WO2003009660A1

WO2003009660A1 - Method and material for manufacturing circuit-formed substrate

Info

Publication number: WO2003009660A1
Application number: PCT/JP2002/007262
Authority: WO
Inventors: Toshihiro Nishii
Original assignee: Matsushita Electric Industrial Co., Ltd.
Priority date: 2001-07-18
Filing date: 2002-07-17
Publication date: 2003-01-30
Also published as: JPWO2003009660A1; CN1465218A; EP1408726B1; US20040067348A1; CN1794902A; EP1408726A1; DE60235301D1; EP1408726A4; CN100473261C; US7059044B2; CN1794902B; TW558931B

Abstract

A method of manufacturing a circuit-formed substrate capable of increasing the reliability of an interlayer connection on the circuit-formed substrate and a material for manufacturing a circuit-formed substrate, the method comprising the steps of A) limiting resin flow in a hot press process, B) fusing or sticking reinforcement fibers to each other, C) reducing the thickness of substrate material after a filling process, and D) forming a low fluidized-layer with fillers mixed in the substrate material, the material comprising volatile components capable of providing physical properties to control the resin fluidity in the hot press process or efficiently reducing the thickness of the substrate material after the filling process.

Description

Specification

Method for manufacturing circuit-formed substrate and material for manufacturing circuit-formed substrate

The present invention relates to a method for manufacturing a circuit forming substrate used for various electronic devices and a material for manufacturing the circuit forming substrate. Background art

In recent years, with the miniaturization and high density of electronic devices, the use of single-sided and double-sided, multi-layer boards has also been increasing for circuit formation boards on which electronic components are mounted, and more circuits and components are integrated on the board. Possible high-density substrates have been developed (for example, “Surface Mount Technology” published by Nikkan Kogyo Shimbun, January 1997, Kiyoshi Takagi; “Development of remarkable build-up multilayer PWB”).

The prior art will be described with reference to FIGS. 6A to 6G.

The substrate material 61 shown in FIG. 6A is a pre-predator in which a glass fiber woven fabric used for a circuit forming substrate is impregnated with a thermosetting epoxy resin or the like, and is placed in a B stage state by a method such as drying. A film 62 is attached to both sides of the substrate material 61 by a laminating method using a hot roll or the like. Next, as shown in FIG. 6B, via holes 63 are formed in the substrate material 61 by a processing method such as laser. Then, as shown in FIG. 6C, a conductive paste 64 formed by kneading conductive particles such as copper powder and a thermosetting resin, a curing agent, and a solvent is filled in the via hole 63. After that, when the film 2 is peeled off, the conductive paste 64 as shown in FIG. When copper foil 65 is placed on both sides and heated and pressed by a hot press device (not shown), the substrate material 61 is thermally cured as shown in FIG. 6E, and the conductive paste 64 is compressed. The copper foil 65 on both sides is electrically connected. At this time, the epoxy resin impregnated in the substrate material 61 flows and flows out to form a flow-out portion 66. After that, an extra portion of the end is cut off to obtain a shape as shown in Fig. A circuit-formed substrate on both sides as shown in FIG. 6G is obtained.

However, in the above-described manufacturing method, the electrical connection between the front and back of the circuit forming substrate may be insufficient. Further, when the multilayer circuit forming substrate is formed by the above-described manufacturing method, similar defects may occur in the circuit of the surface layer and the inner layer.

The main cause is the occurrence of outflow particles 610 in which the conductive particles in the conductive paste 64 flow out of the via holes 63 as shown in FIG. 6E. In order to realize an ideal electrical connection, the conductive paste 64 is compressed in the vertical direction in Fig. 6E, and the conductive particles in the conductive paste come into strong contact with each other efficiently. Need to be firmly in contact with them. However, the thermosetting resin in the substrate material 61 flows outward, as can be seen from the formation of the outflow portion 66 in the process from FIG. 6D to FIG. 6E. At that time, the conductive particles in the conductive paste 64 are swept away in the lateral direction of FIG. 6E, and as a result, the conductive paste 64 cannot be efficiently compressed. The electrical connection becomes unstable. In the above description, the case of a substrate material using a glass woven fabric and a thermosetting resin has been described.However, organic fibers such as inorganic fibers and polyamides other than glass and reinforcing materials for nonwoven fabrics other than the woven fabric are used. It is the same even if there is.

However, when a woven fabric is used, the flow resistance of the above-mentioned thermosetting resin becomes remarkable because the flow resistance in the woven fabric is particularly small, and it is difficult to make an electrical connection by a conductive paste. Furthermore, the phenomenon that the fibers constituting the woven fabric are shifted has an adverse effect. The phenomenon will be described with reference to FIGS. 7A to 7C. As shown in FIG. 7A, via holes 63 are formed in a substrate material 61 using a glass fiber woven fabric 68 using a laser. When viewed from above, the via hole 63 is formed by cutting the glass fiber woven cloth 68 as shown in FIG. 7B. Thereafter, the steps as described with reference to FIGS. 6C to 6E are performed. Observation of the via holes 63 on the circuit-forming board thereafter revealed that, as shown in Fig. 7C, the conductive paste 64 spread around due to the pressing force during hot pressing and the flow of the impregnated resin, etc. Cloth 6 8 is also moved outward from the via hole 63 from the initial regular arrangement. When such a phenomenon occurs, the compression of the conductive paste 64 becomes inefficient. Such phenomena are problems in the manufacture of such a circuit-formed substrate in terms of variation in electrical connection resistance and reliability.

In recent years, since thin substrates have been demanded as circuit forming substrates, thin materials are often used for glass fiber woven fabrics. However, in such a material, the degree of filling of the glass fiber is low, and the gap between the fibers is relatively large. In particular, when the thickness of the glass fiber woven fabric is 100 / m or less, the above phenomenon becomes a serious problem.

The main factors that determine the amount of compression of the conductive paste 4 are the amount by which the substrate material 61 is compressed in the thickness direction in the hot pressing process in FIGS. 6D to 6E, and the amount of the substrate material 61 in FIG. 6D. This is the amount by which the conductive paste 64 protrudes from. In a high-density circuit board, since the number of points for connecting layers between via holes 63 is enormous, an element that exerts a compressive action on conductive paste 64 is required in addition to controlling the two main factors described above. It is. Disclosure of the invention

In the method for manufacturing a circuit-formed substrate according to the present invention, the resin flow in the hot pressing step is restricted. Thereby, the electrical connection by the interlayer connection part such as the conductive paste is efficiently performed.

Further, in the material for manufacturing a circuit forming substrate of the present invention, a resin whose flow is controlled in the hot pressing step is used. Thereby, the electrical connection by the interlayer connection part such as the conductive paste is efficiently performed.

As a result, the reliability of electrical connection between layers using a conductive paste or the like is greatly improved, and a high-density, high-quality circuit-forming substrate can be provided. BRIEF DESCRIPTION OF THE FIGURES

FIGS. 1A to 1G show the manufacture of a circuit forming substrate according to the first embodiment of the present invention. It is a process sectional view showing a fabrication method.

2A to 2E are process cross-sectional views illustrating a method for manufacturing a circuit-formed substrate according to the second embodiment of the present invention.

FIG. 3A is a schematic sectional view of a via forming step in the method for manufacturing a circuit-formed substrate according to the third embodiment of the present invention.

FIG. 3B is a top view of a via portion before filling with a conductive paste in the method of manufacturing a circuit-formed substrate according to the third embodiment of the present invention.

FIG. 3C is a top view of the via portion after filling the conductive paste in the method of manufacturing the circuit-formed substrate according to the third embodiment of the present invention.

4A to 4H are process cross-sectional views illustrating a method for manufacturing a circuit-formed substrate according to the fourth embodiment of the present invention.

FIG. 5A is a schematic cross-sectional view of a via forming step in the method for manufacturing a circuit-formed substrate according to the fifth embodiment of the present invention.

FIG. 5B is a top view of a via portion before filling with a conductive paste in the method of manufacturing a circuit-formed substrate according to the fifth embodiment of the present invention.

FIG. 5C is a top view of the via portion after filling the conductive paste in the method of manufacturing a circuit-formed substrate according to the fifth embodiment of the present invention.

6A to 6G are process cross-sectional views illustrating a method for manufacturing a circuit-formed substrate according to the related art.

FIG. 7A is a schematic cross-sectional view of a via formation process in a conventional method for manufacturing a circuit formation substrate.

FIG. 7B is a top view of the via portion before filling the conductive base in the conventional method of manufacturing a circuit-formed substrate.

FIG. 7C is a top view of the via portion after filling the conductive base in the conventional method of manufacturing a circuit-formed substrate. BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The components having the same configuration are denoted by the same reference numerals, and the detailed description is omitted.

(Embodiment 1) 1A to 1G are process cross-sectional views showing a method for manufacturing a circuit-forming substrate and materials for manufacturing the circuit-forming substrate according to the first embodiment of the present invention.

As shown in Fig. 1A, first, a board material made of a pre-predeer with a thickness of 100 0 // m and impregnated with a thermosetting epoxy resin using a glass fiber woven fabric as a reinforcing material Attach film 2 of m. The film 12 uses polyethylene terephthalate (PET). If necessary, a thermosetting resin such as an epoxy resin may be coated on the film 12.

Thereafter, as shown in FIG. 1B, a via hole 13 having a diameter of about 200 m is formed using a carbon dioxide gas laser.

Thereafter, as shown in FIG. 1C, the conductive paste 14 is filled in the via hole 13 by screen printing or the like. The conductive paste 14 is obtained by kneading copper powder having a diameter of about 5 m, a thermosetting resin, and a curing agent. A solvent or the like may be added to the conductive paste 4 for the purpose of adjusting viscosity or the like. Next, as shown in FIG. 1D, when the films 12 on both sides of the substrate material 11 are peeled off, the substrate material 1 1 The conductive base 14 protrudes from the film 12 to about the thickness of the film 12. Copper foil 15 is placed on both sides.

Next, when a hot press step of heating and pressing in the vertical direction in the figure is performed, the shape becomes as shown in FIG. 1E. At that time, the thermosetting resin in the substrate material 11 flows to form a flow-out portion 16.

Next, as shown in FIG. 1F, the peripheral portion of the substrate material 11 is cut into a desired size. A circuit 17 is formed by patterning the copper foil 15 by a method such as etching to obtain a double-sided circuit-formed substrate as shown in FIG. 1G.

The mass of the resin that flows in the hot pressing process and flows out around the substrate material 11 with respect to the mass of the substrate material 11 before hot pressing in the above process, that is, the mass of the flow-out portion 16 in FIG. 1E Is the resin flow rate. In order to solve the problem of insufficient electrical connection by the conductive paste 14 described in the background art, the resin flow rate must be at least 20% or less. The _t Table 1 Table 1 shows examples of the experimental results by the inventors have studied the resin flow quantity summarizes the following measurement results.

1) Substrate material thickness before and after hot pressing

2) The amount of resin flow calculated from the weight of the flow-out part generated in the peripheral part in the heat press process and the weight of the substrate material before the heat press process

3) Via connection resistance per one point (average value) determined from the electrical resistance of a test pattern circuit in which 500 via holes are connected in series with the copper foil on the front and back of the board

In the sample of Experiment No. 1, the resin flow rate was 22.8%, the connection resistance of vias varied from several Ω to several hundred Ω, and some vias had no electrical connection.

When the cross section of the via portion was observed for the sample of Experiment No. 1, the conductive particles in the conductive paste 4 were flowing out.

However, in the samples of Experiment Nos. 2 to 7 where the hot press conditions were examined to reduce the resin flow, the via connection resistance decreased, and practical control was achieved by controlling the resin flow to 20% or less. The via connection resistance is obtained.

In addition, the sample is stored for a long period of time in a high-temperature, high-humidity environment, etc., and the reliability is evaluated by measuring the change over time in the via connection resistance.

Also, as is clear from the results in Table 1, an initial via connection resistance value can be obtained when the resin flow rate is 10% or less. In this case, better results can be obtained for reliability.

In order to improve the electrical connection, it is effective to reduce the resin flow rate.On the other hand, as can be seen from the results of Experiment No. 7, it is necessary to form the substrate material 1 well in the heat press process. Requires a resin flow of at least 1%. The following phenomena are described as poor filling in Table 1. The substrate of Experiment No. 7 after the hot pressing process has a part that looks white, and when it is enlarged, bubbles and parts where the surface of the substrate material is uneven are observed. This is because the flow of the resin is small. This is a failure mode called whitening in the manufacture of printed wiring boards and the like, in which bubbles and unevenness are generated without filling the unevenness of the layer circuit. When whitening occurs, the properties such as the peel strength of the copper foil and the soldering heat resistance are reduced.

As a means for achieving the above-mentioned resin flow rate of 20% or less, it is effective to control the rate of temperature rise to 3 ° C / min or less in the temperature profile in the hot pressing step.

However, taking into account that the time required for the hot pressing process is extremely long, or that the heating rate is too low, which adversely affects the moldability of the resin, the heating rate is 0.5 t / min. : More preferably.

Also, taking into account the viscosity change during heating of the resin etc. contained in the substrate material 11, the heating rate is controlled to 3 or less per minute only in the time range where the fluidity increases during the hot pressing process. During the time period, the temperature may be increased at a faster rate.

It is also possible to control the characteristics of the substrate material 11 to obtain the above effects. To do this, the uncured epoxy resin is heated and dried, and the volatile components, the amount of residual solvent, and the degree of thermal curing are controlled by the heating temperature and time to change the curing time. With this method, the curing time, which indicates the melting and curing characteristics of the substrate material during hot pressing, is set to 110 seconds or less. By using a substrate material containing such a resin material, the flow rate of the resin is reduced to 20% or less, and the electric current between the layers by the conductive paste is reduced. Good connection can be achieved.

The curing time is preferably 10 seconds or more in order to avoid the occurrence of the above-mentioned poor filling property. Further, from the viewpoint of the adhesion between the copper foil 15 and the substrate material 11 in FIG. 1E or the absorption of the resin amount, it is more preferable to set the time to 50 seconds or more.

(Embodiment 2)

Although Embodiment 1 is an example of a double-sided circuit-formed substrate, it is preferable to apply the present invention also to manufacture a multilayer circuit-formed substrate as shown in FIGS. 2A to 2E.

First, a double-sided circuit forming substrate as shown in FIG. 2A is prepared. Next, as shown in Fig. 2B, the board material 11 filled with the conductive paste 14 and the copper foil 15 are aligned and placed on the front and back of the double-sided circuit board, and heated and pressed by a heat press device or the like. . Thus, the substrate material 11 is molded and cured as shown in FIG. 2C. At that time, the component of the flowing substrate material 1 flows out to form a flow-out portion 26.

In such a process, the weight of the flow-out portion 26 (the amount of resin flow) becomes 20% or less with respect to the weight of the two substrate materials 11 by the method described in the first embodiment. To do.

Next, after cutting off the extraneous part in the periphery to obtain a shape as shown in Fig. 2D, the copper foil 15 is patterned by etching or the like to form a circuit 27, and Fig. 2E Obtain a 4-layer circuit forming substrate as shown.

Even in the production of such a multilayer circuit formation substrate, the electrical connection between the layers can be favorably formed by applying the method for producing a circuit formation substrate and the material for production of the present invention.

It should be noted that a resin flow rate of 1% or more is required to fill in the circuit unevenness of the inner layer circuit forming substrate when manufacturing the multilayer circuit forming substrate. When the resin flow rate is controlled to 20% or less by controlling the curing time of the resin contained in the substrate material 11, the curing time is 50 seconds or more and 110 seconds or less in consideration of the embedding property of the inner layer circuit. It is preferable that The double-sided circuit forming substrate used in the present embodiment may be the substrate described in the first embodiment, or may be a substrate in which connection between layers is formed by a normal plating method or the like. Further, a configuration in which the substrate material 11 is temporarily pressure-bonded to the double-sided circuit formation substrate in the step shown in FIG.

(Embodiment 3)

A third embodiment of the present invention will be described below with reference to FIGS. 3A to 3C.

As shown in FIG. 3A, a via hole 13 is formed in a pre-prepared substrate material 11 using a glass fiber woven fabric 38 by using a laser.

When viewed from above, the via hole 13 is formed by cutting the glass fiber woven fabric 38 as shown in FIG. 3B. At this time, a welded portion 39 as shown in FIG. 3B is formed by a specific processing method.

When the conductive paste 14 is filled into the via hole 13 after the welded part 39 is formed and the hot pressing process is performed, as shown in Fig. 3C, around the via hole 13 of the conductive paste 14 Spread is prevented. Therefore, the electrical interlayer connection by the conductive paste 14 is good. When the via hole 13 is formed by drilling, the welded portion 39 is formed by transforming the resin component and the like in the substrate material 11 by frictional heat or the like at the time of application and solidifying the glass fiber fabric 3 8 Can also be realized by fixing around the via hole 13. As described above, the welded portion 39 does not need to be composed only of a reinforcing material such as glass fiber, and the resin component and the like in the substrate material 11 are hardened or deteriorated by heat or the like at the time of processing, so that the subsequent hot pressing step The same effect can be obtained if the fluidity at the point is lost. However, when forming the via holes 13 by using a laser, it is preferable that the glass fiber woven fabric 38 is melted or deteriorated to form the welded portion 39 mainly composed of the glass fiber woven fabric 38.

Table 2 shows examples of the study results of the inventor.

Via holes 13 were processed under various conditions using three types of laser oscillators to produce a double-sided circuit-formed substrate, and the contents described in Embodiment 1 were used. 0 Similarly, the results of comparing the via connection resistance values are summarized.

As can be seen from these results, the via connection resistance value is related to the laser wavelength. When the substrate material processed via holes 13 is observed in detail, the formation of a welded portion is confirmed at an oscillation wavelength of 10.6, but no welded portion is observed when an oscillation wavelength of 9.4 m is used. . Table 2

When using various lasers such as excimer lasers, YAG harmonics, carbon dioxide lasers, etc., it is possible to form welds depending on the processing conditions. Heating is preferred for forming the weld.

Further, as described above, using a laser having a wavelength of 10 / m or more is effective for forming the welded portion 39. Practically, the use of a carbon dioxide laser is advantageous in terms of processing speed and cost. In addition, A) the processing efficiency, oscillation efficiency, B) the generated laser beam contains multiple oscillation wavelengths, and C) the range of 10 to 1 lim from the viewpoint of application to micromachining, that is, the condensing property of the optical system. The laser-based processing method is more preferable.

(Embodiment 4)

Embodiment 4 will be described with reference to FIGS. 4A to 4H.

As shown in Fig. 4A, substrate material 41 is made of polyethylene terephthalate (PET) on both sides using glass fiber woven fabric as a reinforcing material. This is a 100 m thick pre-preder to which an m film 12 is attached. If necessary, the film 12 may be coated with a thermosetting resin such as an epoxy resin. This substrate material 41 differs from the substrate material 11 in the first embodiment in that a large amount of volatile components remain when a pre-preda is manufactured. From the weight change before and after drying for 160 hours, the volatile content is 3%.

Subsequent steps shown in FIGS. 4B to 4D are the same as in the first embodiment.

Next, the substrate material 41 is introduced into a vacuum drying device (not shown), and dried in a vacuum of about 133 Pa for one hour. During drying, in order to prevent the temperature of the substrate material 41 from lowering, a process of introducing hot air at 50 ° C into the vacuum drying apparatus and reducing the pressure again is performed three times. In this step, as shown in FIG. 4E, the thickness of the substrate material 41 is reduced, and the reduction is about 2 / m. As a result, before drying, the height of the protruding portion of the conductive base 14 from the substrate material 41 of about 20 m increases by about 1 m on each of the front and back sides of the substrate material, to about 22 m. Become.

Next, as shown in Fig. 4F, copper foils 15 are placed on both sides of the substrate material 41, and a heat pressing step of heating and pressing vertically in the figure is performed. Shape.

Further, a circuit 17 is formed by patterning the copper foil 15 by a method such as etching to obtain a double-sided circuit forming substrate as shown in FIG. 1H.

When a circuit-formed substrate is manufactured by the above process, the height of the projecting portion of the conductive paste 14 is increased by only 2 m before the hot pressing. To improve the electrical connection.

Since the normal hot pressing process uses a vacuum press, it is considered that most of the volatile components in the substrate material are removed during the hot pressing process. In such a manufacturing method, the amount of the component of the substrate material flowing during the hot pressing process is relatively large, which is disadvantageous in that the conductive paste is compressed in the thickness direction of the substrate to realize electrical connection. In the present embodiment, the volatile components in the substrate material 41 are removed by vacuum drying before the hot pressing step, and the flow during hot pressing is controlled. In addition, by removing the volatile components, the height of the conductive paste 14 projecting from the substrate material 41 is increased, and the effective compression amount is increased. As a result, the conductive paste 14 can be extremely efficiently compressed in the hot pressing step, and the electrical connection between the circuits 17 on the front and back of the circuit forming substrate becomes sufficient. The method described above is also suitably applied to the substrate material 21 when manufacturing the multilayer circuit forming substrate as described in the second embodiment.

Experimental results show that the effect of the present embodiment is remarkable when the volatile content of the substrate material 41 is 0.5% or more, but the storage stability of the substrate material 41 decreases when the volatile content is too large. In some cases, it is preferable to keep the content to 5% or less.

It is preferable that a high-boiling solvent such as BCA (butyl carbitol acetate) is contained as a volatile component in the production process of the substrate material 41.

Although the step of reducing the thickness of the substrate material 41 has been described using the vacuum drying method, it may be performed by a normal drying method involving heating under conditions that do not cause a problem in the physical properties of the substrate material 41. .

Also, in the process of reducing the thickness of the substrate material, the interlayer connection portion protrudes from the substrate material even when a method of selectively etching the substrate material by a dry or wet etching method using a plasma excimer laser is used. The amount to do can be secured. In this case, there is also an effect that the thickness reduction and the small amount of the substrate material are stabilized. (Embodiment 5)

A fifth embodiment of the present invention will be described below with reference to FIGS. 5A to 5C.

As shown in FIG. 5A, a via hole 13 is formed in a pre-prepared substrate material 51 using a glass fiber woven fabric 38 by using a laser. The substrate material 51 contains a filler 5 10 as a solid content. The usual substrate material is a glass fiber woven fabric 38, which is impregnated with a liquid material called a varnish obtained by diluting a thermosetting resin with a solvent or the like, and then volatilizes volatile components such as a solvent in a drying process to cure the thermosetting resin. It is manufactured by a method that adjusts By dispersing the filler in the varnish, a substrate material 51 used in the present embodiment is manufactured. In this embodiment there use a silica-based filler on silica (Si0 ₂₎ from about. 1 to 2 m in diameter.

As shown in FIG. 5A, a low fluidized bed 5 11 is formed around the via hole 13. In this low fluidized bed 511, the processing energy is absorbed by the filler 510 during laser processing and converted into heat, and the surrounding thermosetting resin is denatured. It is formed by a phenomenon that forms a layer with the filler 510 as a core. Its formation efficiency is much higher than without the filler. Naturally, the low-fluidized bed 5 11 1 may contain the glass fiber woven fabric 38 as a component.

After the low fluidized bed 5 11 is formed, the via hole 13 is filled with the conductive paste 14 and the hot pressing process is performed. spread forms of electrical interlayer connection is good _c low flow layer 5 1 1 by _c therefore conductive paste 1 4 is prevented in the via hole 1 3 surrounding to form the via hole 1 3 drilling It can also be realized by altering the resin component and the like in the substrate material 51 by frictional heat or the like in the case and solidifying it together with the filler 5 10. However, when the via hole 13 is formed by using a laser, it is preferable to absorb energy in the filer 50 and convert it to heat to form the low fluidized layer 511.

Regarding the wavelength of the laser used in this step, the formation of the low fluidized bed 511 is efficient when an oscillation wavelength of 9 m or more is used by the carbon dioxide laser. Further, a material other than silica may be used as the material of the filler 510, and the same effect can be obtained by using talc, gypsum powder or the like, or metal hydroxide (such as aluminum hydroxide).

In all of the embodiments described above, the substrate material is made of a woven glass fiber fabric. Although the description has been made assuming that the resin is impregnated with the curable resin and B-staged, a non-woven fabric may be used instead of the glass fiber woven fabric. Organic fibers such as aramid may be used instead of glass fibers.

In the first, second, and fourth embodiments, a B-stage film may be used instead of the pre-predader as the substrate material.

Further, a material in which a woven fabric and a nonwoven fabric are mixed, for example, a material in which a glass fiber nonwoven fabric is sandwiched between two glass fibers may be used as a reinforcing material.

Although the thermosetting resin in all the embodiments of the present invention has been described as an epoxy resin, the following may be used. Epoxy / melamine resin, unsaturated polyester resin, phenolic resin, polyimide resin, cyanate resin, cyanate ester resin, naphthalene resin, urea resin, amino resin, alkyd resin, Single or two types of silicone resin, furan resin, polyurethane resin, amino alkyd resin, acryl resin, fluorine resin, polyphenylene ether resin, cyanate ester resin, etc. A thermosetting resin composition mixed with the above or a thermosetting resin composition modified with a thermoplastic resin. If necessary, flame retardants and inorganic fillers can be added.

Further, a circuit made of a metal foil or the like temporarily fixed to a support may be used instead of the copper foil.

Also, the description has been given using a conductive paste in which conductive particles such as copper powder, a curing agent, and a thermosetting resin are kneaded as the interlayer connection portion. Instead, a variety of compositions can be used, such as a mixture of a polymer material having an appropriate viscosity that is discharged into the substrate material during heat pressing and conductive particles, or a mixture of a solvent and the like. Furthermore, in addition to the conductive paste, post-shaped conductive protrusions formed by plating or the like, or conductive particles having a relatively large particle size that is not pasted can be used alone as an interlayer connection part. It is. Industrial applicability

In the method for manufacturing a circuit forming substrate according to the present invention, any one of the following configurations is adopted. A) Limit the resin flow during the hot pressing process. B) Reinforcing fibers are fused or bonded together. C) Reduce the thickness of the substrate material after the filling process. D) A low fluidized bed is formed with the filler mixed in the substrate material. Further, in the material for manufacturing a circuit-formed substrate of the present invention, a physical property value for controlling the resin flow in the hot pressing step is imparted, or the thickness of the substrate material can be efficiently reduced after the filling step. The configuration shall include volatile components. According to the present invention, the electrical connection can be efficiently achieved by the inter-layer connection portion such as the conductive paste.

In particular, when a woven fabric is used as a reinforcing material for the substrate material, it has a particular effect that the connection between layers can be stabilized while taking advantage of the dimensional stability and the like of the woven fabric. This is due to the process of controlling the fluidity or locally preventing the movement of the fiber at the part where the interlayer connection is to be performed, simultaneously with the drilling, or by reducing the thickness of the substrate material. As a result of the above, the reliability of electrical connection between layers using an interlayer connection portion such as a conductive paste is improved, and a high-quality, high-density circuit board can be provided.

Claims

BW request range

1. A laminating step of laminating a substrate material including at least a B-stage state substrate material having a hole for forming an interlayer connection, and a hot pressing step involving heating and pressing the substrate material. The circuit forming substrate manufacturing method, wherein a flow amount of the B-stage state substrate material flowing out to the periphery in the hot pressing step is 20% by weight or less of the substrate material.

2. In the laminating step, at least one of the following is laminated with the B-stage state substrate material:

A method for manufacturing the circuit-formed substrate according to claim 1.

(1) Metal foil

(2) Metal foil attached to the support

(3) Circuit pattern attached to the support

(4) C-stage substrate material with circuit pattern (5) C-stage substrate material with metal foil

3. The B-stage state substrate material includes at least one of a metal foil and a circuit pattern,

A method for manufacturing the circuit-formed substrate according to claim 1.

4. In the hot pressing step, at least a temperature rising rate in a region where the substrate material flows in the B-stage state is 3 ° C or less per minute.

A method for manufacturing the circuit-formed substrate according to claim 1.

5. A laminating step of laminating a substrate material including at least a B-stage state substrate material;

A hole forming step of forming a hole for forming a connection between eyebrows in the B-stage state substrate material;

Melting or altering the components of the B-stage state substrate material in the hole forming step;

A method for manufacturing a circuit forming substrate.

6. In the hole forming step, at least one of a reinforcing material and a reinforcing fiber in the B-stage state substrate material is fixed. 7. A method for manufacturing a circuit-formed substrate according to claim 5.

7 The hole forming process is energy beam processing.

A method for manufacturing the circuit-formed substrate according to claim 5.

8 The energy beam processing is laser processing,

A method for manufacturing the circuit-formed substrate according to claim 7.

9 The laser processing is a carbon dioxide laser,

A method for manufacturing the circuit-formed substrate according to claim 8.

10 laser wavelength is 10 or more,

A method for manufacturing a circuit-formed substrate according to claim 9.

1 1 A laminating step of laminating a substrate material including at least the B-stage state substrate material;

A hole forming step of forming a hole for forming an interlayer connection portion in the B-stage state substrate material;

A laminating preparation step of reducing the thickness of the B-stage state substrate material.

A method for manufacturing a circuit forming substrate.

2 a filling step of filling the hole with a conductive material, further comprising: performing the lamination preparation step after the filling step;

A method for manufacturing a circuit-formed substrate according to claim 11.

13. Volatile volatile components in the substrate material in the 基板 stage state in the lamination preparation step;

A method for manufacturing a circuit-formed substrate according to claim 11.

14. Etch the Βstage state substrate material in the lamination preparation step;

Request 方法 manufacturing method of self-loaded circuit forming substrate,

15. A laminating step of laminating a substrate material including at least a stage-state substrate material;

A hole forming step of forming a hole for forming an interlayer connection part in the stage-state substrate material;

In the hole drilling process, the Β stage state around the hole A low fluidized bed containing solids in the substrate material is formed,

A method for manufacturing a circuit forming substrate.

1 6. The hole forming step is energy beam processing.

A method for manufacturing a circuit-formed substrate according to claim 15.

17. The energy beam processing is laser processing.

A method for manufacturing a circuit-formed substrate according to claim 16.

1 8. The laser processing is a carbon dioxide laser,

A method for manufacturing the circuit-formed substrate according to claim 17.

1 9. The laser wavelength is 9m or more,

19. The method for manufacturing a circuit-formed substrate according to claim 18.

20. A B-stage state substrate material which is provided with an interlayer connection for producing a circuit forming substrate having two or more layers,

The flow rate during hot pressing is 20% by weight or less,

Materials for manufacturing circuit-formed substrates.

21.1 A material included in the B-stage state substrate material in which an interlayer connection portion is provided for manufacturing a circuit forming substrate having two or more layers,

Curing time is 110 seconds or less,

Materials for manufacturing circuit-formed substrates.

22. A B-stage state substrate material which is provided with an interlayer connection part for manufacturing a circuit forming substrate having two or more layers,

Contains 0.5% by weight or more of volatile matter,

Materials for manufacturing circuit-formed substrates.

23. A B-stage state substrate material that is provided with an interlayer connection for manufacturing a circuit forming substrate having two or more layers,

In the step of forming a hole for providing the interlayer connection portion, including a solid content forming a low fluidized bed around the hole,

Materials for manufacturing circuit-formed substrates.

24. The solid content is mainly composed of a filler made of an inorganic material.

A material for producing the circuit-formed substrate according to claim 22.