WO2005091892A3 - System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components - Google Patents

System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components Download PDF

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Publication number
WO2005091892A3
WO2005091892A3 PCT/US2005/006305 US2005006305W WO2005091892A3 WO 2005091892 A3 WO2005091892 A3 WO 2005091892A3 US 2005006305 W US2005006305 W US 2005006305W WO 2005091892 A3 WO2005091892 A3 WO 2005091892A3
Authority
WO
WIPO (PCT)
Prior art keywords
components
manifold
semiconductor device
fluid
device fabrication
Prior art date
Application number
PCT/US2005/006305
Other languages
French (fr)
Other versions
WO2005091892A2 (en
Inventor
Darwin G Enicks
Carl E Friedrichs
Richard A Brucher
Original Assignee
Atmel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atmel Corp filed Critical Atmel Corp
Priority to EP20050723954 priority Critical patent/EP1784595A2/en
Publication of WO2005091892A2 publication Critical patent/WO2005091892A2/en
Publication of WO2005091892A3 publication Critical patent/WO2005091892A3/en

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/003—Housing formed from a plurality of the same valve elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/0318—Processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/4238—With cleaner, lubrication added to fluid or liquid sealing at valve interface
    • Y10T137/4245—Cleaning or steam sterilizing
    • Y10T137/4259—With separate material addition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/85978—With pump
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T137/00—Fluid handling
    • Y10T137/8593—Systems
    • Y10T137/877—With flow control means for branched passages
    • Y10T137/87877—Single inlet with multiple distinctly valved outlets

Abstract

A system, apparatus, and method for reducing contaminants of semiconductor device fabrication equipment components (82, 84, 86), featuring a manifold (12) having a passageway (14) in fluid communication with a plurality of inlets (22) and for providing a purge fluid to removably connected components to undergo contaminant reduction. The inlets are connected to a plurality of manifold valves (30) to which components are removably connected. The manifold valves are operable to place connected components into and out of fluid communication with the inlets and the passageway. A fluid source (20) supplies purge fluid to the manifold and a pump (32) is connected to the manifold to remove fluid from the system. In one embodiment, an oven (46) is connected to the system for outgassing and for reduction of moisture in additional components.
PCT/US2005/006305 2004-03-15 2005-02-25 System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components WO2005091892A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20050723954 EP1784595A2 (en) 2004-03-15 2005-02-25 System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/801,435 US7044147B2 (en) 2004-03-15 2004-03-15 System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components
US10/801,435 2004-03-15

Publications (2)

Publication Number Publication Date
WO2005091892A2 WO2005091892A2 (en) 2005-10-06
WO2005091892A3 true WO2005091892A3 (en) 2006-03-23

Family

ID=34920853

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/006305 WO2005091892A2 (en) 2004-03-15 2005-02-25 System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components

Country Status (5)

Country Link
US (2) US7044147B2 (en)
EP (1) EP1784595A2 (en)
CN (1) CN1954167A (en)
TW (1) TW200535958A (en)
WO (1) WO2005091892A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7044147B2 (en) * 2004-03-15 2006-05-16 Atmel Corporation System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components
US20090151623A1 (en) * 2007-12-12 2009-06-18 Atmel Corporation Formation and applications of high-quality epitaxial films
US20090189159A1 (en) * 2008-01-28 2009-07-30 Atmel Corporation Gettering layer on substrate
US8042566B2 (en) 2008-07-23 2011-10-25 Atmel Corporation Ex-situ component recovery
KR200467280Y1 (en) * 2010-02-19 2013-06-04 최육남 Pipe branching apparatus
US8893923B2 (en) * 2012-11-28 2014-11-25 Intermolecular, Inc. Methods and systems for dispensing different liquids for high productivity combinatorial processing

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383547A (en) * 1981-03-27 1983-05-17 Valin Corporation Purging apparatus

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FR2122738A5 (en) * 1971-01-21 1972-09-01 Corobit Anstalt
US4352532A (en) * 1980-09-15 1982-10-05 Robertshaw Controls Company Manifolding means for electrical and/or pneumatic control units and parts and methods therefor
US4437479A (en) * 1981-12-30 1984-03-20 Atcor Decontamination apparatus for semiconductor wafer handling equipment
US4852516A (en) * 1986-05-19 1989-08-01 Machine Technology, Inc. Modular processing apparatus for processing semiconductor wafers
US5137047A (en) * 1990-08-24 1992-08-11 Mark George Delivery of reactive gas from gas pad to process tool
US5453124A (en) * 1992-12-30 1995-09-26 Texas Instruments Incorporated Programmable multizone gas injector for single-wafer semiconductor processing equipment
US5449294A (en) * 1993-03-26 1995-09-12 Texas Instruments Incorporated Multiple valve assembly and process
AU2139197A (en) * 1996-03-29 1997-10-22 Minnesota Mining And Manufacturing Company Apparatus and method for drying a coating on a substrate employing multiple drying subzones
US6099599A (en) * 1996-05-08 2000-08-08 Industrial Technology Research Institute Semiconductor device fabrication system
US5992463A (en) * 1996-10-30 1999-11-30 Unit Instruments, Inc. Gas panel
US6598279B1 (en) * 1998-08-21 2003-07-29 Micron Technology, Inc. Multiple connection socket assembly for semiconductor fabrication equipment and methods employing same
US6199255B1 (en) * 1999-10-06 2001-03-13 Taiwan Semiconductor Manufacturing Company, Ltd Apparatus for disassembling an injector head
US6442867B2 (en) * 2000-01-04 2002-09-03 Texas Instruments Incorporated Apparatus and method for cleaning a vertical furnace pedestal and cap
US6325886B1 (en) * 2000-02-14 2001-12-04 Redwood Microsystems, Inc. Method for attaching a micromechanical device to a manifold, and fluid control system produced thereby
WO2002019390A2 (en) * 2000-08-31 2002-03-07 Chemtrace, Inc. Cleaning of semiconductor process equipment chamber parts using organic solvents
US6349744B1 (en) * 2000-10-13 2002-02-26 Mks Instruments, Inc. Manifold for modular gas box system
US7044147B2 (en) * 2004-03-15 2006-05-16 Atmel Corporation System, apparatus and method for contaminant reduction in semiconductor device fabrication equipment components

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4383547A (en) * 1981-03-27 1983-05-17 Valin Corporation Purging apparatus

Also Published As

Publication number Publication date
US20050199284A1 (en) 2005-09-15
US20060169318A1 (en) 2006-08-03
WO2005091892A2 (en) 2005-10-06
EP1784595A2 (en) 2007-05-16
CN1954167A (en) 2007-04-25
US7044147B2 (en) 2006-05-16
US7540298B2 (en) 2009-06-02
TW200535958A (en) 2005-11-01

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