WO2006007141A3 - Lead solder indicator and method - Google Patents
Lead solder indicator and method Download PDFInfo
- Publication number
- WO2006007141A3 WO2006007141A3 PCT/US2005/017702 US2005017702W WO2006007141A3 WO 2006007141 A3 WO2006007141 A3 WO 2006007141A3 US 2005017702 W US2005017702 W US 2005017702W WO 2006007141 A3 WO2006007141 A3 WO 2006007141A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- carrier
- solder system
- solder
- semiconductor device
- lead solder
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 7
- 238000000034 method Methods 0.000 title abstract 2
- 239000004065 semiconductor Substances 0.000 abstract 3
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000004907 flux Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
- H01L23/49816—Spherical bumps on the substrate for external connection, e.g. ball grid arrays [BGA]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/34—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies not provided for in groups H01L21/0405, H01L21/0445, H01L21/06, H01L21/16 and H01L21/18 with or without impurities, e.g. doping materials
- H01L21/44—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/38 - H01L21/428
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
- H01L2224/118—Post-treatment of the bump connector
- H01L2224/1181—Cleaning, e.g. oxide removal step, desmearing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/812—Applying energy for connecting
- H01L2224/8121—Applying energy for connecting using a reflow oven
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/818—Bonding techniques
- H01L2224/81801—Soldering or alloying
- H01L2224/81815—Reflow soldering
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01049—Indium [In]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0105—Tin [Sn]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/014—Solder alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12042—LASER
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP05751936A EP1761951A4 (en) | 2004-06-29 | 2005-05-19 | Lead solder indicator and method |
KR1020067027716A KR101227210B1 (en) | 2004-06-29 | 2005-05-19 | Lead solder indicator and method |
JP2007519215A JP5159306B2 (en) | 2004-06-29 | 2005-05-19 | Lead solder indicator and method |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/879,242 US7074627B2 (en) | 2004-06-29 | 2004-06-29 | Lead solder indicator and method |
US10/879,242 | 2004-06-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2006007141A2 WO2006007141A2 (en) | 2006-01-19 |
WO2006007141A3 true WO2006007141A3 (en) | 2006-10-05 |
Family
ID=35504780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/017702 WO2006007141A2 (en) | 2004-06-29 | 2005-05-19 | Lead solder indicator and method |
Country Status (8)
Country | Link |
---|---|
US (1) | US7074627B2 (en) |
EP (1) | EP1761951A4 (en) |
JP (1) | JP5159306B2 (en) |
KR (1) | KR101227210B1 (en) |
CN (1) | CN100501960C (en) |
MY (1) | MY139006A (en) |
TW (1) | TWI407514B (en) |
WO (1) | WO2006007141A2 (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7251880B2 (en) * | 2001-09-28 | 2007-08-07 | Intel Corporation | Method and structure for identifying lead-free solder |
CN102171563A (en) * | 2008-10-30 | 2011-08-31 | 丰田自动车株式会社 | Method for detecting lead present in specimen |
KR101097488B1 (en) * | 2009-09-08 | 2011-12-22 | 삼성전기주식회사 | Method of manufacturing pin grid array substrate |
DE102010033092A1 (en) * | 2010-08-02 | 2012-02-02 | Osram Opto Semiconductors Gmbh | Optoelectronic light module and car headlights |
DE102017212796A1 (en) * | 2017-07-26 | 2019-01-31 | Robert Bosch Gmbh | Electrical assembly |
CN108346952B (en) * | 2018-01-25 | 2020-11-24 | 番禺得意精密电子工业有限公司 | Electric connector holder |
KR20210154244A (en) * | 2019-09-12 | 2021-12-20 | 양쯔 메모리 테크놀로지스 씨오., 엘티디. | Electronic component comprising a substrate having a thermal indicator |
CN115362762A (en) * | 2020-05-28 | 2022-11-18 | 松下知识产权经营株式会社 | Mounting substrate manufacturing apparatus and mounting substrate manufacturing method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6187114B1 (en) * | 1996-10-17 | 2001-02-13 | Matsushita Electric Industrial Co. Ltd. | Solder material and electronic part using the same |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
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US5330917A (en) * | 1989-02-02 | 1994-07-19 | Hybrivet Systems, Inc. | Test swab device and method of detecting lead, mercury, arsenic, and bismuth |
US5039618A (en) * | 1989-02-02 | 1991-08-13 | Hybrivet Systems, Inc. | Test swab cartridge type device and method for detecting lead and cadmium |
US5364792A (en) * | 1989-02-02 | 1994-11-15 | Hybrivet Systems, Inc. | Test swab and method of making and using same |
DE4034087A1 (en) * | 1989-10-27 | 1991-05-23 | Tsubakimoto Chain Co | Tensioner for power transmission chain - has housing containing cylindrical bushing with plate fixed to one end, and plastics block and guide |
US5120678A (en) * | 1990-11-05 | 1992-06-09 | Motorola Inc. | Electrical component package comprising polymer-reinforced solder bump interconnection |
US5086966A (en) | 1990-11-05 | 1992-02-11 | Motorola Inc. | Palladium-coated solder ball |
US5088007A (en) * | 1991-04-04 | 1992-02-11 | Motorola, Inc. | Compliant solder interconnection |
US5229070A (en) * | 1992-07-02 | 1993-07-20 | Motorola, Inc. | Low temperature-wetting tin-base solder paste |
US5320272A (en) * | 1993-04-02 | 1994-06-14 | Motorola, Inc. | Tin-bismuth solder connection having improved high temperature properties, and process for forming same |
US5389160A (en) * | 1993-06-01 | 1995-02-14 | Motorola, Inc. | Tin bismuth solder paste, and method using paste to form connection having improved high temperature properties |
US5523920A (en) * | 1994-01-03 | 1996-06-04 | Motorola, Inc. | Printed circuit board comprising elevated bond pads |
US5519535A (en) * | 1994-04-04 | 1996-05-21 | Motorola, Inc. | Precision placement apparatus having liquid crystal shuttered dual prism probe |
US5708812A (en) * | 1996-01-18 | 1998-01-13 | Microsoft Corporation | Method and apparatus for Migrating from a source domain network controller to a target domain network controller |
WO1998002224A1 (en) * | 1996-07-12 | 1998-01-22 | Ibc Advanced Technologies, Inc. | Method for the colorimetric quantification of ions |
US5832274A (en) * | 1996-10-09 | 1998-11-03 | Novell, Inc. | Method and system for migrating files from a first environment to a second environment |
WO1998057167A1 (en) * | 1997-06-11 | 1998-12-17 | The Government Of The United States Of America, As Represented By The Secretary Of The Department Of Health And Human Services | Handwipe disclosing method for the presence of lead |
JPH11272427A (en) * | 1998-03-24 | 1999-10-08 | Hitachi Ltd | Method for saving data and outside storage device |
GB9903552D0 (en) * | 1999-02-16 | 1999-04-07 | Multicore Solders Ltd | Reflow peak temperature reduction of solder alloys |
US6261868B1 (en) * | 1999-04-02 | 2001-07-17 | Motorola, Inc. | Semiconductor component and method for manufacturing the semiconductor component |
US6462413B1 (en) * | 1999-07-22 | 2002-10-08 | Polese Company, Inc. | LDMOS transistor heatsink package assembly and manufacturing method |
JP2001208742A (en) * | 2000-01-26 | 2001-08-03 | Hitachi Ltd | Jig for detecting lead |
US6640291B2 (en) * | 2001-08-10 | 2003-10-28 | Hitachi, Ltd. | Apparatus and method for online data migration with remote copy |
JP4168626B2 (en) * | 2001-12-06 | 2008-10-22 | 株式会社日立製作所 | File migration method between storage devices |
US7007046B2 (en) * | 2002-03-19 | 2006-02-28 | Network Appliance, Inc. | Format for transmission file system information between a source and a destination |
JP2004102374A (en) * | 2002-09-05 | 2004-04-02 | Hitachi Ltd | Information processing system having data transition device |
JP4411929B2 (en) * | 2003-02-28 | 2010-02-10 | 株式会社日立製作所 | Backup method, system, and program |
-
2004
- 2004-06-29 US US10/879,242 patent/US7074627B2/en active Active
-
2005
- 2005-05-19 CN CNB2005800217949A patent/CN100501960C/en active Active
- 2005-05-19 JP JP2007519215A patent/JP5159306B2/en active Active
- 2005-05-19 KR KR1020067027716A patent/KR101227210B1/en active IP Right Grant
- 2005-05-19 WO PCT/US2005/017702 patent/WO2006007141A2/en not_active Application Discontinuation
- 2005-05-19 EP EP05751936A patent/EP1761951A4/en not_active Withdrawn
- 2005-06-02 MY MYPI20052523A patent/MY139006A/en unknown
- 2005-06-14 TW TW094119700A patent/TWI407514B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6187114B1 (en) * | 1996-10-17 | 2001-02-13 | Matsushita Electric Industrial Co. Ltd. | Solder material and electronic part using the same |
Also Published As
Publication number | Publication date |
---|---|
JP2008504963A (en) | 2008-02-21 |
CN1977370A (en) | 2007-06-06 |
US20050285274A1 (en) | 2005-12-29 |
US7074627B2 (en) | 2006-07-11 |
MY139006A (en) | 2009-08-28 |
TW200625484A (en) | 2006-07-16 |
EP1761951A4 (en) | 2009-09-09 |
EP1761951A2 (en) | 2007-03-14 |
KR101227210B1 (en) | 2013-01-28 |
KR20070083395A (en) | 2007-08-24 |
JP5159306B2 (en) | 2013-03-06 |
TWI407514B (en) | 2013-09-01 |
CN100501960C (en) | 2009-06-17 |
WO2006007141A2 (en) | 2006-01-19 |
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