WO2005084341A3 - Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection - Google Patents

Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection Download PDF

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Publication number
WO2005084341A3
WO2005084341A3 PCT/US2005/006779 US2005006779W WO2005084341A3 WO 2005084341 A3 WO2005084341 A3 WO 2005084341A3 US 2005006779 W US2005006779 W US 2005006779W WO 2005084341 A3 WO2005084341 A3 WO 2005084341A3
Authority
WO
WIPO (PCT)
Prior art keywords
patch panel
power insertion
terminal equipment
compensating
circuit separation
Prior art date
Application number
PCT/US2005/006779
Other languages
French (fr)
Other versions
WO2005084341A2 (en
Inventor
Shadi Abughazaleh
Robert Baxter
Alan Miller
Michael O'connor
Original Assignee
Hubbell Inc
Shadi Abughazaleh
Robert Baxter
Mahmood Rehan
Alan Miller
Michael O'connor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/791,291 external-priority patent/US20050195583A1/en
Application filed by Hubbell Inc, Shadi Abughazaleh, Robert Baxter, Mahmood Rehan, Alan Miller, Michael O'connor filed Critical Hubbell Inc
Priority to JP2007501950A priority Critical patent/JP2007526584A/en
Priority to MXPA06009913A priority patent/MXPA06009913A/en
Priority to EP05724347A priority patent/EP1721368A4/en
Publication of WO2005084341A2 publication Critical patent/WO2005084341A2/en
Publication of WO2005084341A3 publication Critical patent/WO2005084341A3/en
Priority to EC2006006870A priority patent/ECSP066870A/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/02Arrangements of circuit components or wiring on supporting structure
    • H05K7/06Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231Capacitors or dielectric substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298Multilayer circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/16Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07Electric details
    • H05K2201/0707Shielding
    • H05K2201/0723Shielding provided by an inner layer of PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/0929Conductive planes
    • H05K2201/09327Special sequence of power, ground and signal layers in multilayer PCB
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621Components characterised by their electrical contacts
    • H05K2201/10689Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S439/00Electrical connectors
    • Y10S439/941Crosstalk suppression

Abstract

A compensating advanced feature patch panel (12) that can include removable modular (50) or fixed electronic components (46) located directly on the patch panel which are separately or in combination capable of providing advanced features such as device detection and power insertion. The patch panel provides communications between an insulation displacement connector (IDC) at a PD/User end (84), and any standard interface type using unshielded twisted pair cables, such as an RJ45 connector at a switch end (86) at performance levels of at least category 3, 5, 5e, 6 and/or higher (e.g. 6e or 7) and equivalent performance levels by compensating for the active electronics used in providing advanced features. Compensation is achieved in part through the separation and isolation of active and communication circuit elements.
PCT/US2005/006779 2004-03-03 2005-03-03 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection WO2005084341A2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007501950A JP2007526584A (en) 2004-03-03 2005-03-03 Midspan patch panel with data terminal equipment, power supply, and circuit isolation for data collection
MXPA06009913A MXPA06009913A (en) 2004-03-03 2005-03-03 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection.
EP05724347A EP1721368A4 (en) 2004-03-03 2005-03-03 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
EC2006006870A ECSP066870A (en) 2005-03-03 2006-09-21 BRIDGE PART PANEL WITH COMPENSATION CIRCUIT FOR DATA TERMINATION, POWER INSERTION AND DATA COLLECTION EQUIPMENT

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US10/791,291 2004-03-03
US10/791,291 US20050195583A1 (en) 2004-03-03 2004-03-03 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
US11/038,460 US7057899B2 (en) 2004-03-03 2005-01-21 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection
US11/038,460 2005-01-21

Publications (2)

Publication Number Publication Date
WO2005084341A2 WO2005084341A2 (en) 2005-09-15
WO2005084341A3 true WO2005084341A3 (en) 2005-12-08

Family

ID=34921947

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2005/006779 WO2005084341A2 (en) 2004-03-03 2005-03-03 Midspan patch panel with circuit separation for data terminal equipment, power insertion and data collection

Country Status (5)

Country Link
US (1) US7301780B2 (en)
EP (1) EP1721368A4 (en)
JP (1) JP2007526584A (en)
KR (1) KR20070004816A (en)
WO (1) WO2005084341A2 (en)

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US7038918B2 (en) * 2004-03-03 2006-05-02 Hubbell Incorporated Midspan patch panel with compensation circuit for data terminal equipment, power insertion and data collection
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CN101782882A (en) * 2009-01-16 2010-07-21 鸿富锦精密工业(深圳)有限公司 Adapter board
US7896692B2 (en) * 2009-05-15 2011-03-01 Leviton Manufacturing Co., Inc. Method of improving isolation between circuits on a printed circuit board
US8235731B1 (en) * 2011-03-18 2012-08-07 Leviton Manufacturing Co., Ltd. Connector module and patch panel
WO2012143926A1 (en) 2011-04-18 2012-10-26 HCS KABLOLAMA SISTEMLERI SAN. ve TIC.A.S. A method of analyzing patching among panels
US8827746B2 (en) 2011-08-01 2014-09-09 Z-Plane, Inc. Crosstalk reduction
KR101197921B1 (en) * 2011-10-18 2012-11-05 삼성전기주식회사 Multi-layered ceramic electronic component
JP5819007B2 (en) 2011-11-23 2015-11-18 パンドウィット・コーポレーション Compensation network using orthogonal compensation network
US9136647B2 (en) 2012-06-01 2015-09-15 Panduit Corp. Communication connector with crosstalk compensation
US9147977B2 (en) 2012-07-05 2015-09-29 Leviton Manufacturing Co., Inc. High density high speed data communications connector
US9871701B2 (en) 2013-02-18 2018-01-16 Hcs Kablolama Sistemleri Sanayi Ve Ticaret A.S. Endpoint mapping in a communication system using serial signal sensing
US9246463B2 (en) 2013-03-07 2016-01-26 Panduit Corp. Compensation networks and communication connectors using said compensation networks
US9257792B2 (en) 2013-03-14 2016-02-09 Panduit Corp. Connectors and systems having improved crosstalk performance
US9246274B2 (en) 2013-03-15 2016-01-26 Panduit Corp. Communication connectors having crosstalk compensation networks
CA2951677C (en) * 2013-08-29 2017-06-13 Rockport Networks Inc. Method and apparatus to manage the direct interconnect switch wiring and growth in computer networks
US20170215296A1 (en) * 2014-07-30 2017-07-27 Hewlett Packard Enterprise Development Lp Multi-bay apparatus
KR101634125B1 (en) 2015-11-09 2016-07-08 주식회사 에이디지털미디어 Patch Panel
US11012765B2 (en) * 2018-01-10 2021-05-18 Extreme Networks, Inc. Methods and systems for managing connector arrays
KR102098725B1 (en) 2019-08-19 2020-04-08 주식회사 에이디엠 Patch panel for connecting communication equipments
KR200492368Y1 (en) 2020-08-12 2020-09-24 (주)인포스텍 red LED recognition Circuit for detecting a connection error of cable used in a LAN modular jack and an active patch panel and active patch panel having the same
KR200493553Y1 (en) 2020-09-18 2021-04-21 (주)인포스텍 red LED recognition Circuit for detecting a connection error of cable used in a LAN modular jack and an active patch panel and active patch panel having the same

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Also Published As

Publication number Publication date
US7301780B2 (en) 2007-11-27
JP2007526584A (en) 2007-09-13
EP1721368A2 (en) 2006-11-15
WO2005084341A2 (en) 2005-09-15
EP1721368A4 (en) 2008-03-12
US20060256540A1 (en) 2006-11-16
KR20070004816A (en) 2007-01-09

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