WO2006049085A1 - 静電チャック装置 - Google Patents
静電チャック装置 Download PDFInfo
- Publication number
- WO2006049085A1 WO2006049085A1 PCT/JP2005/019818 JP2005019818W WO2006049085A1 WO 2006049085 A1 WO2006049085 A1 WO 2006049085A1 JP 2005019818 W JP2005019818 W JP 2005019818W WO 2006049085 A1 WO2006049085 A1 WO 2006049085A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- static elimination
- electrostatic chuck
- support base
- electrode
- potential
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800376076A CN101278385B (zh) | 2004-11-04 | 2005-10-27 | 静电吸盘装置 |
US11/666,950 US7821767B2 (en) | 2004-11-04 | 2005-10-27 | Electrostatic chuck device |
JP2006543261A JP5323317B2 (ja) | 2004-11-04 | 2005-10-27 | 静電チャック方法 |
US12/924,125 US20110013338A1 (en) | 2004-11-04 | 2010-09-21 | Electrostatic chuck device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-320078 | 2004-11-04 | ||
JP2004320078 | 2004-11-04 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/924,125 Continuation US20110013338A1 (en) | 2004-11-04 | 2010-09-21 | Electrostatic chuck device |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006049085A1 true WO2006049085A1 (ja) | 2006-05-11 |
Family
ID=36319097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/019818 WO2006049085A1 (ja) | 2004-11-04 | 2005-10-27 | 静電チャック装置 |
Country Status (6)
Country | Link |
---|---|
US (2) | US7821767B2 (ja) |
JP (1) | JP5323317B2 (ja) |
KR (2) | KR20070072571A (ja) |
CN (1) | CN101278385B (ja) |
TW (1) | TWI390698B (ja) |
WO (1) | WO2006049085A1 (ja) |
Cited By (15)
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JP2013098277A (ja) * | 2011-10-31 | 2013-05-20 | Canon Anelva Corp | 基板ホルダー及び真空処理装置 |
JP2013539913A (ja) * | 2010-09-17 | 2013-10-28 | ラム リサーチ コーポレーション | リフトピンを用いた静電デチャックのための極性領域 |
TWI458041B (zh) * | 2007-10-15 | 2014-10-21 | Tsukuba Seiko Ltd | 靜電型補強裝置 |
JP2015504244A (ja) * | 2011-12-21 | 2015-02-05 | イオン ビーム サービス | 静電基板保持具を含む支持具 |
JPWO2013147037A1 (ja) * | 2012-03-29 | 2015-12-14 | 京セラ株式会社 | 流路部材およびこれを備える熱交換器ならびに半導体製造装置 |
WO2016159239A1 (ja) * | 2015-04-02 | 2016-10-06 | 株式会社アルバック | 吸着装置及び真空処理装置 |
JPWO2019044290A1 (ja) * | 2017-08-28 | 2019-11-07 | 株式会社クリエイティブテクノロジー | 静電式ワーク保持方法,静電式ワーク保持システム及びワーク保持装置 |
JP2020021769A (ja) * | 2018-07-30 | 2020-02-06 | 東京エレクトロン株式会社 | 載置台機構、処理装置及び載置台機構の動作方法 |
US10563919B2 (en) | 2016-04-29 | 2020-02-18 | Semes Co., Ltd. | Method, system, and apparatus for controlling a temperature of a substrate in a plasma processing chamber |
JP2020053663A (ja) * | 2018-09-21 | 2020-04-02 | キヤノントッキ株式会社 | 静電チャックシステム、成膜装置、被吸着体分離方法、成膜方法及び電子デバイスの製造方法 |
JP2020161590A (ja) * | 2019-03-26 | 2020-10-01 | 東京エレクトロン株式会社 | 静電吸着装置及び除電方法 |
JP2021093306A (ja) * | 2019-12-11 | 2021-06-17 | 株式会社日立ハイテク | 荷電粒子線装置およびホルダ |
JP2021158369A (ja) * | 2014-03-05 | 2021-10-07 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | ピクセル化された容量制御esc |
JP2023006762A (ja) * | 2021-06-30 | 2023-01-18 | 新光電気工業株式会社 | 静電チャック及び基板固定装置 |
JP7457765B2 (ja) | 2021-10-28 | 2024-03-28 | セメス株式会社 | 基板テスト装置およびそれを用いるデチャック力の測定方法 |
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US9520276B2 (en) * | 2005-06-22 | 2016-12-13 | Tokyo Electron Limited | Electrode assembly and plasma processing apparatus |
US8336891B2 (en) * | 2008-03-11 | 2012-12-25 | Ngk Insulators, Ltd. | Electrostatic chuck |
KR100899078B1 (ko) * | 2008-07-31 | 2009-05-25 | 김준규 | 램리서치 티시피/레인보우 장치의 정전 척 디척킹 장치 |
US8270142B2 (en) * | 2008-12-10 | 2012-09-18 | Axcelis Technologies, Inc. | De-clamping wafers from an electrostatic chuck |
CN103222043B (zh) * | 2010-09-08 | 2016-10-12 | 恩特格林斯公司 | 一种高传导静电夹盘 |
US20120227886A1 (en) * | 2011-03-10 | 2012-09-13 | Taipei Semiconductor Manufacturing Company, Ltd. | Substrate Assembly Carrier Using Electrostatic Force |
CN102915943B (zh) * | 2011-08-02 | 2015-02-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 静电卡盘和半导体设备 |
JP5914020B2 (ja) * | 2012-02-09 | 2016-05-11 | 株式会社日立ハイテクノロジーズ | 荷電粒子線装置 |
ITUD20120073A1 (it) * | 2012-04-24 | 2013-10-25 | Applied Materials Italia Srl | Dispositivo e procedimento per tenere posizionato uno strato di materiale semiconduttore, per la produzione di celle fotovoltaiche, rispetto ad un supporto |
KR101319785B1 (ko) * | 2013-03-18 | 2013-10-18 | 주식회사 야스 | 정전기 부상을 이용한 기판이송장치 |
US10236202B2 (en) * | 2013-11-11 | 2019-03-19 | Diablo Capital, Inc. | System and method for adhering a semiconductive wafer to a mobile electrostatic carrier through a vacuum |
US9754809B2 (en) * | 2013-11-11 | 2017-09-05 | Western Alliance Bank | Tri-modal carrier for a semiconductive wafer |
GB201321463D0 (en) * | 2013-12-05 | 2014-01-22 | Oxford Instr Nanotechnology Tools Ltd | Electrostatic clamping method and apparatus |
US9101038B2 (en) * | 2013-12-20 | 2015-08-04 | Lam Research Corporation | Electrostatic chuck including declamping electrode and method of declamping |
WO2015171207A1 (en) * | 2014-05-09 | 2015-11-12 | Applied Materials, Inc. | Substrate carrier system and method for using the same |
CN105448793A (zh) * | 2014-06-12 | 2016-03-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 一种半导体加工设备 |
US10002782B2 (en) | 2014-10-17 | 2018-06-19 | Lam Research Corporation | ESC assembly including an electrically conductive gasket for uniform RF power delivery therethrough |
US9845533B2 (en) * | 2014-11-11 | 2017-12-19 | Applied Materials, Inc. | Substrate carrier system utilizing electrostatic chucking to accommodate substrate size heterogeneity |
KR102288349B1 (ko) | 2014-12-09 | 2021-08-11 | 삼성디스플레이 주식회사 | 정전 척 시스템과, 이를 이용한 유기 발광 디스플레이 장치의 제조 방법 |
JP6649689B2 (ja) * | 2015-03-16 | 2020-02-19 | 株式会社ディスコ | 減圧処理装置及びウエーハの保持方法 |
JP6407128B2 (ja) * | 2015-11-18 | 2018-10-17 | 三菱電機株式会社 | 半導体装置の評価装置および半導体装置の評価方法 |
KR101912885B1 (ko) * | 2015-12-11 | 2018-10-29 | 에이피시스템 주식회사 | 지지 척 및 기판 처리 장치 |
JP6445191B2 (ja) * | 2016-05-09 | 2018-12-26 | 株式会社アルバック | 静電チャック、および、プラズマ処理装置 |
WO2017197305A1 (en) * | 2016-05-12 | 2017-11-16 | Corning Incorporated | Electrostatic chucking of cover glass with irregular surface flatness |
CN107393856B (zh) * | 2016-05-16 | 2021-08-13 | 北京北方华创微电子装备有限公司 | 一种下电极装置、半导体加工设备及残余电荷释放方法 |
US10804821B2 (en) * | 2016-11-04 | 2020-10-13 | Advanced Ion Beam Technology, Inc. | Apparatus and method for monitoring the relative relationship between the wafer and the chuck |
JP6723660B2 (ja) * | 2017-03-24 | 2020-07-15 | 住友重機械イオンテクノロジー株式会社 | ウェハ保持装置及びウェハ着脱方法 |
KR102435888B1 (ko) * | 2017-07-04 | 2022-08-25 | 삼성전자주식회사 | 정전 척, 기판 처리 장치 및 그를 이용한 반도체 소자의 제조방법 |
US20190088518A1 (en) * | 2017-09-20 | 2019-03-21 | Applied Materials, Inc. | Substrate support with cooled and conducting pins |
US10714372B2 (en) * | 2017-09-20 | 2020-07-14 | Applied Materials, Inc. | System for coupling a voltage to portions of a substrate |
KR102450476B1 (ko) * | 2018-02-28 | 2022-10-05 | 주식회사 미코세라믹스 | 정전척 히터 및 그 제조 방법 |
US10555412B2 (en) | 2018-05-10 | 2020-02-04 | Applied Materials, Inc. | Method of controlling ion energy distribution using a pulse generator with a current-return output stage |
US11476145B2 (en) | 2018-11-20 | 2022-10-18 | Applied Materials, Inc. | Automatic ESC bias compensation when using pulsed DC bias |
WO2020146034A1 (en) * | 2019-01-08 | 2020-07-16 | Applied Materials, Inc. | Recursive coils for inductively coupled plasmas |
JP7451540B2 (ja) | 2019-01-22 | 2024-03-18 | アプライド マテリアルズ インコーポレイテッド | パルス状電圧波形を制御するためのフィードバックループ |
US11508554B2 (en) | 2019-01-24 | 2022-11-22 | Applied Materials, Inc. | High voltage filter assembly |
CN111952231A (zh) * | 2019-05-14 | 2020-11-17 | 北京北方华创微电子装备有限公司 | 电荷传输装置及相关等离子体系统 |
US11462389B2 (en) | 2020-07-31 | 2022-10-04 | Applied Materials, Inc. | Pulsed-voltage hardware assembly for use in a plasma processing system |
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US11901157B2 (en) | 2020-11-16 | 2024-02-13 | Applied Materials, Inc. | Apparatus and methods for controlling ion energy distribution |
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US11967483B2 (en) | 2021-06-02 | 2024-04-23 | Applied Materials, Inc. | Plasma excitation with ion energy control |
US11810760B2 (en) | 2021-06-16 | 2023-11-07 | Applied Materials, Inc. | Apparatus and method of ion current compensation |
US11569066B2 (en) | 2021-06-23 | 2023-01-31 | Applied Materials, Inc. | Pulsed voltage source for plasma processing applications |
US11776788B2 (en) | 2021-06-28 | 2023-10-03 | Applied Materials, Inc. | Pulsed voltage boost for substrate processing |
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US11694876B2 (en) | 2021-12-08 | 2023-07-04 | Applied Materials, Inc. | Apparatus and method for delivering a plurality of waveform signals during plasma processing |
JP7328720B1 (ja) | 2022-04-18 | 2023-08-17 | アダプティブ プラズマ テクノロジー コーポレーション | プラズマエッチングシステム |
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JP2000236014A (ja) * | 1999-02-15 | 2000-08-29 | Rohm Co Ltd | 半導体ウェハの処理方法 |
JP2001506808A (ja) * | 1996-12-19 | 2001-05-22 | ラム・リサーチ・コーポレーション | ウェハ昇降システムによるウェハ放電制御 |
JP2001343755A (ja) * | 2000-06-01 | 2001-12-14 | Nikon Corp | 静電チャック保護方法及びデバイス製造方法 |
JP2002270682A (ja) * | 2001-03-13 | 2002-09-20 | Toshiba Corp | 静電チャック装置および半導体処理装置ならびに半導体製造装置および半導体処理方法 |
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2005
- 2005-10-27 KR KR1020077010308A patent/KR20070072571A/ko active Search and Examination
- 2005-10-27 JP JP2006543261A patent/JP5323317B2/ja active Active
- 2005-10-27 US US11/666,950 patent/US7821767B2/en active Active
- 2005-10-27 KR KR1020087026054A patent/KR20080107473A/ko not_active Application Discontinuation
- 2005-10-27 CN CN2005800376076A patent/CN101278385B/zh active Active
- 2005-10-27 WO PCT/JP2005/019818 patent/WO2006049085A1/ja active Application Filing
- 2005-11-02 TW TW094138363A patent/TWI390698B/zh active
-
2010
- 2010-09-21 US US12/924,125 patent/US20110013338A1/en not_active Abandoned
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JP2000236014A (ja) * | 1999-02-15 | 2000-08-29 | Rohm Co Ltd | 半導体ウェハの処理方法 |
JP2001343755A (ja) * | 2000-06-01 | 2001-12-14 | Nikon Corp | 静電チャック保護方法及びデバイス製造方法 |
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Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI458041B (zh) * | 2007-10-15 | 2014-10-21 | Tsukuba Seiko Ltd | 靜電型補強裝置 |
JP2013539913A (ja) * | 2010-09-17 | 2013-10-28 | ラム リサーチ コーポレーション | リフトピンを用いた静電デチャックのための極性領域 |
JP2013098277A (ja) * | 2011-10-31 | 2013-05-20 | Canon Anelva Corp | 基板ホルダー及び真空処理装置 |
JP2015504244A (ja) * | 2011-12-21 | 2015-02-05 | イオン ビーム サービス | 静電基板保持具を含む支持具 |
JPWO2013147037A1 (ja) * | 2012-03-29 | 2015-12-14 | 京セラ株式会社 | 流路部材およびこれを備える熱交換器ならびに半導体製造装置 |
US10103047B2 (en) | 2012-03-29 | 2018-10-16 | Kyocera Corporation | Flow path member, heat exchanger including the flow path member, and semiconductor manufacturing apparatus including the flow path member |
JP2021158369A (ja) * | 2014-03-05 | 2021-10-07 | アプライド マテリアルズ インコーポレイテッドApplied Materials, Incorporated | ピクセル化された容量制御esc |
WO2016159239A1 (ja) * | 2015-04-02 | 2016-10-06 | 株式会社アルバック | 吸着装置及び真空処理装置 |
JPWO2016159239A1 (ja) * | 2015-04-02 | 2017-08-03 | 株式会社アルバック | 吸着装置及び真空処理装置 |
US10563919B2 (en) | 2016-04-29 | 2020-02-18 | Semes Co., Ltd. | Method, system, and apparatus for controlling a temperature of a substrate in a plasma processing chamber |
US11121649B2 (en) | 2017-08-28 | 2021-09-14 | Creative Technology Corporation | Electrostatic workpiece-holding method and electrostatic workpiece-holding system |
JPWO2019044290A1 (ja) * | 2017-08-28 | 2019-11-07 | 株式会社クリエイティブテクノロジー | 静電式ワーク保持方法,静電式ワーク保持システム及びワーク保持装置 |
JP7170449B2 (ja) | 2018-07-30 | 2022-11-14 | 東京エレクトロン株式会社 | 載置台機構、処理装置及び載置台機構の動作方法 |
JP2020021769A (ja) * | 2018-07-30 | 2020-02-06 | 東京エレクトロン株式会社 | 載置台機構、処理装置及び載置台機構の動作方法 |
JP2020053663A (ja) * | 2018-09-21 | 2020-04-02 | キヤノントッキ株式会社 | 静電チャックシステム、成膜装置、被吸着体分離方法、成膜方法及び電子デバイスの製造方法 |
JP7224172B2 (ja) | 2018-09-21 | 2023-02-17 | キヤノントッキ株式会社 | 静電チャックシステム、成膜装置、被吸着体分離方法、成膜方法及び電子デバイスの製造方法 |
WO2020195959A1 (ja) * | 2019-03-26 | 2020-10-01 | 東京エレクトロン株式会社 | 静電吸着装置及び除電方法 |
JP2020161590A (ja) * | 2019-03-26 | 2020-10-01 | 東京エレクトロン株式会社 | 静電吸着装置及び除電方法 |
JP7169920B2 (ja) | 2019-03-26 | 2022-11-11 | 東京エレクトロン株式会社 | 静電吸着装置及び除電方法 |
JP2021093306A (ja) * | 2019-12-11 | 2021-06-17 | 株式会社日立ハイテク | 荷電粒子線装置およびホルダ |
JP7246296B2 (ja) | 2019-12-11 | 2023-03-27 | 株式会社日立ハイテク | 荷電粒子線装置およびホルダ |
JP2023006762A (ja) * | 2021-06-30 | 2023-01-18 | 新光電気工業株式会社 | 静電チャック及び基板固定装置 |
JP7303249B2 (ja) | 2021-06-30 | 2023-07-04 | 新光電気工業株式会社 | 静電チャック及び基板固定装置 |
JP7457765B2 (ja) | 2021-10-28 | 2024-03-28 | セメス株式会社 | 基板テスト装置およびそれを用いるデチャック力の測定方法 |
Also Published As
Publication number | Publication date |
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CN101278385B (zh) | 2011-10-12 |
US20070297118A1 (en) | 2007-12-27 |
JP5323317B2 (ja) | 2013-10-23 |
CN101278385A (zh) | 2008-10-01 |
KR20080107473A (ko) | 2008-12-10 |
KR20070072571A (ko) | 2007-07-04 |
TWI390698B (zh) | 2013-03-21 |
US7821767B2 (en) | 2010-10-26 |
TW200618249A (en) | 2006-06-01 |
JPWO2006049085A1 (ja) | 2008-08-07 |
US20110013338A1 (en) | 2011-01-20 |
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