WO2006039273A2 - Modular liquid cooling of electronic assemblies - Google Patents
Modular liquid cooling of electronic assemblies Download PDFInfo
- Publication number
- WO2006039273A2 WO2006039273A2 PCT/US2005/034596 US2005034596W WO2006039273A2 WO 2006039273 A2 WO2006039273 A2 WO 2006039273A2 US 2005034596 W US2005034596 W US 2005034596W WO 2006039273 A2 WO2006039273 A2 WO 2006039273A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- assemblies
- cooling
- recited
- assembly
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q30/00—Commerce
- G06Q30/06—Buying, selling or leasing transactions
- G06Q30/0601—Electronic shopping [e-shopping]
- G06Q30/0641—Shopping interfaces
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/08—Payment architectures
- G06Q20/12—Payment architectures specially adapted for electronic shopping systems
- G06Q20/123—Shopping for digital content
- G06Q20/1235—Shopping for digital content with control of digital rights management [DRM]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/08—Payment architectures
- G06Q20/20—Point-of-sale [POS] network systems
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q20/00—Payment architectures, schemes or protocols
- G06Q20/08—Payment architectures
- G06Q20/20—Point-of-sale [POS] network systems
- G06Q20/204—Point-of-sale [POS] network systems comprising interface for record bearing medium or carrier for electronic funds transfer or payment credit
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F13/00—Coin-freed apparatus for controlling dispensing or fluids, semiliquids or granular material from reservoirs
- G07F13/02—Coin-freed apparatus for controlling dispensing or fluids, semiliquids or granular material from reservoirs by volume
- G07F13/025—Coin-freed apparatus for controlling dispensing or fluids, semiliquids or granular material from reservoirs by volume wherein the volume is determined during delivery
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
- G07F17/0014—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for vending, access and use of specific services not covered anywhere else in G07F17/00
-
- G—PHYSICS
- G07—CHECKING-DEVICES
- G07F—COIN-FREED OR LIKE APPARATUS
- G07F17/00—Coin-freed apparatus for hiring articles; Coin-freed facilities or services
- G07F17/16—Coin-freed apparatus for hiring articles; Coin-freed facilities or services for devices exhibiting advertisements, announcements, pictures or the like
-
- C—CHEMISTRY; METALLURGY
- C02—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F—TREATMENT OF WATER, WASTE WATER, SEWAGE, OR SLUDGE
- C02F2209/00—Controlling or monitoring parameters in water treatment
- C02F2209/005—Processes using a programmable logic controller [PLC]
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Definitions
- This invention relates generally to electronic assemblies, and, more particularly, to thermal management of electronic assemblies.
- circuit board assembly includes electronic components that mount to an insulative substrate. Wires or traces are placed on different layers of the substrate to electrically interconnect the components.
- a circuit board assembly generally includes one or more connectors for attaching the assembly to other parts of an electronic system, and may include multiple tiers of circuit boards connected together.
- Circuit board assemblies are typically provided in standard sizes and shapes. Standardization allows the assemblies to plug into a standardized chassis, or "card cages.”
- a typical card cage has a front face with an opening for receiving circuit board assemblies and a backplane located toward the rear of the card cage.
- the backplane has connectors for making blind mate connections with the circuit board assemblies.
- Circuit board assemblies are generally inserted into the opening of the card cage at fixed locations, called "slots."
- One or more connectors on each circuit board assembly mates with one or more respective connectors on the backplane. Conductive pathways within the backplane allow transmission of electrical signals between different circuit board assemblies.
- a card cage can generally accommodate different numbers and types of electronic assemblies. Numerous instances of any one type of assembly may be provided together in a card cage. In addition, different types of assemblies can be provided within a card cage.
- a card cage is often bolted to a frame, generally called a "rack." The rack may hold multiple card cages, as well as other equipment. Racks for holding electronic equipment are generally provided in standard sizes, such as the common 19 inch (48.3 cm) rack. As is known, electronic assemblies require adequate cooling to function properly.
- liquid cooling system it would be desirable for a liquid cooling system to be suitable for use with standard sized circuit board assemblies, card cages, and racks. It would also be desirable to be able to vary the amount of liquid cooling capacity according to the number and types of circuit board assemblies used.
- a plurality of liquid- coolable electronic assemblies are placed in a system at a first location, and a plurality of liquid cooling assemblies are placed in the system at a second location, which is generally above or below the first location.
- Liquid transport pathways such as hoses, are connected between the plurality of electronic assemblies and the plurality of cooling assemblies for circulating liquid coolant.
- the arrangement is modular, and different numbers of liquid cooling assemblies may be provided for cooling different numbers or types of electronic assemblies, as the target application requires.
- Fig. 1 is an isometric view of an illustrative embodiment of an electronic system employing modular cooling assemblies
- Fig. 2 is an isometric, rear view of one of the cooling assemblies shown in Fig. 1;
- Fig. 3 is a plan, side view of one of the cooling assemblies shown in Figs. 1 and 2;
- Fig. 4 is a plan, side view of an embodiment of a cooling assembly that uses a liquid-to-liquid heat exchanger.
- Fig. 1 shows an illustrative embodiment 100 of an electronic system.
- the system 100 includes a frame 110, which is preferably a rack, such as a standard 19-inch (48.3 cm) rack.
- the rack 110 preferably has vertical supports 1 10a, 110b, 1 10c, and 11Od, a top shelf 11 Oe, and a bottom shelf 11 Of.
- a card cage 112 is inserted into the rack, where it is preferably attached using bolts.
- the card cage 112 preferably houses a backplane 116, which has backplane connectors 118.
- the card cage 112 is at least partially loaded with circuit board assemblies 120, installed side-by-side. As shown at the bottom-left of Fig. 1, each circuit board assembly 120 preferably has a front panel 122.
- An electrical connector 124 may be attached to the front panel 122 for exchanging electrical signals with other equipment in the system.
- Coolant ports 126a and 126b are also preferably attached to the front panel 122.
- Each circuit board assembly 120 preferably includes a cold plate 129.
- the cold plate 129 is preferably placed in close thermal contact with power dissipative components within the assembly 120.
- the cold plate is coupled to the pair of coolant ports, 126a and 126b. Liquid coolant is made to flow into port 126b, through the cold plate 129, and then back out of the assembly via port 126a. Heat from the components of the assembly 120 is thus drawn into the cold plate and then away from the assembly 120.
- the circuit board assemblies plug into the backplane 116 via the connectors 118.
- the backplane 116 has conductive wires or traces (not shown) running between different connectors 118, for allowing the circuit board assemblies to communicate and exchange signals, both with one another and with other types of circuit board assemblies plugged into the backplane 1 16, as needed.
- the circuit board assemblies are computer servers.
- the system 100 also includes a plurality of liquid cooling assemblies 130. These assemblies are preferably attached to a support 1 14, located directly above the card cage 112.
- the support such as a cage 114, is preferably bolted to the rack 110.
- the support can be a shelf or a simple frame.
- each liquid cooling assembly 130 preferably has a front 130a, a top 130c, and a bottom 130d.
- a vent 134 is preferably provided toward the top front 130a of the unit.
- Coolant ports 136a and 136b are also preferably provided at the front 130a of the unit. Multiple pairs of coolant ports may be provided.
- an access door 138 is preferably provided on the front face to facilitate servicing. The access door 138 preferably attaches to the liquid cooling assembly 130 via thumb screws 138a.
- Each liquid cooling assembly 130 is connected to at least one circuit board assembly 120 for exchanging liquid coolant with the assembly.
- a liquid transport pathway such as a hose 146a, is connected between a coolant port 136a and a coolant port 126b.
- a hose 146b is connected between a coolant port 136b and a coolant port 126a.
- Other types of liquid connection pathways can be used, such as rigid pathways or blind-mate pathways. Coolant flows out of the port 136a of the liquid cooling assembly 130 and into the port 126b of the circuit board assembly 120. Spent coolant flows out of port 126a and back to the liquid cooling assembly 130, where it enters via port 136b.
- each liquid cooling assembly 130 has three source ports 136a and three return ports 136b, for simultaneously cooling up to three circuit board assemblies 120.
- the hoses 146a/146b for cooling different circuit board assemblies are preferably all the same length. They preferably pass straight down, from the liquid cooling assembly 130 to the circuit board assemblies 120 they service. To reduce clutter in the figure, only one pair of hose connections is shown (it is shown schematically). It is understood, however, that each circuit board assembly 120 has a pair of hoses 146a/146b (or other liquid transport pathways) attached between its ports 126a/126b and a pair of coolant ports 136a/136b on a liquid cooling assembly 130.
- Fig. 2 shows a rear view of one of the liquid cooling assemblies 130 of Fig. 1.
- the liquid cooling assembly 130 has a rear face 130b.
- a power supply module 210 is preferably inserted into an opening toward the top of the rear face 130b.
- a fan module 220 is preferably inserted into an opening toward the bottom of the rear face 130b.
- Fig. 2 also shows the power supply module 210 and the fan module 220 removed from the liquid cooling assembly 130, above and below the module 130, respectively.
- the power supply module 210 has a front face 210a.
- a handle 212 is preferably attached to the front face, to facilitate manual insertion and removal of the module 210 from the liquid cooling assembly 130.
- a vent 214 is preferably formed in the front face 210a, for promoting air flow through the power supply module.
- Thumb screws 216 are preferably used to fasten the power supply module to the liquid cooling assembly 130.
- the power supply module 210 may include a fan 218 (seen in Figs. 3 and 4) to provide localized cooling.
- the fan module 220 has a front face 220a, on which a handle 222 and thumb screws 216 are mounted.
- the fan module includes fans 224a-d.
- the fan module 220 is preferably open at its top and bottom, to allow air to readily pass from top to bottom. Alternatively, vented covers can be provided at the top and bottom.
- Fig. 3 shows a side, plan view of the liquid cooling assembly 130.
- the front of the assembly 130 appears to the left of the figure, and the rear of the assembly appears to the right. From this perspective, the power supply module 210 and the fan module 220 are clearly visible.
- the liquid cooling assembly 130 is seen to include an air inlet region 310 and an air outlet region (plenum) 312. Also evident are the outlet port 136a, the inlet port 136b, a reservoir (e.g., a tank) 314, a pump 316, and a liquid-to-air heat exchanger (e.g., a radiator) 318.
- the liquid cooling assembly 130 operates essentially as follows.
- the power supply module 210 provides DC power for running the fan module 220 and the pump 316.
- the pump 316 generates an elevated liquid pressure at its output (shown to the left of the pump).
- the increased pressure causes liquid coolant to flow out of the port 136a and into one or more assemblies to be cooled.
- Coolant flows back into the liquid cooling assembly 130, via port 136b, and into the radiator 318. Coolant then flows into the tank 314 and is returned to the pump 316, whereupon the process repeats itself indefinitely.
- the radiator 318 cools the liquid coolant.
- the fan assembly 220 establishes a downward flow of air. Air is drawn through the vent 134 and into the inlet region 310.
- Fig. 3 shows only one pair of cooling ports 136a/136b. Additional ports are connected in parallel.
- the pump 316 has an outlet (to the left) that is branched into three parallel paths. Each of these paths is terminated in a port 136a.
- the radiator 318 preferably has an inlet (to the left) that is branched into three parallel paths, each being terminated in a port 136b.
- Electrical cables are preferably used to distribute electrical power within the liquid cooling assembly 130.
- One cable connects the pump 316 to the power supply module 210, and another cable connects the fan module 220 to the power supply module 210.
- the pump 316 has a magnetically coupled motor.
- the motor can be serviced and/or replaced, such as via the access door 138, without disturbing the liquid plumbing to the pump or the hoses 146a/146b.
- Liquid cooling can be supplied where needed, and only to the extent needed. Systems with only modest liquid cooling needs can have those needs satisfied without a large investment. Systems with greater liquid cooling needs can receive as much liquid cooling capacity as needed.
- the modular liquid cooling arrangement disclosed herein can easily be incorporated into existing systems. Circuit board assemblies can employ liquid cooling, while still fitting into standardized card cages and racks.
- liquid cooling assemblies 130 placed above the card cage 112, this is not required.
- the liquid cooling assemblies 130 can alternatively be placed below the card cage 112 or beside the card cage 112.
- the liquid cooling assemblies 130 need not be mounted in the same rack as the card cage. They need not be mounted in a rack at all.
- the power supply module 210 is removable through an opening in the rear 130b of the liquid cooling assembly 130. This is not required, however.
- the assembly 130 can be designed so that the power supply module 210 is removable through an opening in the front 130a.
- the power supply module should be preferably located above the coolant ports 136a and 136b.
- the fan assembly 220 can be made removable from the front 130a. Once again, however, to preserve the ease of servicing, the fan assembly should placed above the ports 136a and 136b.
- liquid cooling assemblies 130 are placed below the card cage and the power supply module 210 is removable from the front, the liquid cooling assembly 130 should preferably be turned upside down, or the internal arrangement of its components modified, to preserve the ability to remove the power supply module 210 without disturbing the liquid connections.
- each liquid cooling assembly 130 cools three circuit board assemblies 120. This is not required, however. Each liquid cooling assembly 130 can be arranged to cool an arbitrary number of circuit board assemblies. Liquid cooling assemblies 130 can thus have any number of coolant ports 136a and 136b. In addition, multiple liquid cooling assemblies 130 (or coolant ports thereof) can be connected in parallel for cooling a single, high power assembly.
- the circuit board assemblies in the preferred embodiment are computer servers, the invention applies equally well to any type of assembly that employs liquid cooling. This includes, but is not limited to, line cards and switch cards used in telecom and datacom applications.
- liquid cooling assemblies 130 are provided for cooling circuit board assemblies.
- the assemblies 130 can be used to cool other types of equipment, such as equipment that mounts directly to a rack.
- both the card cage 112 and the liquid cooling assemblies 130 can be rotated 90 degrees or 270 degrees.
- Each liquid cooling assembly 130 has been shown and described as cooling spent liquid coolant using a radiator 318 and fan module 220.
- the liquid cooling assemblies 130 may alternatively employ refrigeration.
- the spent coolant can be passed through a refrigeration unit before being sent back to the assembly/assemblies to be cooled.
- hoses are used to transport liquid coolant between the liquid cooling assemblies 130 and the electronics assemblies 120.
- blind mate liquid transport pathways can be used.
- the coolant ports 136a and 136b are preferably positioned at the rear 130b of the liquid cooling assembly 130 and coolant ports 126a and 126b are preferably positioned on the backplane 116.
- FIG. 4 shows another variation of the liquid cooling assembly.
- a liquid cooling assembly 430 employs a liquid-to-liquid heat exchanger 418. No fan module is required. Separate coolant, such as facility water, is piped into the heat exchanger 418. Facility water is circulated through the heat exchanger 418. Spent coolant from the assemblies 120 is also pumped through the heat exchanger 418. Heat is exchanged between the spent coolant and the facility water, to reduce the temperature of the spent coolant.
- top As used herein, the designations "top,” “bottom,” “front,” and “back” indicate positions of items or parts thereof. These designations are relative and are not required to correspond to any absolute positions. Thus, for example, nothing prevents the "top” of an item from facing the floor.
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/954,441 US7355852B2 (en) | 2004-09-30 | 2004-09-30 | Modular liquid cooling of electronic assemblies |
US10/954,411 | 2004-09-30 |
Publications (2)
Publication Number | Publication Date |
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WO2006039273A2 true WO2006039273A2 (en) | 2006-04-13 |
WO2006039273A3 WO2006039273A3 (en) | 2007-01-18 |
Family
ID=36098807
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/034596 WO2006039273A2 (en) | 2004-09-30 | 2005-09-28 | Modular liquid cooling of electronic assemblies |
Country Status (2)
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US (1) | US7355852B2 (en) |
WO (1) | WO2006039273A2 (en) |
Families Citing this family (58)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102004054337B4 (en) * | 2004-11-09 | 2007-01-11 | Rittal Res Electronic Systems Gmbh & Co. Kg | cooling arrangement |
US7599761B2 (en) * | 2005-01-19 | 2009-10-06 | Hewlett-Packard Development Company, L.P. | Cooling assist module |
DE202006007275U1 (en) * | 2006-05-06 | 2006-09-07 | Schroff Gmbh | Sub-rack with housing for receiving plug-in modules, has liquid distributor joined to heat-sink via forward- and return-line |
US20070297136A1 (en) * | 2006-06-23 | 2007-12-27 | Sun Micosystems, Inc. | Modular liquid cooling of electronic components while preserving data center integrity |
JP5283836B2 (en) | 2006-07-25 | 2013-09-04 | 富士通株式会社 | Heat receiver and liquid cooling unit for liquid cooling unit and electronic device |
JP2008027374A (en) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | Heat receiver for liquid cooling unit, liquid cooling unit, and electronic device |
JP4781929B2 (en) * | 2006-07-25 | 2011-09-28 | 富士通株式会社 | Electronics |
JP2008027370A (en) * | 2006-07-25 | 2008-02-07 | Fujitsu Ltd | Electronic device |
JP5133531B2 (en) * | 2006-07-25 | 2013-01-30 | 富士通株式会社 | Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment |
JP4842040B2 (en) | 2006-07-25 | 2011-12-21 | 富士通株式会社 | Electronics |
JP5148079B2 (en) * | 2006-07-25 | 2013-02-20 | 富士通株式会社 | Heat exchanger for liquid cooling unit, liquid cooling unit and electronic equipment |
US7447026B2 (en) * | 2006-08-31 | 2008-11-04 | Hewlett-Packard Development Company, L.P. | System for hot swapping heat exchangers |
DE502007001183D1 (en) * | 2007-01-23 | 2009-09-10 | Schroff Gmbh | Control cabinet for mounting electronic plug-in units with a heat exchanger |
US7551440B2 (en) * | 2007-01-24 | 2009-06-23 | Hewlett-Packard Development Company, L.P. | System and method for cooling an electronic component |
US7602609B2 (en) * | 2007-05-31 | 2009-10-13 | Liebert Corporation | Cooling system and method of use |
US20090027856A1 (en) * | 2007-07-26 | 2009-01-29 | Mccoy Scott | Blade cooling system using wet and dry heat sinks |
US11113228B2 (en) | 2008-02-13 | 2021-09-07 | Arnouse Digital Devices Corporation | Portable computing system and portable computer for use with same |
US10235323B2 (en) | 2008-02-13 | 2019-03-19 | Michael Arnouse | Portable computing system and portable computer for use with same |
US9141139B2 (en) * | 2012-04-10 | 2015-09-22 | Arnouse Digital Devices Corp. | Mobile data center |
USRE49124E1 (en) * | 2008-02-13 | 2022-07-05 | Arnouse Digital Devices Corp. | Mobile data center |
CN102037426B (en) * | 2008-04-21 | 2014-08-06 | 固核电脑公司 | A case and rack system for liquid submersion cooling of electronic devices connected in an array |
GB2463956B (en) * | 2008-05-20 | 2010-11-03 | Semper Holdings Ltd | Rack mounted cooling unit |
US8656985B2 (en) * | 2008-09-30 | 2014-02-25 | International Business Machines Corporation | Rackmount rear door heat exchanger |
US7688584B1 (en) * | 2008-10-02 | 2010-03-30 | Environmental Container Systems, Inc. | Cooling system for rack-mounted electronics equipment |
US7961475B2 (en) * | 2008-10-23 | 2011-06-14 | International Business Machines Corporation | Apparatus and method for facilitating immersion-cooling of an electronic subsystem |
US7916483B2 (en) | 2008-10-23 | 2011-03-29 | International Business Machines Corporation | Open flow cold plate for liquid cooled electronic packages |
US7983040B2 (en) | 2008-10-23 | 2011-07-19 | International Business Machines Corporation | Apparatus and method for facilitating pumped immersion-cooling of an electronic subsystem |
US7885070B2 (en) | 2008-10-23 | 2011-02-08 | International Business Machines Corporation | Apparatus and method for immersion-cooling of an electronic system utilizing coolant jet impingement and coolant wash flow |
US7944694B2 (en) | 2008-10-23 | 2011-05-17 | International Business Machines Corporation | Liquid cooling apparatus and method for cooling blades of an electronic system chassis |
US7724524B1 (en) * | 2008-11-12 | 2010-05-25 | International Business Machines Corporation | Hybrid immersion cooled server with integral spot and bath cooling |
US8189334B2 (en) | 2010-05-26 | 2012-05-29 | International Business Machines Corporation | Dehumidifying and re-humidifying cooling apparatus and method for an electronics rack |
US7905096B1 (en) * | 2010-05-26 | 2011-03-15 | International Business Machines Corporation | Dehumidifying and re-humidifying air cooling for an electronics rack |
US9038406B2 (en) | 2010-05-26 | 2015-05-26 | International Business Machines Corporation | Dehumidifying cooling apparatus and method for an electronics rack |
US8144467B2 (en) | 2010-05-26 | 2012-03-27 | International Business Machines Corporation | Dehumidifying and re-humidifying apparatus and method for an electronics rack |
US8351206B2 (en) | 2010-06-29 | 2013-01-08 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems and vertically-mounted, vapor-condensing unit |
US8179677B2 (en) | 2010-06-29 | 2012-05-15 | International Business Machines Corporation | Immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8369091B2 (en) | 2010-06-29 | 2013-02-05 | International Business Machines Corporation | Interleaved, immersion-cooling apparatus and method for an electronic subsystem of an electronics rack |
US8184436B2 (en) | 2010-06-29 | 2012-05-22 | International Business Machines Corporation | Liquid-cooled electronics rack with immersion-cooled electronic subsystems |
US8345423B2 (en) | 2010-06-29 | 2013-01-01 | International Business Machines Corporation | Interleaved, immersion-cooling apparatuses and methods for cooling electronic subsystems |
CN103609205B (en) * | 2011-02-28 | 2016-03-30 | 里塔尔有限责任两合公司 | Cooling device |
WO2012116727A1 (en) * | 2011-02-28 | 2012-09-07 | Rittal Gmbh & Co. Kg | Cooling device |
US8922998B2 (en) * | 2011-10-26 | 2014-12-30 | International Business Machines Corporation | Coolant manifold with separately rotatable manifold section(s) |
EP2649730B1 (en) | 2012-02-21 | 2015-01-14 | Huawei Technologies Co., Ltd. | Liquid cooling system and method for cooling at least one radio unit |
US10101769B2 (en) | 2012-04-10 | 2018-10-16 | Michael Arnouse | Mobile data center |
EP2901829B1 (en) * | 2012-09-25 | 2019-12-18 | Liquidcool Solutions, Inc. | Method and apparatus to manage coolant pressure and flow for an array of liquid submerged electronic devices |
WO2015077561A1 (en) | 2013-11-22 | 2015-05-28 | Liquidcool Solutions, Inc. | Scalable liquid submersion cooling system |
FR3017936B1 (en) * | 2014-02-21 | 2019-03-15 | Thales | THERMAL CONTROL SYSTEM OF AT LEAST ONE ELECTRONIC MODULE ON BOARD AN AIRCRAFT |
US20170303439A1 (en) * | 2014-09-30 | 2017-10-19 | Hewlett Packard Enterprise Development Lp | Modular utilities |
US9504184B2 (en) | 2015-02-12 | 2016-11-22 | International Business Machines Corporation | Flexible coolant manifold-heat sink assembly |
US9655281B2 (en) | 2015-06-26 | 2017-05-16 | Seagate Technology Llc | Modular cooling system |
US10136556B2 (en) | 2016-02-24 | 2018-11-20 | Thermal Corp. | Electronics rack with selective engagement of heat sink |
US10349557B2 (en) | 2016-02-24 | 2019-07-09 | Thermal Corp. | Electronics rack with compliant heat pipe |
FR3057344B1 (en) * | 2016-10-10 | 2019-05-24 | Bull Sas | COMPUTER CABINET WITH LIQUID COOLING MODULES |
US20190171265A1 (en) * | 2017-12-05 | 2019-06-06 | Hewlett Packard Enterprise Development Lp | Power input module |
US10893630B2 (en) | 2018-01-30 | 2021-01-12 | Hewlett Packard Enterprise Development Lp | Pumps with pre-charged fluid |
US10809466B2 (en) | 2018-11-15 | 2020-10-20 | Hewlett Packard Enterprise Development Lp | Switch sub-chassis systems and methods |
US10795096B1 (en) | 2019-04-30 | 2020-10-06 | Hewlett Packard Enterprise Development Lp | Line-card |
TWI687640B (en) * | 2019-05-27 | 2020-03-11 | 雙鴻科技股份有限公司 | Cooling system amd coolant distribution module thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
US20040057211A1 (en) * | 2002-09-24 | 2004-03-25 | Yoshihiro Kondo | Electronic equipment |
US6763880B1 (en) * | 2003-06-26 | 2004-07-20 | Evserv Tech Corporation | Liquid cooled radiation module for servers |
EP1448040A2 (en) * | 2003-02-14 | 2004-08-18 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
Family Cites Families (39)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3512582A (en) * | 1968-07-15 | 1970-05-19 | Ibm | Immersion cooling system for modularly packaged components |
US5121788A (en) * | 1989-10-16 | 1992-06-16 | Miller Electric Mfg. Co. | Self contained heat exchange apparatus |
JPH03208365A (en) * | 1990-01-10 | 1991-09-11 | Hitachi Ltd | Cooling mechanism for electronic device and usage thereof |
US5323847A (en) * | 1990-08-01 | 1994-06-28 | Hitachi, Ltd. | Electronic apparatus and method of cooling the same |
US5206791A (en) * | 1992-02-07 | 1993-04-27 | Digital Equipment Corporation | Bellows heat pipe apparatus for cooling systems |
US5216582A (en) * | 1992-02-10 | 1993-06-01 | Quantum Corporation | Shock mounted disk drive module having snap-lock cover |
US5316077A (en) * | 1992-12-09 | 1994-05-31 | Eaton Corporation | Heat sink for electrical circuit components |
US5941300A (en) | 1996-05-28 | 1999-08-24 | Illinois Tool Works Inc. | Self-contained heat exchange apparatus |
US5731954A (en) * | 1996-08-22 | 1998-03-24 | Cheon; Kioan | Cooling system for computer |
DE19719507A1 (en) * | 1997-05-09 | 1998-11-12 | Alsthom Cge Alcatel | Rack with subrack and ventilation device |
US6191945B1 (en) * | 1997-07-30 | 2001-02-20 | Hewlett-Packard Company | Cold plate arrangement for cooling processor and companion voltage regulator |
US5986882A (en) * | 1997-10-16 | 1999-11-16 | Compaq Computer Corporation | Electronic apparatus having removable processor/heat pipe cooling device modules therein |
US6151210A (en) * | 1999-05-06 | 2000-11-21 | Lucent Technologies Inc. | Modular design of electronic equipment systems |
US6234240B1 (en) * | 1999-07-01 | 2001-05-22 | Kioan Cheon | Fanless cooling system for computer |
US6490160B2 (en) * | 1999-07-15 | 2002-12-03 | Incep Technologies, Inc. | Vapor chamber with integrated pin array |
US6166907A (en) * | 1999-11-26 | 2000-12-26 | Chien; Chuan-Fu | CPU cooling system |
US6519955B2 (en) * | 2000-04-04 | 2003-02-18 | Thermal Form & Function | Pumped liquid cooling system using a phase change refrigerant |
US6313990B1 (en) * | 2000-05-25 | 2001-11-06 | Kioan Cheon | Cooling apparatus for electronic devices |
US6272016B1 (en) * | 2000-05-31 | 2001-08-07 | Trw Inc | Avionics rack with external electronics module |
US6317320B1 (en) * | 2000-09-19 | 2001-11-13 | Marconi Communications, Inc. | Cooling system for electronic components in an equipment enclosure |
US6393853B1 (en) * | 2000-12-19 | 2002-05-28 | Nortel Networks Limited | Liquid cooling of removable electronic modules based on low pressure applying biasing mechanisms |
CN1290392C (en) | 2001-03-02 | 2006-12-13 | 三洋电机株式会社 | Electronic device |
US6504719B2 (en) * | 2001-03-30 | 2003-01-07 | Intel Corporation | Computer system that can be operated without a cooling fan |
US6351381B1 (en) * | 2001-06-20 | 2002-02-26 | Thermal Corp. | Heat management system |
US6536510B2 (en) * | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
US6587343B2 (en) | 2001-08-29 | 2003-07-01 | Sun Microsystems, Inc. | Water-cooled system and method for cooling electronic components |
US6608752B2 (en) * | 2001-09-24 | 2003-08-19 | General Electric Company | Adaptive heat sink for electronics applications |
US6828675B2 (en) * | 2001-09-26 | 2004-12-07 | Modine Manufacturing Company | Modular cooling system and thermal bus for high power electronics cabinets |
US6836407B2 (en) * | 2002-01-04 | 2004-12-28 | Intel Corporation | Computer system having a plurality of server units transferring heat to a fluid flowing through a frame-level fluid-channeling structure |
US6714412B1 (en) * | 2002-09-13 | 2004-03-30 | International Business Machines Corporation | Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use |
US6970355B2 (en) * | 2002-11-20 | 2005-11-29 | International Business Machines Corporation | Frame level partial cooling boost for drawer and/or node level processors |
US6840311B2 (en) * | 2003-02-25 | 2005-01-11 | Delphi Technologies, Inc. | Compact thermosiphon for dissipating heat generated by electronic components |
US6695039B1 (en) * | 2003-02-25 | 2004-02-24 | Delphi Technologies, Inc. | Orientation insensitive thermosiphon assembly for cooling electronic components |
US6724624B1 (en) * | 2003-05-05 | 2004-04-20 | Douglas A. Dodson | Housing with directed-flow cooling for computer |
US7484552B2 (en) * | 2003-12-19 | 2009-02-03 | Amphenol Corporation | Modular rackmount chiller |
US6917522B1 (en) * | 2003-12-29 | 2005-07-12 | Intel Corporation | Apparatus and method for cooling integrated circuit devices |
US7068509B2 (en) * | 2004-02-03 | 2006-06-27 | Hewlett-Packard Development Company, L.P. | Small form factor cooling system |
US7002799B2 (en) * | 2004-04-19 | 2006-02-21 | Hewlett-Packard Development Company, L.P. | External liquid loop heat exchanger for an electronic system |
US6967841B1 (en) * | 2004-05-07 | 2005-11-22 | International Business Machines Corporation | Cooling assembly for electronics drawer using passive fluid loop and air-cooled cover |
-
2004
- 2004-09-30 US US10/954,441 patent/US7355852B2/en not_active Expired - Fee Related
-
2005
- 2005-09-28 WO PCT/US2005/034596 patent/WO2006039273A2/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040008483A1 (en) * | 2002-07-13 | 2004-01-15 | Kioan Cheon | Water cooling type cooling system for electronic device |
US20040057211A1 (en) * | 2002-09-24 | 2004-03-25 | Yoshihiro Kondo | Electronic equipment |
EP1448040A2 (en) * | 2003-02-14 | 2004-08-18 | Hitachi, Ltd. | Liquid cooling system for a rack-mount server system |
US6763880B1 (en) * | 2003-06-26 | 2004-07-20 | Evserv Tech Corporation | Liquid cooled radiation module for servers |
Also Published As
Publication number | Publication date |
---|---|
WO2006039273A3 (en) | 2007-01-18 |
US7355852B2 (en) | 2008-04-08 |
US20060067047A1 (en) | 2006-03-30 |
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