WO2003022023A1 - Method and apparatus for mounting a component - Google Patents
Method and apparatus for mounting a component Download PDFInfo
- Publication number
- WO2003022023A1 WO2003022023A1 PCT/US2002/028069 US0228069W WO03022023A1 WO 2003022023 A1 WO2003022023 A1 WO 2003022023A1 US 0228069 W US0228069 W US 0228069W WO 03022023 A1 WO03022023 A1 WO 03022023A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- spindle
- pick
- component
- place
- place head
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53183—Multilead component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53191—Means to apply vacuum directly to position or hold work part
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/532—Conductor
- Y10T29/53243—Multiple, independent conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP02797847.7A EP1468591B1 (en) | 2001-09-05 | 2002-09-05 | Apparatus for mounting a component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/947,099 US6625878B2 (en) | 2001-09-05 | 2001-09-05 | Method and apparatus for improving component placement in a component pick up and place machine |
US09/947,099 | 2001-09-05 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2003022023A1 true WO2003022023A1 (en) | 2003-03-13 |
Family
ID=25485514
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/028069 WO2003022023A1 (en) | 2001-09-05 | 2002-09-05 | Method and apparatus for mounting a component |
Country Status (4)
Country | Link |
---|---|
US (2) | US6625878B2 (en) |
EP (1) | EP1468591B1 (en) |
CN (1) | CN100544552C (en) |
WO (1) | WO2003022023A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM265687U (en) * | 2004-10-15 | 2005-05-21 | Inventec Corp | Foolproof device for heat sink module of notebook computer |
KR20120096727A (en) * | 2011-02-23 | 2012-08-31 | 삼성테크윈 주식회사 | Apparatus and method for picking up and mounting bare die |
EP2658958B1 (en) * | 2011-03-18 | 2017-05-03 | Siemens Healthcare Diagnostics Inc. | Methods and systems for calibration of a positional orientation between a sample container and nozzle tip |
JP2013251475A (en) * | 2012-06-04 | 2013-12-12 | Panasonic Corp | Calibration value obtaining method in electronic component mounting line and electronic component mounting method on electronic component mounting line |
US10893638B2 (en) | 2016-05-27 | 2021-01-12 | Universal Instruments Corporation | Dispensing head having a nozzle heater device, system and method |
CN112171263A (en) | 2018-02-26 | 2021-01-05 | 环球仪器公司 | Spindle module, library and method |
US11375651B2 (en) | 2018-02-26 | 2022-06-28 | Universal Instruments Corporation | Dispensing head, nozzle and method |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631816A (en) * | 1984-02-17 | 1986-12-30 | Matsushita Electric Industrial Co., Ltd. | Automatic apparatus for mounting electronic parts |
US4706379A (en) * | 1984-08-31 | 1987-11-17 | Matsushita Electric Industrial Co., Ltd. | Parts mounting apparatus |
US4794689A (en) * | 1985-11-14 | 1989-01-03 | Matsushita Electric Industrial Co., Ltd. | Method of and apparatus for mounting electric components |
US4805110A (en) * | 1985-12-19 | 1989-02-14 | Tdk Corporation | Circuit element mounting system and method |
US4984354A (en) * | 1989-04-28 | 1991-01-15 | Sanyo Electric Co., Ltd. | Electronic parts mounting apparatus |
US5070598A (en) * | 1989-05-18 | 1991-12-10 | Hitachi, Ltd. | Device for mounting electronic parts |
US5084962A (en) * | 1988-08-24 | 1992-02-04 | Tdk Corporation | Apparatus for and method of automatically mounting electronic component on printed circuit board |
US5153983A (en) * | 1990-02-15 | 1992-10-13 | Matsushita Electric Industrial Co., Ltd. | Rotary head type electrical component placing apparatus |
US5544411A (en) * | 1993-05-26 | 1996-08-13 | Sanyo Electric Co., Ltd. | Automatic electronic parts-mounting apparatus |
US5960534A (en) * | 1994-07-06 | 1999-10-05 | Sankyo Seiki Mfg. Co., Ltd. | Electronic-part surface mounting apparatus |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07107960B2 (en) * | 1987-09-14 | 1995-11-15 | 株式会社日立製作所 | Chip electronic component mounting device |
ATE75900T1 (en) * | 1987-11-10 | 1992-05-15 | Siemens Ag | DEVICE AND METHOD FOR INSTALLING COMPONENTS ON CIRCUIT BOARDS. |
USRE35027E (en) | 1988-09-22 | 1995-08-29 | Delaware Capital Formation, Inc. | Pick and place method and apparatus |
US5433013A (en) * | 1993-09-24 | 1995-07-18 | Micron Custom Manufacturing Services, Inc. | Fixture for alignment of vacuum nozzles on semiconductor manufacturing equipment |
JP3469652B2 (en) * | 1994-09-26 | 2003-11-25 | 富士機械製造株式会社 | Electronic component mounting device |
JPH09191195A (en) * | 1996-01-10 | 1997-07-22 | Matsushita Electric Ind Co Ltd | Electronic component mounting device |
US6018865A (en) * | 1998-01-20 | 2000-02-01 | Mcms, Inc. | Method for calibrating the Z origin position |
US6535291B1 (en) * | 2000-06-07 | 2003-03-18 | Cyberoptics Corporation | Calibration methods for placement machines incorporating on-head linescan sensing |
US6739036B2 (en) | 2000-09-13 | 2004-05-25 | Fuji Machine Mfg., Co., Ltd. | Electric-component mounting system |
-
2001
- 2001-09-05 US US09/947,099 patent/US6625878B2/en not_active Expired - Lifetime
-
2002
- 2002-09-05 EP EP02797847.7A patent/EP1468591B1/en not_active Expired - Lifetime
- 2002-09-05 WO PCT/US2002/028069 patent/WO2003022023A1/en not_active Application Discontinuation
- 2002-09-05 CN CNB028220617A patent/CN100544552C/en not_active Expired - Lifetime
-
2003
- 2003-07-28 US US10/627,927 patent/US7040137B1/en not_active Expired - Lifetime
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4631816A (en) * | 1984-02-17 | 1986-12-30 | Matsushita Electric Industrial Co., Ltd. | Automatic apparatus for mounting electronic parts |
US4706379A (en) * | 1984-08-31 | 1987-11-17 | Matsushita Electric Industrial Co., Ltd. | Parts mounting apparatus |
US4794689A (en) * | 1985-11-14 | 1989-01-03 | Matsushita Electric Industrial Co., Ltd. | Method of and apparatus for mounting electric components |
US4805110A (en) * | 1985-12-19 | 1989-02-14 | Tdk Corporation | Circuit element mounting system and method |
US5084962A (en) * | 1988-08-24 | 1992-02-04 | Tdk Corporation | Apparatus for and method of automatically mounting electronic component on printed circuit board |
US4984354A (en) * | 1989-04-28 | 1991-01-15 | Sanyo Electric Co., Ltd. | Electronic parts mounting apparatus |
US5070598A (en) * | 1989-05-18 | 1991-12-10 | Hitachi, Ltd. | Device for mounting electronic parts |
US5153983A (en) * | 1990-02-15 | 1992-10-13 | Matsushita Electric Industrial Co., Ltd. | Rotary head type electrical component placing apparatus |
US5544411A (en) * | 1993-05-26 | 1996-08-13 | Sanyo Electric Co., Ltd. | Automatic electronic parts-mounting apparatus |
US5960534A (en) * | 1994-07-06 | 1999-10-05 | Sankyo Seiki Mfg. Co., Ltd. | Electronic-part surface mounting apparatus |
Non-Patent Citations (1)
Title |
---|
See also references of EP1468591A4 * |
Also Published As
Publication number | Publication date |
---|---|
US20030041450A1 (en) | 2003-03-06 |
EP1468591B1 (en) | 2015-03-18 |
EP1468591A1 (en) | 2004-10-20 |
CN100544552C (en) | 2009-09-23 |
US6625878B2 (en) | 2003-09-30 |
CN1582606A (en) | 2005-02-16 |
US7040137B1 (en) | 2006-05-09 |
EP1468591A4 (en) | 2008-06-11 |
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