WO2005100636A3 - Techniques for packaging and encapsulating components of diagnostic plasma measurement devices - Google Patents

Techniques for packaging and encapsulating components of diagnostic plasma measurement devices Download PDF

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Publication number
WO2005100636A3
WO2005100636A3 PCT/US2005/009581 US2005009581W WO2005100636A3 WO 2005100636 A3 WO2005100636 A3 WO 2005100636A3 US 2005009581 W US2005009581 W US 2005009581W WO 2005100636 A3 WO2005100636 A3 WO 2005100636A3
Authority
WO
WIPO (PCT)
Prior art keywords
probe
substrate
techniques
disposed
packaging
Prior art date
Application number
PCT/US2005/009581
Other languages
French (fr)
Other versions
WO2005100636A2 (en
Inventor
Daniel C Carter
Daniel B Doran
Leonard J Mahoney
Original Assignee
Advanced Energy Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Energy Ind Inc filed Critical Advanced Energy Ind Inc
Publication of WO2005100636A2 publication Critical patent/WO2005100636A2/en
Publication of WO2005100636A3 publication Critical patent/WO2005100636A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32917—Plasma diagnostics
    • H01J37/32935—Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

An in-situ plasma measurement probe comprises a primary substrate, such as a silicon wafer, with sensor devices disposed about the surface of the probe. An electronics module contains electronic components or other elements of the diagnostic probe that require isolation and shielding from the plasma environment. The electronics module is disposed upon the probe substrate and electrically connected to the remote sensor devices through one or more electrical interconnection layers disposed upon the substrate. By integrating and modularizing the electronic components of a sensor probe, the probe design may be optimized for cost effective production techniques while ensuring mechanical, chemical, and thermal compatibility with the wafer or other carrying substrate and the environment to which it is exposed.
PCT/US2005/009581 2004-03-31 2005-03-21 Techniques for packaging and encapsulating components of diagnostic plasma measurement devices WO2005100636A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/815,124 2004-03-31
US10/815,124 US20050217796A1 (en) 2004-03-31 2004-03-31 Techniques for packaging and encapsulating components of diagnostic plasma measurement devices

Publications (2)

Publication Number Publication Date
WO2005100636A2 WO2005100636A2 (en) 2005-10-27
WO2005100636A3 true WO2005100636A3 (en) 2006-08-03

Family

ID=35052982

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/009581 WO2005100636A2 (en) 2004-03-31 2005-03-21 Techniques for packaging and encapsulating components of diagnostic plasma measurement devices

Country Status (3)

Country Link
US (1) US20050217796A1 (en)
TW (1) TW200532753A (en)
WO (1) WO2005100636A2 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7960670B2 (en) 2005-05-03 2011-06-14 Kla-Tencor Corporation Methods of and apparatuses for measuring electrical parameters of a plasma process
WO2008103700A2 (en) 2007-02-23 2008-08-28 Kla-Tencor Corporation Process condition measuring device
US8712571B2 (en) * 2009-08-07 2014-04-29 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for wireless transmission of diagnostic information
US9222842B2 (en) * 2013-01-07 2015-12-29 Kla-Tencor Corporation High temperature sensor wafer for in-situ measurements in active plasma
US10327655B2 (en) 2016-04-11 2019-06-25 Paradromics, Inc. Neural-interface probe and methods of packaging the same
US10892179B2 (en) * 2016-11-08 2021-01-12 Lam Research Corporation Electrostatic chuck including clamp electrode assembly forming portion of Faraday cage for RF delivery and associated methods
TWI669029B (en) * 2016-11-11 2019-08-11 日商京瓷股份有限公司 Package for mounting an electric component, array package, and electrical device
WO2018183967A1 (en) 2017-03-30 2018-10-04 Paradromics, Inc. Patterned microwire bundles and methods of producing the same

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020105792A1 (en) * 2000-09-29 2002-08-08 Masud Beroz Wave strip injection form
US20030001083A1 (en) * 2001-06-28 2003-01-02 Greene Tweed Of Delaware, Inc. Self contained sensing apparatus and system
US20040031340A1 (en) * 2002-01-24 2004-02-19 Renken Wayne G. Process condition sensing wafer and data analysis system
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4577056A (en) * 1984-04-09 1986-03-18 Olin Corporation Hermetically sealed metal package
US5200640A (en) * 1991-08-12 1993-04-06 Electron Power Inc. Hermetic package having covers and a base providing for direct electrical connection
US5786548A (en) * 1996-08-15 1998-07-28 Hughes Electronics Corporation Hermetic package for an electrical device

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020105792A1 (en) * 2000-09-29 2002-08-08 Masud Beroz Wave strip injection form
US20030001083A1 (en) * 2001-06-28 2003-01-02 Greene Tweed Of Delaware, Inc. Self contained sensing apparatus and system
US20040031340A1 (en) * 2002-01-24 2004-02-19 Renken Wayne G. Process condition sensing wafer and data analysis system
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication

Also Published As

Publication number Publication date
TW200532753A (en) 2005-10-01
US20050217796A1 (en) 2005-10-06
WO2005100636A2 (en) 2005-10-27

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