WO2003065443A3 - Probe station - Google Patents

Probe station Download PDF

Info

Publication number
WO2003065443A3
WO2003065443A3 PCT/US2002/038960 US0238960W WO03065443A3 WO 2003065443 A3 WO2003065443 A3 WO 2003065443A3 US 0238960 W US0238960 W US 0238960W WO 03065443 A3 WO03065443 A3 WO 03065443A3
Authority
WO
WIPO (PCT)
Prior art keywords
chuck
probe station
outer shield
shield box
probe
Prior art date
Application number
PCT/US2002/038960
Other languages
French (fr)
Other versions
WO2003065443A2 (en
Inventor
Peter Navratil
Brad Froemke
Craig Stewart
Anthony Lord
Jeff Spencer
Scott Rumbaugh
Gavin Fisher
Cann Pete Mc
Rod Jones
Original Assignee
Cascade Microtech Inc
Peter Navratil
Brad Froemke
Craig Stewart
Anthony Lord
Jeff Spencer
Scott Rumbaugh
Gavin Fisher
Cann Pete Mc
Rod Jones
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cascade Microtech Inc, Peter Navratil, Brad Froemke, Craig Stewart, Anthony Lord, Jeff Spencer, Scott Rumbaugh, Gavin Fisher, Cann Pete Mc, Rod Jones filed Critical Cascade Microtech Inc
Priority to JP2003564929A priority Critical patent/JP2005526380A/en
Priority to DE10297648T priority patent/DE10297648T5/en
Publication of WO2003065443A2 publication Critical patent/WO2003065443A2/en
Publication of WO2003065443A3 publication Critical patent/WO2003065443A3/en

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2886Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/18Screening arrangements against electric or magnetic fields, e.g. against earth's field
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/311Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits

Abstract

The probe station (10) includes the chuck (12) that supports the electrical device (14) to be probed by the probe apparatus (16) that extends through an opening in the platen (18), an outer shield box (24) provides sufficient space for the chuck (12) to be moved laterally by positioner (22), because the chuck (12) may freely move within the outer shield box (24), a suspended member (26) electrically interconnected to a guard potential may readily position above the chuck (12).
PCT/US2002/038960 2002-01-25 2002-12-04 Probe station WO2003065443A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2003564929A JP2005526380A (en) 2002-01-25 2002-12-04 Probe station
DE10297648T DE10297648T5 (en) 2002-01-25 2002-12-04 inspection

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US35184402P 2002-01-25 2002-01-25
US60/351,844 2002-01-25
US10/285,135 US6777964B2 (en) 2002-01-25 2002-10-30 Probe station
US10/285,135 2002-10-30

Publications (2)

Publication Number Publication Date
WO2003065443A2 WO2003065443A2 (en) 2003-08-07
WO2003065443A3 true WO2003065443A3 (en) 2003-09-04

Family

ID=27616495

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/038960 WO2003065443A2 (en) 2002-01-25 2002-12-04 Probe station

Country Status (4)

Country Link
US (3) US6777964B2 (en)
JP (1) JP2005526380A (en)
DE (1) DE10297648T5 (en)
WO (1) WO2003065443A2 (en)

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US6965226B2 (en) 2000-09-05 2005-11-15 Cascade Microtech, Inc. Chuck for holding a device under test
US6914423B2 (en) 2000-09-05 2005-07-05 Cascade Microtech, Inc. Probe station
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US6777964B2 (en) * 2002-01-25 2004-08-17 Cascade Microtech, Inc. Probe station
US7250779B2 (en) * 2002-11-25 2007-07-31 Cascade Microtech, Inc. Probe station with low inductance path
US7378861B1 (en) * 2003-04-07 2008-05-27 Luxtera, Inc. Optical alignment loops for the wafer-level testing of optical and optoelectronic chips
US7184626B1 (en) * 2003-04-07 2007-02-27 Luxtera, Inc Wafer-level testing of optical and optoelectronic chips
US7492172B2 (en) 2003-05-23 2009-02-17 Cascade Microtech, Inc. Chuck for holding a device under test
US7224173B2 (en) * 2003-10-01 2007-05-29 Taiwan Semiconductor Manufacturing Co., Ltd. Electrical bias electrical test apparatus and method
US7250626B2 (en) 2003-10-22 2007-07-31 Cascade Microtech, Inc. Probe testing structure
US7187188B2 (en) * 2003-12-24 2007-03-06 Cascade Microtech, Inc. Chuck with integrated wafer support
US7348786B2 (en) * 2004-08-31 2008-03-25 Georgia Tech Research Corporation Probe module for testing chips with electrical and optical input/output interconnects, methods of use, and methods of fabrication
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US7535247B2 (en) 2005-01-31 2009-05-19 Cascade Microtech, Inc. Interface for testing semiconductors
US7656172B2 (en) 2005-01-31 2010-02-02 Cascade Microtech, Inc. System for testing semiconductors
US7764079B1 (en) * 2007-01-31 2010-07-27 SemiProbe LLC Modular probe system
DE102008048081B4 (en) * 2008-09-19 2015-06-18 Cascade Microtech, Inc. Method for testing electronic components of a repeating structure under defined thermal conditions
US8319503B2 (en) 2008-11-24 2012-11-27 Cascade Microtech, Inc. Test apparatus for measuring a characteristic of a device under test
KR20120106705A (en) 2009-06-22 2012-09-26 캐스캐이드 마이크로텍 드레스덴 게엠베하 Method for measuring a power component
US8823406B2 (en) 2010-10-20 2014-09-02 Cascade Micotech, Inc. Systems and methods for simultaneous optical testing of a plurality of devices under test
US8970240B2 (en) 2010-11-04 2015-03-03 Cascade Microtech, Inc. Resilient electrical interposers, systems that include the interposers, and methods for using and forming the same
US9244099B2 (en) 2011-05-09 2016-01-26 Cascade Microtech, Inc. Probe head assemblies, components thereof, test systems including the same, and methods of operating the same
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CN102222632B (en) * 2011-07-07 2013-04-24 北京思比科微电子技术股份有限公司 Wafer testing method and device
KR101671690B1 (en) * 2011-10-19 2016-11-03 어플라이드 머티어리얼스, 인코포레이티드 Roll to roll tester and method of testing flexible substrates roll to roll
US20130125793A1 (en) * 2011-11-22 2013-05-23 Alex K. Deyhim Two degrees of freedom optical table
US10281487B2 (en) 2013-09-17 2019-05-07 The Micromanipulator Company, Llc Probe system designed for probing of electronic parts mounted into application or test boards
TWI516786B (en) * 2013-12-13 2016-01-11 Mpi Corp Detection and debugging of the system
JP6855185B2 (en) * 2016-07-27 2021-04-07 株式会社日本マイクロニクス Electrical connection device
US11906579B2 (en) 2019-10-25 2024-02-20 Jenoptik Gmbh Wafer-level test method for optoelectronic chips

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US20080042675A1 (en) 2008-02-21
US6777964B2 (en) 2004-08-17
US20050156610A1 (en) 2005-07-21
WO2003065443A2 (en) 2003-08-07
US7368925B2 (en) 2008-05-06
US20030141861A1 (en) 2003-07-31
JP2005526380A (en) 2005-09-02
DE10297648T5 (en) 2005-01-27

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