WO2005084341A3 - Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection - Google Patents
Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection Download PDFInfo
- Publication number
- WO2005084341A3 WO2005084341A3 PCT/US2005/006779 US2005006779W WO2005084341A3 WO 2005084341 A3 WO2005084341 A3 WO 2005084341A3 US 2005006779 W US2005006779 W US 2005006779W WO 2005084341 A3 WO2005084341 A3 WO 2005084341A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- patch panel
- power insertion
- terminal equipment
- compensating
- circuit separation
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0228—Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
- H05K2201/0723—Shielding provided by an inner layer of PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/09327—Special sequence of power, ground and signal layers in multilayer PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S439/00—Electrical connectors
- Y10S439/941—Crosstalk suppression
Abstract
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007501950A JP2007526584A (en) | 2004-03-03 | 2005-03-03 | Midspan patch panel with data terminal equipment, power supply, and circuit isolation for data collection |
MXPA06009913A MXPA06009913A (en) | 2004-03-03 | 2005-03-03 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection. |
EP05724347A EP1721368A4 (en) | 2004-03-03 | 2005-03-03 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection |
EC2006006870A ECSP066870A (en) | 2005-03-03 | 2006-09-21 | BRIDGE PART PANEL WITH COMPENSATION CIRCUIT FOR DATA TERMINATION, POWER INSERTION AND DATA COLLECTION EQUIPMENT |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/791,291 | 2004-03-03 | ||
US10/791,291 US20050195583A1 (en) | 2004-03-03 | 2004-03-03 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection |
US11/038,460 US7057899B2 (en) | 2004-03-03 | 2005-01-21 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection |
US11/038,460 | 2005-01-21 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005084341A2 WO2005084341A2 (en) | 2005-09-15 |
WO2005084341A3 true WO2005084341A3 (en) | 2005-12-08 |
Family
ID=34921947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2005/006779 WO2005084341A2 (en) | 2004-03-03 | 2005-03-03 | Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection |
Country Status (5)
Country | Link |
---|---|
US (1) | US7301780B2 (en) |
EP (1) | EP1721368A4 (en) |
JP (1) | JP2007526584A (en) |
KR (1) | KR20070004816A (en) |
WO (1) | WO2005084341A2 (en) |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
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US7038918B2 (en) * | 2004-03-03 | 2006-05-02 | Hubbell Incorporated | Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection |
US7978845B2 (en) * | 2005-09-28 | 2011-07-12 | Panduit Corp. | Powered patch panel |
US20080141056A1 (en) * | 2006-11-30 | 2008-06-12 | Abughazaleh Shadi A | Asset, PoE and power supply, stack management controller |
US20090002139A1 (en) * | 2007-06-29 | 2009-01-01 | Commscope, Inc. Of North Carolina | Apparatus for selectively providing power over ethernet in an upgradeable patch panel and related methods |
US8926509B2 (en) * | 2007-08-24 | 2015-01-06 | Hmicro, Inc. | Wireless physiological sensor patches and systems |
US8004863B2 (en) * | 2007-12-26 | 2011-08-23 | Silicon Laboratories Inc. | Circuit device and method of providing feedback across an isolation barrier |
US7654870B2 (en) * | 2008-02-11 | 2010-02-02 | Z-Plane, Inc. | Interconnection assembly for printed circuit boards |
US20100112837A1 (en) * | 2008-10-31 | 2010-05-06 | Tdh Solutions, L.L.C. | Feed through wire terminal block |
AU2010205834A1 (en) * | 2009-01-15 | 2011-08-04 | Hcs Kablolama Sistemleri San. Ve. Tic. A.S. | Improved cabling system and method for monitoring and managing physically connected devices over a data network |
CN101782882A (en) * | 2009-01-16 | 2010-07-21 | 鸿富锦精密工业(深圳)有限公司 | Adapter board |
US7896692B2 (en) * | 2009-05-15 | 2011-03-01 | Leviton Manufacturing Co., Inc. | Method of improving isolation between circuits on a printed circuit board |
US8235731B1 (en) * | 2011-03-18 | 2012-08-07 | Leviton Manufacturing Co., Ltd. | Connector module and patch panel |
WO2012143926A1 (en) | 2011-04-18 | 2012-10-26 | HCS KABLOLAMA SISTEMLERI SAN. ve TIC.A.S. | A method of analyzing patching among panels |
US8827746B2 (en) | 2011-08-01 | 2014-09-09 | Z-Plane, Inc. | Crosstalk reduction |
KR101197921B1 (en) * | 2011-10-18 | 2012-11-05 | 삼성전기주식회사 | Multi-layered ceramic electronic component |
JP5819007B2 (en) | 2011-11-23 | 2015-11-18 | パンドウィット・コーポレーション | Compensation network using orthogonal compensation network |
US9136647B2 (en) | 2012-06-01 | 2015-09-15 | Panduit Corp. | Communication connector with crosstalk compensation |
US9147977B2 (en) | 2012-07-05 | 2015-09-29 | Leviton Manufacturing Co., Inc. | High density high speed data communications connector |
US9871701B2 (en) | 2013-02-18 | 2018-01-16 | Hcs Kablolama Sistemleri Sanayi Ve Ticaret A.S. | Endpoint mapping in a communication system using serial signal sensing |
US9246463B2 (en) | 2013-03-07 | 2016-01-26 | Panduit Corp. | Compensation networks and communication connectors using said compensation networks |
US9257792B2 (en) | 2013-03-14 | 2016-02-09 | Panduit Corp. | Connectors and systems having improved crosstalk performance |
US9246274B2 (en) | 2013-03-15 | 2016-01-26 | Panduit Corp. | Communication connectors having crosstalk compensation networks |
CA2951677C (en) * | 2013-08-29 | 2017-06-13 | Rockport Networks Inc. | Method and apparatus to manage the direct interconnect switch wiring and growth in computer networks |
US20170215296A1 (en) * | 2014-07-30 | 2017-07-27 | Hewlett Packard Enterprise Development Lp | Multi-bay apparatus |
KR101634125B1 (en) | 2015-11-09 | 2016-07-08 | 주식회사 에이디지털미디어 | Patch Panel |
US11012765B2 (en) * | 2018-01-10 | 2021-05-18 | Extreme Networks, Inc. | Methods and systems for managing connector arrays |
KR102098725B1 (en) | 2019-08-19 | 2020-04-08 | 주식회사 에이디엠 | Patch panel for connecting communication equipments |
KR200492368Y1 (en) | 2020-08-12 | 2020-09-24 | (주)인포스텍 | red LED recognition Circuit for detecting a connection error of cable used in a LAN modular jack and an active patch panel and active patch panel having the same |
KR200493553Y1 (en) | 2020-09-18 | 2021-04-21 | (주)인포스텍 | red LED recognition Circuit for detecting a connection error of cable used in a LAN modular jack and an active patch panel and active patch panel having the same |
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US6411506B1 (en) * | 2000-07-20 | 2002-06-25 | Rlx Technologies, Inc. | High density web server chassis system and method |
US6483715B1 (en) * | 2001-11-21 | 2002-11-19 | Surtec Industries Inc. | Circuit board coupled with jacks |
US6533618B1 (en) * | 2000-03-31 | 2003-03-18 | Ortronics, Inc. | Bi-directional balance low noise communication interface |
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US7038918B2 (en) * | 2004-03-03 | 2006-05-02 | Hubbell Incorporated | Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection |
-
2005
- 2005-03-03 WO PCT/US2005/006779 patent/WO2005084341A2/en active Application Filing
- 2005-03-03 EP EP05724347A patent/EP1721368A4/en not_active Withdrawn
- 2005-03-03 KR KR1020067020697A patent/KR20070004816A/en not_active Application Discontinuation
- 2005-03-03 JP JP2007501950A patent/JP2007526584A/en active Pending
-
2006
- 2006-05-01 US US11/414,548 patent/US7301780B2/en not_active Expired - Lifetime
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5931703A (en) * | 1997-02-04 | 1999-08-03 | Hubbell Incorporated | Low crosstalk noise connector for telecommunication systems |
US5944535A (en) * | 1997-02-04 | 1999-08-31 | Hubbell Incorporated | Interface panel system for networks |
US6057743A (en) * | 1998-06-22 | 2000-05-02 | Hubbell Incorporation | Distributed noise reduction circuits in telecommunication system connector |
US6089923A (en) * | 1999-08-20 | 2000-07-18 | Adc Telecommunications, Inc. | Jack including crosstalk compensation for printed circuit board |
US6533618B1 (en) * | 2000-03-31 | 2003-03-18 | Ortronics, Inc. | Bi-directional balance low noise communication interface |
US6411506B1 (en) * | 2000-07-20 | 2002-06-25 | Rlx Technologies, Inc. | High density web server chassis system and method |
US6483715B1 (en) * | 2001-11-21 | 2002-11-19 | Surtec Industries Inc. | Circuit board coupled with jacks |
Also Published As
Publication number | Publication date |
---|---|
US7301780B2 (en) | 2007-11-27 |
JP2007526584A (en) | 2007-09-13 |
EP1721368A2 (en) | 2006-11-15 |
WO2005084341A2 (en) | 2005-09-15 |
EP1721368A4 (en) | 2008-03-12 |
US20060256540A1 (en) | 2006-11-16 |
KR20070004816A (en) | 2007-01-09 |
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