WO2004012485A3 - Mounting surfaces for electronic devices - Google Patents

Mounting surfaces for electronic devices Download PDF

Info

Publication number
WO2004012485A3
WO2004012485A3 PCT/US2003/022548 US0322548W WO2004012485A3 WO 2004012485 A3 WO2004012485 A3 WO 2004012485A3 US 0322548 W US0322548 W US 0322548W WO 2004012485 A3 WO2004012485 A3 WO 2004012485A3
Authority
WO
WIPO (PCT)
Prior art keywords
mounting surface
electronic devices
mounting surfaces
mount
making
Prior art date
Application number
PCT/US2003/022548
Other languages
French (fr)
Other versions
WO2004012485A2 (en
Inventor
Jr Frank J Mosna
Alexander J Elliot
William M Strom
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Priority to AU2003256617A priority Critical patent/AU2003256617A1/en
Publication of WO2004012485A2 publication Critical patent/WO2004012485A2/en
Publication of WO2004012485A3 publication Critical patent/WO2004012485A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49544—Deformation absorbing parts in the lead frame plane, e.g. meanderline shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49575—Assemblies of semiconductor devices on lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device

Landscapes

  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Casings For Electric Apparatus (AREA)
  • Auxiliary Devices For And Details Of Packaging Control (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A mount, packaged device, and method of making the same are provided. In one embodiment, a method for making a mount for at least two electronic devices comprises forming a first mounting surface (210) from a material (240), and forming a second mounting surface (220) from the material (240). The first mounting surface (210) is connected to, but spaced from, the second mounting surface (220) by a mounting surface distance (250). The method further comprises reducing the mounting surface distance (250).
PCT/US2003/022548 2002-07-31 2003-07-17 Mounting surfaces for electronic devices WO2004012485A2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU2003256617A AU2003256617A1 (en) 2002-07-31 2003-07-17 Mounting surfaces for electronic devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/208,867 2002-07-31
US10/208,867 US6996897B2 (en) 2002-07-31 2002-07-31 Method of making a mount for electronic devices

Publications (2)

Publication Number Publication Date
WO2004012485A2 WO2004012485A2 (en) 2004-02-05
WO2004012485A3 true WO2004012485A3 (en) 2004-04-08

Family

ID=31186894

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2003/022548 WO2004012485A2 (en) 2002-07-31 2003-07-17 Mounting surfaces for electronic devices

Country Status (5)

Country Link
US (1) US6996897B2 (en)
AU (1) AU2003256617A1 (en)
MY (1) MY146202A (en)
TW (1) TWI326473B (en)
WO (1) WO2004012485A2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6996897B2 (en) * 2002-07-31 2006-02-14 Freescale Semiconductor, Inc. Method of making a mount for electronic devices
US7012324B2 (en) 2003-09-12 2006-03-14 Freescale Semiconductor, Inc. Lead frame with flag support structure
US20070134409A1 (en) * 2004-03-10 2007-06-14 Frankiewicz Gregory P Light-Pipe Arrangement with Reduced Fresnel-Reflection Losses
US7445967B2 (en) * 2006-01-20 2008-11-04 Freescale Semiconductor, Inc. Method of packaging a semiconductor die and package thereof
CN109983591B (en) * 2016-11-11 2022-10-04 亮锐控股有限公司 Method for manufacturing lead frame

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559401A (en) * 1978-07-05 1980-01-23 Hitachi Ltd Leed frame
EP0409196A2 (en) * 1989-07-18 1991-01-23 Kabushiki Kaisha Toshiba Plastic molded type semiconductor device
EP0452634A1 (en) * 1990-03-16 1991-10-23 Sumitomo Electric Industries, Ltd. Lead frame for semiconductor device
JPH0964266A (en) * 1995-08-18 1997-03-07 Sony Corp Lead frame
US5773878A (en) * 1995-10-28 1998-06-30 Institute Of Microelectronics National University Of Singapore IC packaging lead frame for reducing chip stress and deformation
JPH10321791A (en) * 1997-03-17 1998-12-04 Tokai Rika Co Ltd Operational amplifier
EP0887850A2 (en) * 1997-06-23 1998-12-30 STMicroelectronics, Inc. Lead-frame forming for improved thermal performance

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61257443A (en) * 1985-05-08 1986-11-14 Mitsubishi Shindo Kk Cu alloy as lead material for semiconductor device
US4829362A (en) 1986-04-28 1989-05-09 Motorola, Inc. Lead frame with die bond flag for ceramic packages
US5068764A (en) 1990-03-05 1991-11-26 Thermalloy Incorporated Electronic device package mounting assembly
US5049973A (en) 1990-06-26 1991-09-17 Harris Semiconductor Patents, Inc. Heat sink and multi mount pad lead frame package and method for electrically isolating semiconductor die(s)
JP3088193B2 (en) * 1992-06-05 2000-09-18 三菱電機株式会社 Method for manufacturing semiconductor device having LOC structure and lead frame used therein
US5233222A (en) 1992-07-27 1993-08-03 Motorola, Inc. Semiconductor device having window-frame flag with tapered edge in opening
US5767443A (en) 1993-07-10 1998-06-16 Micron Technology, Inc. Multi-die encapsulation device
DE4404986B4 (en) * 1994-02-17 2008-08-21 Robert Bosch Gmbh Device for contacting electrical conductors and method for producing such a device
US5566749A (en) 1994-04-12 1996-10-22 Thermalloy, Inc. Stamped and formed heat sink
US5594234A (en) 1994-11-14 1997-01-14 Texas Instruments Incorporated Downset exposed die mount pad leadframe and package
JP2767404B2 (en) * 1994-12-14 1998-06-18 アナムインダストリアル株式会社 Lead frame structure of semiconductor package
US5739586A (en) 1996-08-30 1998-04-14 Scientific-Atlanta, Inc. Heat sink assembly including a printed wiring board and a metal case
US5856911A (en) 1996-11-12 1999-01-05 National Semiconductor Corporation Attachment assembly for integrated circuits
US6049125A (en) 1997-12-29 2000-04-11 Micron Technology, Inc. Semiconductor package with heat sink and method of fabrication
JP4090103B2 (en) * 1998-03-02 2008-05-28 太陽インキ製造株式会社 Photosensitive composition and fired product pattern obtained using the same
US5969949A (en) 1998-03-31 1999-10-19 Sun Microsystems, Inc. Interfitting heat sink and heat spreader slug
US5969950A (en) 1998-11-04 1999-10-19 Sun Microsystems, Inc. Enhanced heat sink attachment
US6163068A (en) 1999-04-22 2000-12-19 Yao; Hsia Kuang Multi-chip semiconductor encapsulation method and its finished product
US6395983B1 (en) * 1999-05-18 2002-05-28 Pulse Engineering, Inc. Electronic packaging device and method
US6996897B2 (en) * 2002-07-31 2006-02-14 Freescale Semiconductor, Inc. Method of making a mount for electronic devices

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS559401A (en) * 1978-07-05 1980-01-23 Hitachi Ltd Leed frame
EP0409196A2 (en) * 1989-07-18 1991-01-23 Kabushiki Kaisha Toshiba Plastic molded type semiconductor device
EP0452634A1 (en) * 1990-03-16 1991-10-23 Sumitomo Electric Industries, Ltd. Lead frame for semiconductor device
JPH0964266A (en) * 1995-08-18 1997-03-07 Sony Corp Lead frame
US5773878A (en) * 1995-10-28 1998-06-30 Institute Of Microelectronics National University Of Singapore IC packaging lead frame for reducing chip stress and deformation
JPH10321791A (en) * 1997-03-17 1998-12-04 Tokai Rika Co Ltd Operational amplifier
EP0887850A2 (en) * 1997-06-23 1998-12-30 STMicroelectronics, Inc. Lead-frame forming for improved thermal performance

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 0040, no. 36 (E - 003) 26 March 1980 (1980-03-26) *
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 07 31 July 1997 (1997-07-31) *
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 03 31 March 1999 (1999-03-31) *

Also Published As

Publication number Publication date
US20040022016A1 (en) 2004-02-05
TWI326473B (en) 2010-06-21
TW200405485A (en) 2004-04-01
WO2004012485A2 (en) 2004-02-05
US6996897B2 (en) 2006-02-14
MY146202A (en) 2012-07-31
AU2003256617A8 (en) 2004-02-16
AU2003256617A1 (en) 2004-02-16

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