-23 Canon Inc Wiring connection structure and its manufacturing method
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US7442408B2 (en) * 2002-03-26 2008-10-28 Hewlett-Packard Development Company, L.P. Methods for ink-jet printing circuitry
JP4026388B2 (en) 2002-03-28 2007-12-26 三菱電機株式会社 Printed wiring board and manufacturing method thereof
US6866799B2 (en) * 2002-05-09 2005-03-15 Anuvu, Inc. Water-soluble electrically conductive composition, modifications, and applications thereof
EP1383364A3 (en) * 2002-05-23 2006-01-04 Nashua Corporation Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
KR100499289B1 (en) * 2003-02-07 2005-07-04 삼성전자주식회사 Semiconductor package having pattern lead and method for manufacturing thereof

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6449831B1 (en) * 1998-06-19 2002-09-17 Lexmark International, Inc Process for making a heater chip module
US20030083203A1 (en) * 2001-10-22 2003-05-01 Seiko Epson Corporation Apparatus and methods for forming film pattern
US6750547B2 (en) * 2001-12-26 2004-06-15 Micron Technology, Inc. Multi-substrate microelectronic packages and methods for manufacture

Also Published As

Publication number Publication date
US20060187267A1 (en) 2006-08-24
WO2006089026A2 (en) 2006-08-24
US7354794B2 (en) 2008-04-08
TW200640693A (en) 2006-12-01

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