WO2006028942A3 - Thermally controlled self-assembly method and support - Google Patents

Thermally controlled self-assembly method and support Download PDF

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Publication number
WO2006028942A3
WO2006028942A3 PCT/US2005/031239 US2005031239W WO2006028942A3 WO 2006028942 A3 WO2006028942 A3 WO 2006028942A3 US 2005031239 W US2005031239 W US 2005031239W WO 2006028942 A3 WO2006028942 A3 WO 2006028942A3
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WO
WIPO (PCT)
Prior art keywords
support
binding sites
components
conductive path
micro
Prior art date
Application number
PCT/US2005/031239
Other languages
French (fr)
Other versions
WO2006028942A2 (en
Inventor
Theodore K Ricks
Ravi Sharma
Original Assignee
Eastman Kodak Co
Theodore K Ricks
Ravi Sharma
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Eastman Kodak Co, Theodore K Ricks, Ravi Sharma filed Critical Eastman Kodak Co
Priority to EP05794305A priority Critical patent/EP1784860A2/en
Priority to JP2007530377A priority patent/JP2008512253A/en
Publication of WO2006028942A2 publication Critical patent/WO2006028942A2/en
Publication of WO2006028942A3 publication Critical patent/WO2006028942A3/en

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Abstract

A support (60) and a method for assembling micro-components (80, 84) to binding sites (62, 64, 66, 68) on the support are provided. The support has a pattern of electrical conductors adapted to conduct electrical energy between binding sites. In accordance with the method, an electrical signal is passed through at least one conductive path including at least one of the conductors so that heat is generated by a portion of each conductive path proximate to the binding sites, a first fluid (72) is applied to the support that is adapted to increase in viscosity when heated, and, a carrier fluid (73) having first micro-components (80) adapted to engage the binding sites is applied to the support. Wherein the heat from the at least one conductive path increases the viscosity of the first fluid in areas (92, 94) proximate to the selected binding sites (62, 66) so as to inhibit first micro-components from engaging the binding sites (62, 66) .
PCT/US2005/031239 2004-09-03 2005-09-01 Thermally controlled self-assembly method and support WO2006028942A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
EP05794305A EP1784860A2 (en) 2004-09-03 2005-09-01 Thermally controlled self-assembly method and support
JP2007530377A JP2008512253A (en) 2004-09-03 2005-09-01 Thermally controlled self-assembly method and support

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/849,329 2004-09-03
US10/849,329 US7251882B2 (en) 2004-09-03 2004-09-03 Method for assembling micro-components to binding sites

Publications (2)

Publication Number Publication Date
WO2006028942A2 WO2006028942A2 (en) 2006-03-16
WO2006028942A3 true WO2006028942A3 (en) 2006-06-15

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Family Applications (1)

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PCT/US2005/031239 WO2006028942A2 (en) 2004-09-03 2005-09-01 Thermally controlled self-assembly method and support

Country Status (5)

Country Link
US (1) US7251882B2 (en)
EP (1) EP1784860A2 (en)
JP (1) JP2008512253A (en)
TW (1) TW200623342A (en)
WO (1) WO2006028942A2 (en)

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US7687277B2 (en) * 2004-12-22 2010-03-30 Eastman Kodak Company Thermally controlled fluidic self-assembly
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WO2007037381A1 (en) * 2005-09-29 2007-04-05 Matsushita Electric Industrial Co., Ltd. Method of mounting electronic circuit constituting member and relevant mounting apparatus
KR100649445B1 (en) * 2005-10-17 2006-11-27 삼성전기주식회사 Wiring forming method and device
WO2007062268A2 (en) * 2005-11-28 2007-05-31 University Of Florida Research Foundation, Inc. Method and structure for magnetically-directed, self-assembly of three-dimensional structures
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