WO2003010798A3 - Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates - Google Patents
Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates Download PDFInfo
- Publication number
- WO2003010798A3 WO2003010798A3 PCT/US2002/023067 US0223067W WO03010798A3 WO 2003010798 A3 WO2003010798 A3 WO 2003010798A3 US 0223067 W US0223067 W US 0223067W WO 03010798 A3 WO03010798 A3 WO 03010798A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- light emitting
- bonding
- shaped substrates
- emitting diodes
- submount
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/40—Materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12032—Schottky diode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2004-7001064A KR20040029382A (en) | 2001-07-23 | 2002-07-22 | Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates |
CA002454735A CA2454735A1 (en) | 2001-07-23 | 2002-07-22 | Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates |
AT02763308T ATE548752T1 (en) | 2001-07-23 | 2002-07-22 | CONNECTING LIGHT EMITTING DIODES TO SPECIALLY SHAPED SUBSTRATES AND COLLET FOR CONNECTING LIGHT EMITTING DIODES TO SPECIALLY SHAPED SUBSTRATES |
JP2003516088A JP4594618B2 (en) | 2001-07-23 | 2002-07-22 | BOARDING OF LIGHT EMITTING DIODE WITH FORMED SUBSTRATE AND COLLET FOR BODYING LIGHT EMITTING DIODE WITH FORMED SUBSTRATE |
EP02763308A EP1410426B1 (en) | 2001-07-23 | 2002-07-22 | Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US30723401P | 2001-07-23 | 2001-07-23 | |
US60/307,234 | 2001-07-23 | ||
US10/185,350 | 2002-06-27 | ||
US10/185,350 US6747298B2 (en) | 2001-07-23 | 2002-06-27 | Collets for bonding of light emitting diodes having shaped substrates |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2003010798A2 WO2003010798A2 (en) | 2003-02-06 |
WO2003010798A3 true WO2003010798A3 (en) | 2003-10-16 |
Family
ID=26881076
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2002/023067 WO2003010798A2 (en) | 2001-07-23 | 2002-07-22 | Bonding of light emitting diodes having shaped substrates and collets for bonding of light emitting diodes having shaped substrates |
Country Status (10)
Country | Link |
---|---|
US (2) | US6747298B2 (en) |
EP (1) | EP1410426B1 (en) |
JP (1) | JP4594618B2 (en) |
KR (1) | KR20040029382A (en) |
CN (1) | CN1305108C (en) |
AT (1) | ATE548752T1 (en) |
CA (1) | CA2454735A1 (en) |
MY (1) | MY138237A (en) |
TW (1) | TW557588B (en) |
WO (1) | WO2003010798A2 (en) |
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-
2002
- 2002-06-27 US US10/185,350 patent/US6747298B2/en not_active Expired - Lifetime
- 2002-07-22 WO PCT/US2002/023067 patent/WO2003010798A2/en active Application Filing
- 2002-07-22 EP EP02763308A patent/EP1410426B1/en not_active Expired - Lifetime
- 2002-07-22 KR KR10-2004-7001064A patent/KR20040029382A/en not_active Application Discontinuation
- 2002-07-22 CN CNB028186443A patent/CN1305108C/en not_active Expired - Lifetime
- 2002-07-22 AT AT02763308T patent/ATE548752T1/en active
- 2002-07-22 JP JP2003516088A patent/JP4594618B2/en not_active Expired - Lifetime
- 2002-07-22 TW TW091116248A patent/TW557588B/en not_active IP Right Cessation
- 2002-07-22 CA CA002454735A patent/CA2454735A1/en not_active Abandoned
- 2002-07-23 MY MYPI20022771A patent/MY138237A/en unknown
-
2004
- 2004-04-27 US US10/832,971 patent/US7341175B2/en not_active Expired - Lifetime
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JPH02206136A (en) * | 1989-02-06 | 1990-08-15 | Matsushita Electric Ind Co Ltd | Apparatus and method for die bonding |
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JPH0529364A (en) * | 1991-07-17 | 1993-02-05 | Sharp Corp | Method and apparatus for bonding semiconductor element |
EP0843365A2 (en) * | 1992-08-20 | 1998-05-20 | Hewlett-Packard Company | Light source and technique for mounting light emitting diodes |
EP0589524A2 (en) * | 1992-09-25 | 1994-03-30 | Koninklijke Philips Electronics N.V. | Method of manufacturing an optoelectronic semiconductor device and optoelectronic semiconductor element suitable for use in such a method |
Non-Patent Citations (5)
Title |
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DATABASE INSPEC [online] INSTITUTE OF ELECTRICAL ENGINEERS, STEVENAGE, GB; 4 June 1993 (1993-06-04), SA-YOON KANG ET AL: "Thermosonic bonding: an alternative to area-array solder connections", XP002241923, Database accession no. 4823489 * |
DATABASE WPI Section EI Week 199502, Derwent World Patents Index; Class V04, AN 1995-013018, XP002241924 * |
PATENT ABSTRACTS OF JAPAN vol. 014, no. 496 (E - 0996) 29 October 1990 (1990-10-29) * |
PATENT ABSTRACTS OF JAPAN vol. 016, no. 435 (E - 1263) 10 September 1992 (1992-09-10) * |
PATENT ABSTRACTS OF JAPAN vol. 017, no. 310 (E - 1380) 14 June 1993 (1993-06-14) * |
Also Published As
Publication number | Publication date |
---|---|
US20030042507A1 (en) | 2003-03-06 |
US6747298B2 (en) | 2004-06-08 |
ATE548752T1 (en) | 2012-03-15 |
EP1410426A2 (en) | 2004-04-21 |
MY138237A (en) | 2009-05-29 |
CA2454735A1 (en) | 2003-02-06 |
CN1305108C (en) | 2007-03-14 |
EP1410426B1 (en) | 2012-03-07 |
CN1557014A (en) | 2004-12-22 |
JP2005510042A (en) | 2005-04-14 |
KR20040029382A (en) | 2004-04-06 |
US7341175B2 (en) | 2008-03-11 |
TW557588B (en) | 2003-10-11 |
WO2003010798A2 (en) | 2003-02-06 |
US20040200882A1 (en) | 2004-10-14 |
JP4594618B2 (en) | 2010-12-08 |
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