WO2006066136A3 - System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece - Google Patents

System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece Download PDF

Info

Publication number
WO2006066136A3
WO2006066136A3 PCT/US2005/045783 US2005045783W WO2006066136A3 WO 2006066136 A3 WO2006066136 A3 WO 2006066136A3 US 2005045783 W US2005045783 W US 2005045783W WO 2006066136 A3 WO2006066136 A3 WO 2006066136A3
Authority
WO
WIPO (PCT)
Prior art keywords
workpiece
subsystem
scattered light
inspecting
region above
Prior art date
Application number
PCT/US2005/045783
Other languages
French (fr)
Other versions
WO2006066136A2 (en
Inventor
Richard Earl Bills
Neil Judell
Original Assignee
Ade Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ade Corp filed Critical Ade Corp
Publication of WO2006066136A2 publication Critical patent/WO2006066136A2/en
Publication of WO2006066136A3 publication Critical patent/WO2006066136A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501Semiconductor wafers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21Polarisation-affecting properties
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N21/4738Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N21/4738Diffuse reflection, e.g. also for testing fluids, fibrous materials
    • G01N21/474Details of optical heads therefor, e.g. using optical fibres
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55Specular reflectivity
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N2021/4704Angular selective
    • G01N2021/4707Forward scatter; Low angle scatter
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N2021/4704Angular selective
    • G01N2021/4711Multiangle measurement
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N2021/4792Polarisation of scatter light
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/55Specular reflectivity
    • G01N2021/556Measuring separately scattering and specular
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8848Polarisation of light
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8861Determining coordinates of flaws
    • G01N2021/8864Mapping zones of defects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8877Proximity analysis, local statistics
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8896Circuits specially adapted for system specific signal conditioning
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/06Illumination; Optics
    • G01N2201/061Sources
    • G01N2201/06113Coherent sources; lasers
    • G01N2201/0612Laser diodes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00Features of devices classified in G01N21/00
    • G01N2201/10Scanning
    • G01N2201/105Purely optical scan
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00Indexing scheme for image analysis or image enhancement
    • G06T2207/30Subject of image; Context of image processing
    • G06T2207/30108Industrial image inspection
    • G06T2207/30148Semiconductor; IC; Wafer
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49826Assembling or joining

Abstract

A surface inspection system includes a beam source subsystem, a beam scanning subsystem, a workpiece movement subsystem, an optical collection and detection subsystem, and a processing subsystem. The optical collection and detection system features back collectors disposed in the back quartersphere, outside the incident plane, for collecting light scattered from the surface of the workpiece. The back collectors are disposed at a relative minimum in the portion of scattered light attributable to haze relative to the portion of scattered light attributable to defect scatter portion, or, alternatively, at a relative minimum in the Rayleigh scatter.
PCT/US2005/045783 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece WO2006066136A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US63852904P 2004-12-19 2004-12-19
US60/638,529 2004-12-19

Publications (2)

Publication Number Publication Date
WO2006066136A2 WO2006066136A2 (en) 2006-06-22
WO2006066136A3 true WO2006066136A3 (en) 2008-04-03

Family

ID=36588613

Family Applications (9)

Application Number Title Priority Date Filing Date
PCT/US2005/045782 WO2006066135A2 (en) 2004-12-19 2005-12-17 System and method for signal processing for a workpiece surface inspection
PCT/US2005/045786 WO2006066139A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface by analyzing scattered in a front quartersphere region above the workpiece
PCT/US2005/045930 WO2006066206A2 (en) 2004-12-19 2005-12-17 System and method for controlling light scattered from a workpiece surface in a surface inspection system
PCT/US2005/045929 WO2006066205A2 (en) 2004-12-19 2005-12-17 System and method for inspection of a workpiece surface using multiple scattered light collectors
PCT/US2005/045784 WO2006066137A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface using polarization of scattered light
PCT/US2005/045785 WO2006066138A2 (en) 2004-12-19 2005-12-17 System and method for controlling a beam source in a workpiece surface inspection system
PCT/US2005/046181 WO2006066255A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface using surface structure spatial frequencies
PCT/US2005/045931 WO2006066207A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface using combinations of light collectors
PCT/US2005/045783 WO2006066136A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece

Family Applications Before (8)

Application Number Title Priority Date Filing Date
PCT/US2005/045782 WO2006066135A2 (en) 2004-12-19 2005-12-17 System and method for signal processing for a workpiece surface inspection
PCT/US2005/045786 WO2006066139A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface by analyzing scattered in a front quartersphere region above the workpiece
PCT/US2005/045930 WO2006066206A2 (en) 2004-12-19 2005-12-17 System and method for controlling light scattered from a workpiece surface in a surface inspection system
PCT/US2005/045929 WO2006066205A2 (en) 2004-12-19 2005-12-17 System and method for inspection of a workpiece surface using multiple scattered light collectors
PCT/US2005/045784 WO2006066137A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface using polarization of scattered light
PCT/US2005/045785 WO2006066138A2 (en) 2004-12-19 2005-12-17 System and method for controlling a beam source in a workpiece surface inspection system
PCT/US2005/046181 WO2006066255A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface using surface structure spatial frequencies
PCT/US2005/045931 WO2006066207A2 (en) 2004-12-19 2005-12-17 System and method for inspecting a workpiece surface using combinations of light collectors

Country Status (2)

Country Link
US (21) US20060192950A1 (en)
WO (9) WO2006066135A2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8422010B2 (en) 2006-02-09 2013-04-16 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of a wafer

Families Citing this family (180)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060192950A1 (en) 2004-12-19 2006-08-31 Neil Judell System and method for inspecting a workpiece surface using combinations of light collectors
US7375362B2 (en) * 2005-01-13 2008-05-20 Wd Media, Inc. Method and apparatus for reducing or eliminating stray light in an optical test head
WO2006079537A2 (en) * 2005-01-26 2006-08-03 Carl Zeiss Smt Ag Optical assembly
JP4402004B2 (en) * 2005-04-15 2010-01-20 株式会社日立ハイテクノロジーズ Inspection device
US7336222B2 (en) * 2005-06-23 2008-02-26 Enerlab, Inc. System and method for measuring characteristics of a continuous medium and/or localized targets using multiple sensors
JP2007024737A (en) 2005-07-20 2007-02-01 Hitachi High-Technologies Corp Semiconductor defect inspection device and method thereof
US8862445B2 (en) * 2005-11-28 2014-10-14 Halliburton Energy Services, Inc. Selecting spectral elements and components for optical analysis systems
CN101336414A (en) * 2005-11-30 2008-12-31 3M创新有限公司 Method and apparatus for simulation of optical systems
US7898520B2 (en) * 2005-11-30 2011-03-01 3M Innovative Properties Company Method and apparatus for backlight simulation
US7372559B2 (en) * 2005-12-14 2008-05-13 Kla-Tencor Technologies Corp. Systems and methods for inspecting a wafer with increased sensitivity
US20070150094A1 (en) * 2005-12-23 2007-06-28 Qingfeng Huang System and method for planning and indirectly guiding robotic actions based on external factor tracking and analysis
US7436505B2 (en) * 2006-04-04 2008-10-14 Kla-Tencor Technologies Corp. Computer-implemented methods and systems for determining a configuration for a light scattering inspection system
US8254020B2 (en) * 2006-04-20 2012-08-28 Washington University Objective-coupled selective plane illumination microscopy
US7528944B2 (en) * 2006-05-22 2009-05-05 Kla-Tencor Technologies Corporation Methods and systems for detecting pinholes in a film formed on a wafer or for monitoring a thermal process tool
US7711177B2 (en) * 2006-06-08 2010-05-04 Kla-Tencor Technologies Corp. Methods and systems for detecting defects on a specimen using a combination of bright field channel data and dark field channel data
WO2008001922A1 (en) * 2006-06-27 2008-01-03 Nec Corporation Method for analyzing warp of board or electronic component, system for analyzing warp of board or electronic component and program for analyzing warp of board or electronic component
JP2008034817A (en) * 2006-06-30 2008-02-14 Toshiba Corp Alarm device
JP4843399B2 (en) * 2006-07-31 2011-12-21 株式会社日立ハイテクノロジーズ Inspection apparatus and inspection method
US7564564B2 (en) * 2006-08-22 2009-07-21 Artium Technologies, Inc. Automatic set-up for instrument functions
US20080068593A1 (en) * 2006-09-13 2008-03-20 Hiroyuki Nakano Method and apparatus for detecting defects
US8260035B2 (en) * 2006-09-22 2012-09-04 Kla-Tencor Corporation Threshold determination in an inspection system
US20090073440A1 (en) * 2006-09-30 2009-03-19 Timothy Tiemeyer System and method for detecting surface features on a semiconductor workpiece surface
JP5006005B2 (en) * 2006-10-16 2012-08-22 株式会社日立ハイテクノロジーズ Foreign matter inspection apparatus and foreign matter inspection method
WO2008082411A1 (en) * 2007-01-03 2008-07-10 General Electric Company Method for examining molds and apparatus for accomplishing the same
US7835015B1 (en) * 2007-03-05 2010-11-16 Kla-Tencor Corporation Auto focus system for reticle inspection
US20080239904A1 (en) * 2007-03-28 2008-10-02 Minoru Yoshida Method and apparatus for inspecting a surface of a specimen
US7710557B2 (en) * 2007-04-25 2010-05-04 Hitachi High-Technologies Corporation Surface defect inspection method and apparatus
JP5132982B2 (en) * 2007-05-02 2013-01-30 株式会社日立ハイテクノロジーズ Pattern defect inspection apparatus and method
JP2009014510A (en) * 2007-07-04 2009-01-22 Hitachi High-Technologies Corp Inspection method and inspection apparatus
US8611639B2 (en) 2007-07-30 2013-12-17 Kla-Tencor Technologies Corp Semiconductor device property extraction, generation, visualization, and monitoring methods
US7453562B1 (en) * 2007-09-06 2008-11-18 Kla-Tencor Corporation Ellipsometry measurement and analysis
US8267388B2 (en) * 2007-09-12 2012-09-18 Xradia, Inc. Alignment assembly
JP2009139248A (en) * 2007-12-07 2009-06-25 Hitachi High-Technologies Corp Defect detecting optical system and surface defect inspecting device for mounting defect detecting image processing
US7756658B2 (en) 2008-05-14 2010-07-13 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer and generating inspection results for the wafer
JP5624714B2 (en) * 2008-05-23 2014-11-12 株式会社日立ハイテクノロジーズ Inspection method and inspection apparatus for substrate surface
US7912658B2 (en) * 2008-05-28 2011-03-22 Kla-Tencor Corp. Systems and methods for determining two or more characteristics of a wafer
US7962234B2 (en) * 2008-06-09 2011-06-14 International Business Machines Corporation Multidimensional process window optimization in semiconductor manufacturing
WO2009155502A2 (en) 2008-06-19 2009-12-23 Kla-Tencor Corporation Computer-implemented methods, computer-readable media, and systems for determining one or more characteristics of a wafer
US8269960B2 (en) 2008-07-24 2012-09-18 Kla-Tencor Corp. Computer-implemented methods for inspecting and/or classifying a wafer
WO2010013232A1 (en) * 2008-07-29 2010-02-04 Applied Materials Israel Ltd. Mapping variations of a surface
JP5341440B2 (en) * 2008-09-10 2013-11-13 株式会社日立ハイテクノロジーズ Inspection device
JP5027775B2 (en) * 2008-10-03 2012-09-19 株式会社日立ハイテクノロジーズ Substrate surface shape detection method and apparatus
JP5332478B2 (en) 2008-10-06 2013-11-06 株式会社Sumco Laser scattering type defect inspection apparatus and laser scattering type defect inspection method
JP5357509B2 (en) * 2008-10-31 2013-12-04 株式会社日立ハイテクノロジーズ Inspection device, inspection method, and calibration system for inspection device
JP2010145468A (en) * 2008-12-16 2010-07-01 Canon Inc Height detection device and toner height detection apparatus using the same
JP2010197352A (en) 2009-02-27 2010-09-09 Hitachi High-Technologies Corp Defect inspection method and defect inspecting apparatus
JP2010217129A (en) * 2009-03-19 2010-09-30 Hitachi High-Technologies Corp Inspecting method and device
DE102009044151B4 (en) * 2009-05-19 2012-03-29 Kla-Tencor Mie Gmbh Device for optical wafer inspection
JP5458683B2 (en) * 2009-06-08 2014-04-02 株式会社Sumco Non-defective judgment method of semiconductor wafer using laser scattering method
US8311659B1 (en) * 2009-09-09 2012-11-13 Xilinx, Inc. Identifying non-randomness in integrated circuit product yield
DE102009042986B3 (en) * 2009-09-25 2011-03-03 Precitec Kg Welding head and method for joining a workpiece
JP2011075406A (en) 2009-09-30 2011-04-14 Hitachi High-Technologies Corp Surface defect inspection method and apparatus of the same
JP5216752B2 (en) 2009-11-18 2013-06-19 株式会社日立ハイテクノロジーズ Defect detection method, defect detection apparatus, and defect observation apparatus provided with the same
US9268466B2 (en) * 2009-12-09 2016-02-23 Citrix Systems, Inc. Methods and systems for updating a dock with a user interface element representative of a remote application
JP5308327B2 (en) * 2009-12-28 2013-10-09 株式会社日立ハイテクノロジーズ Optical magnetic disk defect inspection method and apparatus
JP5295160B2 (en) * 2010-03-30 2013-09-18 株式会社日立ハイテクノロジーズ Surface inspection apparatus and surface inspection method
CN102834689B (en) * 2010-04-01 2014-05-28 新日铁住金株式会社 Particle measuring system and particle measuring method
JP5597056B2 (en) * 2010-08-02 2014-10-01 株式会社キーエンス Image measuring apparatus, image measuring method, and program for image measuring apparatus
JP5469012B2 (en) * 2010-08-06 2014-04-09 本田技研工業株式会社 Imaging apparatus and imaging method of imaging apparatus
DE102010046433B4 (en) * 2010-09-24 2012-06-21 Grenzebach Maschinenbau Gmbh Apparatus and method for detecting defects in continuously generated float glass
EP2650673B1 (en) * 2010-12-08 2022-03-02 Hitachi High-Tech Corporation Automatic analytical apparatus
US8891079B2 (en) 2010-12-16 2014-11-18 Kla-Tencor Corp. Wafer inspection
DE102010063337B9 (en) * 2010-12-17 2020-05-07 Carl Zeiss Ag Process for mask inspection and process for emulating imaging properties
WO2012090392A1 (en) 2010-12-27 2012-07-05 株式会社 日立ハイテクノロジーズ Measuring device
US8456390B2 (en) 2011-01-31 2013-06-04 Global Oled Technology Llc Electroluminescent device aging compensation with multilevel drive
EP2505987B1 (en) * 2011-03-30 2013-03-27 C.R.F. Società Consortile per Azioni Method for determining the bidirectional reflectance distribution function (BRDF) of a surface
EP2726887B1 (en) * 2011-07-01 2015-03-25 Telefonaktiebolaget LM Ericsson (PUBL) Device and method for emi source location
US9279774B2 (en) 2011-07-12 2016-03-08 Kla-Tencor Corp. Wafer inspection
US8970691B2 (en) 2011-08-26 2015-03-03 Microsoft Technology Licensing, Llc Removal of rayleigh scattering from images
JP5581282B2 (en) * 2011-08-31 2014-08-27 株式会社日立ハイテクノロジーズ Surface shape measuring device
JP2013178231A (en) * 2012-02-01 2013-09-09 Canon Inc Inspection device, inspection method, lithography device and imprinting device
WO2013118543A1 (en) 2012-02-09 2013-08-15 株式会社 日立ハイテクノロジーズ Surface measurement device
JP2013205239A (en) * 2012-03-28 2013-10-07 Hitachi High-Technologies Corp Method for inspecting substrate surface and device therefor
JP6004421B2 (en) * 2012-03-30 2016-10-05 株式会社日立ハイテクノロジーズ Image sensor, inspection device, and detection device
MY182531A (en) 2012-05-09 2021-01-25 Seagate Technology Llc Surface features mapping
WO2013191682A1 (en) * 2012-06-19 2013-12-27 Ardic Instruments Co. Surface characterization system
KR102095947B1 (en) 2012-06-29 2020-04-02 루돌프 테크놀로지스 인코퍼레이티드 Flying sensor head
US9212900B2 (en) 2012-08-11 2015-12-15 Seagate Technology Llc Surface features characterization
US9297759B2 (en) 2012-10-05 2016-03-29 Seagate Technology Llc Classification of surface features using fluorescence
US9297751B2 (en) 2012-10-05 2016-03-29 Seagate Technology Llc Chemical characterization of surface features
US9355440B1 (en) * 2012-10-10 2016-05-31 Kla-Tencor Corp. Detection of selected defects in relatively noisy inspection data
US9377394B2 (en) 2012-10-16 2016-06-28 Seagate Technology Llc Distinguishing foreign surface features from native surface features
US8786850B2 (en) 2012-10-29 2014-07-22 Kla-Tencor Corporation Illumination energy management in surface inspection
US9879977B2 (en) 2012-11-09 2018-01-30 Kla-Tencor Corporation Apparatus and method for optical metrology with optimized system parameters
JP2014103353A (en) * 2012-11-22 2014-06-05 Samsung R&D Institute Japan Co Ltd Recognition device, recognition method, mounting device, and mounting method
US9217714B2 (en) 2012-12-06 2015-12-22 Seagate Technology Llc Reflective surfaces for surface features of an article
NL2009980C2 (en) * 2012-12-13 2014-06-16 Ct Voor Tech Informatica B V A method of producing glass products from glass product material and an assembly for performing said method.
CN105008853B (en) * 2013-02-14 2017-12-01 Qso干涉系统股份公司 The method and apparatus of the surface accuracy in quantitative measurment region
JP6128902B2 (en) * 2013-03-08 2017-05-17 株式会社ミツトヨ Shape measuring device
JP6066192B2 (en) * 2013-03-12 2017-01-25 株式会社荏原製作所 Polishing pad surface texture measuring device
WO2014145471A1 (en) * 2013-03-15 2014-09-18 Carnegie Mellon University A supervised autonomous robotic system for complex surface inspection and processing
FR3004259B1 (en) * 2013-04-05 2015-05-15 Commissariat Energie Atomique OPTICAL METHOD FOR CHARACTERIZING A DIFFRACTIVE SURFACE AND APPARATUS FOR IMPLEMENTING SUCH A METHOD
US9619878B2 (en) * 2013-04-16 2017-04-11 Kla-Tencor Corporation Inspecting high-resolution photolithography masks
US9217715B2 (en) * 2013-05-30 2015-12-22 Seagate Technology Llc Apparatuses and methods for magnetic features of articles
US9513215B2 (en) * 2013-05-30 2016-12-06 Seagate Technology Llc Surface features by azimuthal angle
US9201019B2 (en) * 2013-05-30 2015-12-01 Seagate Technology Llc Article edge inspection
US9274064B2 (en) 2013-05-30 2016-03-01 Seagate Technology Llc Surface feature manager
US9581554B2 (en) * 2013-05-30 2017-02-28 Seagate Technology Llc Photon emitter array
MY179786A (en) * 2013-06-03 2020-11-14 Xtralis Technologies Ltd Particle detection system and related methods
US9782855B2 (en) * 2013-06-11 2017-10-10 Fundació Institut De Ciències Fotòniques Protective structure for tables and optical table comprising said protective structure
WO2014200648A2 (en) * 2013-06-14 2014-12-18 Kla-Tencor Corporation System and method for determining the position of defects on objects, coordinate measuring unit and computer program for coordinate measuring unit
US9240042B2 (en) * 2013-10-24 2016-01-19 Globalfoundries Inc. Wafer slip detection during CMP processing
JP6288549B2 (en) * 2013-10-24 2018-03-07 株式会社リコー Optical sensor, image forming apparatus including the same, and apparatus and method for discriminating paper type
JP2017515118A (en) * 2014-05-01 2017-06-08 アリゾナ ボード オブ リージェンツ オン ビハーフ オブ アリゾナ ステート ユニバーシティ Flexible optical biosensor for multiple pathogen detection
JP6424020B2 (en) * 2014-06-09 2018-11-14 株式会社キーエンス Image inspection apparatus, image inspection method, image inspection program, computer-readable recording medium, and recorded apparatus
US9217713B1 (en) * 2014-06-19 2015-12-22 The Boeing Company System and method for detecting pin-holes in fiberglass and composite parts
MX355451B (en) 2014-06-20 2018-04-18 Velo3D Inc Apparatuses, systems and methods for three-dimensional printing.
JP6251647B2 (en) * 2014-07-15 2017-12-20 株式会社ニューフレアテクノロジー Mask inspection apparatus and mask inspection method
US9784691B2 (en) * 2014-07-31 2017-10-10 Zeta Instruments, Inc. Method and apparatus to optically detect defects in transparent solids
JP6377459B2 (en) * 2014-08-29 2018-08-22 株式会社ディスコ Wafer inspection method, grinding and polishing equipment
EP3201310B1 (en) * 2014-10-01 2021-02-17 Purdue Research Foundation Microorganism identification
JP6553940B2 (en) * 2015-05-15 2019-07-31 株式会社ディスコ Laser processing equipment
CN104966308B (en) * 2015-06-12 2017-12-01 深圳大学 A kind of method for calculating laser beam spot size
RU2017144105A (en) 2015-06-19 2019-07-22 АйПиДжи Фотоникс Корпорейшен LASER CUTTER HEAD WITH ADJUSTABLE COLLIMATOR SUPPLIED WITH MOBILE LENSES FOR ADJUSTING THE BEAM DIAMETER AND / OR FOCAL POINT LOCATION
CN105182101B (en) * 2015-07-06 2018-07-27 京东方科技集团股份有限公司 Undesirable method and apparatus are detected in touch screen pressing test
DE102015009728B4 (en) * 2015-07-31 2018-10-25 Airbus Defence and Space GmbH Probabilistic error detection in laid fiber bands
US10088298B2 (en) 2015-09-04 2018-10-02 Kla-Tencor Corporation Method of improving lateral resolution for height sensor using differential detection technology for semiconductor inspection and metrology
WO2017079091A1 (en) 2015-11-06 2017-05-11 Velo3D, Inc. Adept three-dimensional printing
US20170160207A1 (en) * 2015-12-05 2017-06-08 Ming-Sheng Chen Machine for detecting tiny particles
US10183330B2 (en) 2015-12-10 2019-01-22 Vel03D, Inc. Skillful three-dimensional printing
FR3045156B1 (en) * 2015-12-11 2017-12-22 Soitec Silicon On Insulator FAULT DETECTION METHOD AND DEVICE THEREFOR
KR102618813B1 (en) * 2016-01-27 2023-12-27 삼성전자주식회사 Apparatus for monitoring a process chamber
CN108883575A (en) 2016-02-18 2018-11-23 维洛3D公司 Accurate 3 D-printing
JP6719246B2 (en) * 2016-03-25 2020-07-08 キヤノン株式会社 Measuring method, measuring apparatus, lithographic apparatus, and article manufacturing method
JP6117398B1 (en) * 2016-03-30 2017-04-19 日新製鋼株式会社 Steel plate surface defect inspection apparatus and surface defect inspection method
WO2018005439A1 (en) 2016-06-29 2018-01-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
US11691343B2 (en) 2016-06-29 2023-07-04 Velo3D, Inc. Three-dimensional printing and three-dimensional printers
KR20180028787A (en) * 2016-09-09 2018-03-19 삼성전자주식회사 Defect inspection system and method, and method for fabricating semiconductor using the inspection method
US10697756B2 (en) * 2016-09-15 2020-06-30 Delavan Inc. 3D scanning systems
US10739275B2 (en) * 2016-09-15 2020-08-11 Kla-Tencor Corporation Simultaneous multi-directional laser wafer inspection
US10768533B2 (en) * 2016-10-20 2020-09-08 Kla-Tencor Corporation Method and system for generating programmed defects for use in metrology measurements
JP6622679B2 (en) * 2016-10-26 2019-12-18 川崎重工業株式会社 Circle scratch inspection device
US20180126460A1 (en) 2016-11-07 2018-05-10 Velo3D, Inc. Gas flow in three-dimensional printing
US10572570B2 (en) * 2016-11-14 2020-02-25 Blackberry Limited Determining a load status of a platform using a likelihood ratio test
JP7063610B2 (en) * 2016-12-27 2022-05-09 株式会社前川製作所 Protein amount measuring method and measuring device
US20180186081A1 (en) * 2017-01-05 2018-07-05 Velo3D, Inc. Optics in three-dimensional printing
WO2018132258A1 (en) * 2017-01-10 2018-07-19 Sunspring America, Inc. Technologies for identifying defects
KR101803503B1 (en) * 2017-02-06 2017-11-30 주식회사 풍산에프앤에스 Accurate measuring system and its method of structure
US20180246034A1 (en) * 2017-02-24 2018-08-30 GM Global Technology Operations LLC Methods for characterizing engine block bore surfaces and apparatus therefor
WO2018160807A1 (en) 2017-03-02 2018-09-07 Velo3D, Inc. Three-dimensional printing of three dimensional objects
US20180281282A1 (en) 2017-03-28 2018-10-04 Velo3D, Inc. Material manipulation in three-dimensional printing
JP2020524123A (en) * 2017-05-31 2020-08-13 ニプロ株式会社 Evaluation method for glass containers
US10192301B1 (en) * 2017-08-16 2019-01-29 Siemens Energy, Inc. Method and system for detecting line defects on surface of object
US10215714B1 (en) * 2017-08-16 2019-02-26 Siemens Energy, Inc. Method and system for detecting defects on surface of object
US11120539B2 (en) * 2017-11-30 2021-09-14 Taiwan Semiconductor Manufacturing Co., Ltd. Topological scanning method and system
CN110044295B (en) * 2017-11-30 2021-12-03 台湾积体电路制造股份有限公司 Method for scanning and analyzing a surface, inspection system and computer readable medium therefor
US10416061B2 (en) * 2017-12-08 2019-09-17 Fca Us Llc Blank washer inspection system
US10272525B1 (en) 2017-12-27 2019-04-30 Velo3D, Inc. Three-dimensional printing systems and methods of their use
WO2019159334A1 (en) 2018-02-16 2019-08-22 株式会社日立ハイテクノロジーズ Defect inspection device
JP2019158345A (en) * 2018-03-07 2019-09-19 株式会社東芝 Inspection system, inspection method, program, and storage medium
US20190355110A1 (en) * 2018-05-15 2019-11-21 Camtek Ltd. Cross talk reduction
US20190369307A1 (en) * 2018-05-30 2019-12-05 Key Technology, Inc. Electromagnetic Radiation Detector Assembly
KR102141946B1 (en) * 2018-06-27 2020-08-06 울산과학기술원 Apparatus and method for identifying modal parameters of structures
US10756778B1 (en) * 2018-07-30 2020-08-25 Veex Inc. Systems and methods for subcarrier scan
US10554914B1 (en) * 2018-08-10 2020-02-04 Apple Inc. Adjusting confidence values for correcting pixel defects
JP2020041991A (en) * 2018-09-13 2020-03-19 キオクシア株式会社 Shape measurement method and shape measurement device
US10854486B2 (en) * 2018-09-19 2020-12-01 Kla Corporation System and method for characterization of buried defects
CN111198382B (en) * 2018-11-16 2022-07-12 精準基因生物科技股份有限公司 Time-of-flight distance measuring sensor and time-of-flight distance measuring method
DE102018133083A1 (en) * 2018-12-20 2020-06-25 Carl Zeiss Jena Gmbh Device and method for the controlled machining of a workpiece with machining radiation
US11815470B2 (en) * 2019-01-17 2023-11-14 Applied Materials Israel, Ltd. Multi-perspective wafer analysis
US10522426B1 (en) 2019-02-08 2019-12-31 Kla-Tencor Corporation Haze mask system for haze suppression
CN111721776B (en) * 2019-03-22 2024-02-20 住友化学株式会社 Inspection method and inspection device
US10502691B1 (en) 2019-03-29 2019-12-10 Caastle, Inc. Systems and methods for inspection and defect detection
US20220146663A1 (en) * 2019-04-02 2022-05-12 The Curators Of The University Of Missouri Microwave imaging using a radially-polarized probe
US11635326B2 (en) * 2019-04-02 2023-04-25 Waymo Llc Stray-light testing station
JP7344047B2 (en) * 2019-08-22 2023-09-13 株式会社ジェーイーエル How to align the board
US11329722B2 (en) 2020-03-27 2022-05-10 Relative Dynamics Incorporated Optical terminals
US11721785B2 (en) * 2020-05-22 2023-08-08 Chongqing Konka Photoelectronic Technology Research Institute Co., Ltd. Mass transfer apparatus, mass transfer system, and control method for mass transfer
US11232554B1 (en) * 2021-06-07 2022-01-25 Elementary Robotics, Inc. Machine-learning based camera image triggering for quality assurance inspection processes
DE102020207566B4 (en) 2020-06-18 2023-02-16 Carl Zeiss Smt Gmbh Device and method for characterizing a mask for microlithography
CN112001961B (en) * 2020-08-28 2023-08-11 广西科技大学 Loading machine and material associated shovel loading system and method
CN112229854B (en) * 2020-09-03 2022-10-11 中国科学院上海光学精密机械研究所 Device and method for measuring surface defects of spherical optical element
US11422096B2 (en) * 2020-11-30 2022-08-23 Applied Materials, Inc. Surface topography measurement apparatus and method
JP2022120418A (en) * 2021-02-05 2022-08-18 東京エレクトロン株式会社 Substrate processing apparatus, substrate processing system and abnormality detection method
TWI770906B (en) * 2021-03-26 2022-07-11 環球晶圓股份有限公司 Wafer surface defect inspection method and apparatus thereof
TWI767642B (en) * 2021-04-01 2022-06-11 環球晶圓股份有限公司 Wafer inspection method and apparatus thereof
CN113102270A (en) * 2021-04-08 2021-07-13 赵倩 Novel image detection and identification intelligence device
US11605159B1 (en) 2021-11-03 2023-03-14 Elementary Robotics, Inc. Computationally efficient quality assurance inspection processes using machine learning
US11675345B2 (en) 2021-11-10 2023-06-13 Elementary Robotics, Inc. Cloud-based multi-camera quality assurance architecture
US11605216B1 (en) 2022-02-10 2023-03-14 Elementary Robotics, Inc. Intelligent automated image clustering for quality assurance

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5448364A (en) * 1993-03-22 1995-09-05 Estek Corporation Particle detection system with reflective line-to-spot collector
US5712701A (en) * 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
US6064477A (en) * 1993-02-26 2000-05-16 Hitachi, Ltd. Method of and apparatus for inspecting reticle for defects
US20040080741A1 (en) * 1994-03-24 2004-04-29 Norbert Marxer Process and assembly for non-destructive surface inspections
US20040125368A1 (en) * 2002-09-13 2004-07-01 Mehdi Vaez-Iravani Inspection system for integrated applications

Family Cites Families (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2127483A1 (en) * 1971-06-03 1972-12-14 Leitz Ernst Gmbh Procedure for the interferential measurement of lengths, angles, differences in gait or speeds
US4441124A (en) * 1981-11-05 1984-04-03 Western Electric Company, Inc. Technique for inspecting semiconductor wafers for particulate contamination
JPS5897608A (en) * 1981-12-05 1983-06-10 Nippon Paint Co Ltd Method and device for surface property
USRE33991E (en) * 1982-11-04 1992-07-14 Hitachi, Ltd. Foreign particle detecting method and apparatus
US4886975A (en) * 1986-02-14 1989-12-12 Canon Kabushiki Kaisha Surface examining apparatus for detecting the presence of foreign particles on two or more surfaces
US4889998A (en) * 1987-01-29 1989-12-26 Nikon Corporation Apparatus with four light detectors for checking surface of mask with pellicle
US5046847A (en) * 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
US4929080A (en) * 1988-05-16 1990-05-29 Litton Systems, Inc. Apparatus for the optical measurement of spectra distribution
US4991953A (en) * 1989-02-09 1991-02-12 Eye Research Institute Of Retina Foundation Scanning laser vitreous camera
US4991971A (en) * 1989-02-13 1991-02-12 United Technologies Corporation Fiber optic scatterometer for measuring optical surface roughness
US5363187A (en) * 1990-09-12 1994-11-08 Nikon Corporation Light scanning apparatus for detecting foreign particles on surface having circuit pattern
IL99823A0 (en) * 1990-11-16 1992-08-18 Orbot Instr Ltd Optical inspection method and apparatus
US5177559A (en) * 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
US5164603A (en) * 1991-07-16 1992-11-17 Reynolds Metals Company Modular surface inspection method and apparatus using optical fibers
US5436464A (en) * 1992-04-13 1995-07-25 Nikon Corporation Foreign particle inspecting method and apparatus with correction for pellicle transmittance
DE69314791T2 (en) * 1992-06-11 1998-07-09 Zed Instr Ltd Printhead
DE4230068A1 (en) * 1992-09-09 1994-03-10 Tzn Forschung & Entwicklung Method and device for contactless checking of the surface roughness of materials
US5680207A (en) * 1992-12-14 1997-10-21 Nikon Corporation Defect inspecting apparatus and defect inspecting method
US5416594A (en) * 1993-07-20 1995-05-16 Tencor Instruments Surface scanner with thin film gauge
US5537669A (en) * 1993-09-30 1996-07-16 Kla Instruments Corporation Inspection method and apparatus for the inspection of either random or repeating patterns
US5576831A (en) * 1994-06-20 1996-11-19 Tencor Instruments Wafer alignment sensor
US5864394A (en) * 1994-06-20 1999-01-26 Kla-Tencor Corporation Surface inspection system
US5883710A (en) * 1994-12-08 1999-03-16 Kla-Tencor Corporation Scanning system for inspecting anomalies on surfaces
US20040057044A1 (en) * 1994-12-08 2004-03-25 Mehrdad Nikoonahad Scanning system for inspecting anamolies on surfaces
US6118525A (en) * 1995-03-06 2000-09-12 Ade Optical Systems Corporation Wafer inspection system for distinguishing pits and particles
JP3381924B2 (en) * 1995-03-10 2003-03-04 株式会社 日立製作所 Inspection device
AU3376597A (en) * 1996-06-04 1998-01-05 Tencor Instruments Optical scanning system for surface inspection
ATE307536T1 (en) 1997-04-01 2005-11-15 Axel Muntermann DEVICE FOR DETECTING CATHETER TISSUE CONTACT AND INTERACTIONS WITH TISSUE DURING CATHETER ABLATION
US6034776A (en) * 1997-04-16 2000-03-07 The United States Of America As Represented By The Secretary Of Commerce Microroughness-blind optical scattering instrument
US5877858A (en) * 1997-09-19 1999-03-02 International Business Machines Corporation Textured surface monitoring and control apparatus
US6201601B1 (en) * 1997-09-19 2001-03-13 Kla-Tencor Corporation Sample inspection system
JP3375876B2 (en) * 1998-02-06 2003-02-10 株式会社日立製作所 Crystal defect measurement method and crystal defect measurement device
US6256093B1 (en) * 1998-06-25 2001-07-03 Applied Materials, Inc. On-the-fly automatic defect classification for substrates using signal attributes
US6529270B1 (en) 1999-03-31 2003-03-04 Ade Optical Systems Corporation Apparatus and method for detecting defects in the surface of a workpiece
US6313909B1 (en) * 1999-04-20 2001-11-06 Lucent Technologies Inc. Fiber defect detection apparatus and method
US6486946B1 (en) * 1999-06-15 2002-11-26 Ade Corporation Method for discriminating between holes in and particles on a film covering a substrate
US6088092A (en) * 1999-06-21 2000-07-11 Phase Metrics, Inc. Glass substrate inspection apparatus
US6496270B1 (en) * 2000-02-17 2002-12-17 Gsi Lumonics, Inc. Method and system for automatically generating reference height data for use in a three-dimensional inspection system
JP3996728B2 (en) * 2000-03-08 2007-10-24 株式会社日立製作所 Surface inspection apparatus and method
US6809809B2 (en) * 2000-11-15 2004-10-26 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
US6898304B2 (en) * 2000-12-01 2005-05-24 Applied Materials, Inc. Hardware configuration for parallel data processing without cross communication
JP4786027B2 (en) * 2000-12-08 2011-10-05 オリンパス株式会社 Optical system and optical apparatus
US6661953B2 (en) * 2001-06-28 2003-12-09 Avanex Corporation Method and apparatus for simultaneous multiplexing and demultiplexing, variable attenuation and power detection of wavelength division multiplexed optical signals
AU2002320323A1 (en) * 2001-07-06 2003-01-21 Zygo Corporation Multi-axis interferometer
JP4030815B2 (en) * 2001-07-10 2008-01-09 ケーエルエー−テンカー テクノロジィース コーポレイション System and method for simultaneous or sequential multiple perspective sample defect inspection
WO2003010518A2 (en) * 2001-07-26 2003-02-06 Koninklijke Philips Electronics N.V. Opto-acoustic apparatus with optical heterodyning for measuring solid surfaces and thin films
US6934219B2 (en) 2002-04-24 2005-08-23 Ascend Geo, Llc Methods and systems for acquiring seismic data
US7668044B2 (en) * 2002-04-24 2010-02-23 Ascend Geo, Llc Data offload and charging systems and methods
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection
DE10241472B4 (en) * 2002-09-04 2019-04-11 Carl Zeiss Microscopy Gmbh Method and arrangement for the adjustable change of illumination light and / or sample light with respect to its spectral composition and / or intensity
US7369233B2 (en) * 2002-11-26 2008-05-06 Kla-Tencor Technologies Corporation Optical system for measuring samples using short wavelength radiation
US7068363B2 (en) * 2003-06-06 2006-06-27 Kla-Tencor Technologies Corp. Systems for inspection of patterned or unpatterned wafers and other specimen
WO2004111618A2 (en) 2003-06-10 2004-12-23 Ade Corporation Method and system for classifiying defects occurring at a surface of a substrate using graphical representation of multi-channel data
US7002675B2 (en) * 2003-07-10 2006-02-21 Synetics Solutions, Inc. Method and apparatus for locating/sizing contaminants on a polished planar surface of a dielectric or semiconductor material
US7130036B1 (en) * 2003-09-16 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for inspection of an entire wafer surface using multiple detection channels
US7110106B2 (en) * 2003-10-29 2006-09-19 Coretech Optical, Inc. Surface inspection system
US7295303B1 (en) * 2004-03-25 2007-11-13 Kla-Tencor Technologies Corporation Methods and apparatus for inspecting a sample
US7505133B1 (en) * 2004-06-22 2009-03-17 Sci Instruments, Inc. Optical metrology systems and methods
US7321421B2 (en) * 2004-07-30 2008-01-22 The Boeing Company Apparatus and methods for scanning conoscopic holography measurements
US20060192950A1 (en) 2004-12-19 2006-08-31 Neil Judell System and method for inspecting a workpiece surface using combinations of light collectors
US7728965B2 (en) * 2005-06-06 2010-06-01 Kla-Tencor Technologies Corp. Systems and methods for inspecting an edge of a specimen
US7512700B2 (en) * 2005-09-30 2009-03-31 International Business Machines Corporation Real-time mining and reduction of streamed data
US8260035B2 (en) * 2006-09-22 2012-09-04 Kla-Tencor Corporation Threshold determination in an inspection system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6064477A (en) * 1993-02-26 2000-05-16 Hitachi, Ltd. Method of and apparatus for inspecting reticle for defects
US5448364A (en) * 1993-03-22 1995-09-05 Estek Corporation Particle detection system with reflective line-to-spot collector
US20040080741A1 (en) * 1994-03-24 2004-04-29 Norbert Marxer Process and assembly for non-destructive surface inspections
US5712701A (en) * 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
US20040125368A1 (en) * 2002-09-13 2004-07-01 Mehdi Vaez-Iravani Inspection system for integrated applications

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8422010B2 (en) 2006-02-09 2013-04-16 Kla-Tencor Technologies Corp. Methods and systems for determining a characteristic of a wafer

Also Published As

Publication number Publication date
US20150042987A1 (en) 2015-02-12
US20060186362A1 (en) 2006-08-24
US7286218B2 (en) 2007-10-23
US20070024998A1 (en) 2007-02-01
WO2006066205A2 (en) 2006-06-22
WO2006066135A3 (en) 2009-04-16
US20060181700A1 (en) 2006-08-17
US20100110419A1 (en) 2010-05-06
WO2006066136A2 (en) 2006-06-22
US20100110420A1 (en) 2010-05-06
WO2006066135A9 (en) 2006-08-03
US8537350B2 (en) 2013-09-17
US8330947B2 (en) 2012-12-11
WO2006066139A2 (en) 2006-06-22
WO2006066255A2 (en) 2006-06-22
WO2006066135A2 (en) 2006-06-22
US9488591B2 (en) 2016-11-08
US20070252977A1 (en) 2007-11-01
US9110033B2 (en) 2015-08-18
US10018572B2 (en) 2018-07-10
US7839495B2 (en) 2010-11-23
US7417722B2 (en) 2008-08-26
US7605913B2 (en) 2009-10-20
US20100149527A1 (en) 2010-06-17
WO2006066139A3 (en) 2009-04-16
US9528942B2 (en) 2016-12-27
WO2006066206A2 (en) 2006-06-22
US8553215B2 (en) 2013-10-08
WO2006066206A3 (en) 2009-04-09
US20130342833A1 (en) 2013-12-26
US20060256326A1 (en) 2006-11-16
WO2006066138A3 (en) 2008-10-16
US20060197945A1 (en) 2006-09-07
WO2006066137A3 (en) 2009-04-16
WO2006066138A2 (en) 2006-06-22
US8059268B2 (en) 2011-11-15
US7623227B2 (en) 2009-11-24
US7557910B2 (en) 2009-07-07
US20100265518A1 (en) 2010-10-21
US20060192950A1 (en) 2006-08-31
US20130094023A1 (en) 2013-04-18
US20170010222A1 (en) 2017-01-12
US20060192948A1 (en) 2006-08-31
US7659974B2 (en) 2010-02-09
US8497984B2 (en) 2013-07-30
US20060192949A1 (en) 2006-08-31
WO2006066207A2 (en) 2006-06-22
US9518930B2 (en) 2016-12-13
US20120013898A1 (en) 2012-01-19
WO2006066255A3 (en) 2007-07-12
US20130335733A1 (en) 2013-12-19
WO2006066207A3 (en) 2009-04-09
WO2006066137A2 (en) 2006-06-22
US7505125B2 (en) 2009-03-17
US20150042993A1 (en) 2015-02-12
WO2006066205A3 (en) 2009-04-09
US20080304057A1 (en) 2008-12-11
US9103800B2 (en) 2015-08-11

Similar Documents

Publication Publication Date Title
WO2006066136A3 (en) System and method for inspecting a workpiece surface by analyzing scattered light in a back quartersphere region above the workpiece
WO2007100615A3 (en) High-sensitivity surface detection system and method
WO2006121843A3 (en) Wafer edge inspection
EP0665951B1 (en) Process and device for inspection of a transparent material
SG143215A1 (en) A scatterometer, a lithographic apparatus and a focus analysis method
US6462813B1 (en) Surface defect inspection system and method
EP2282197A3 (en) Particle beam systems and methods
CA2842544C (en) Apparatus and method for inspecting matter and use thereof for sorting recyclable matter
ATE463736T1 (en) OPTICAL SYSTEM FOR DETECTING ANOMALIES AND/OR CHARACTERISTICS OF SURFACES
CA2640639A1 (en) Device and method for optical measurement of grains from cereals and like crops
WO2009076730A3 (en) Sorting device, sorting method and sensor element for a sorting device
JP2014514556A (en) Microorganism detection apparatus and method
TW200624771A (en) Optical inspection apparatus and optical inspection method
EP2378273A3 (en) System and method for double sided optical inspection of thin film disks or wafers
TW200734630A (en) Defect inspection apparatus and defect inspection method
TW200712479A (en) Surface defect inspection apparatus and surface defect inspection method
WO2007087101A3 (en) Systems and methods for inspecting a wafer with increased sensitivity
ATE506627T1 (en) METHOD AND DEVICE FOR OPTICAL TISSUE ANALYSIS
WO2009023154A3 (en) Systems configured to inspect a wafer
WO2011030156A3 (en) Collection of electromagnetic radiation emitted from particle-irradiated samples
JP2005345281A5 (en)
EP2554323A3 (en) Method for operating a laser scanner and processing system with laser scanner
DE602004027006D1 (en) STREUMESSER AND METHOD FOR EXAMINING A SURFACE
JP2008216150A (en) Inspection device and method of transparent object
EP1058111A3 (en) Optical inspection system and method

Legal Events

Date Code Title Description
AK Designated states

Kind code of ref document: A2

Designated state(s): AE AG AL AM AT AU AZ BA BB BG BR BW BY BZ CA CH CN CO CR CU CZ DE DK DM DZ EC EE EG ES FI GB GD GE GH GM HR HU ID IL IN IS JP KE KG KM KN KP KR KZ LC LK LR LS LT LU LV LY MA MD MG MK MN MW MX MZ NA NG NI NO NZ OM PG PH PL PT RO RU SC SD SE SG SK SL SM SY TJ TM TN TR TT TZ UA UG US UZ VC VN YU ZA ZM ZW

AL Designated countries for regional patents

Kind code of ref document: A2

Designated state(s): GM KE LS MW MZ NA SD SL SZ TZ UG ZM ZW AM AZ BY KG KZ MD RU TJ TM AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IS IT LT LU LV MC NL PL PT RO SE SI SK TR BF BJ CF CG CI CM GA GN GQ GW ML MR NE SN TD TG

121 Ep: the epo has been informed by wipo that ep was designated in this application
NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 05854485

Country of ref document: EP

Kind code of ref document: A2