WO2002067297A3 - Run-to-run control method for proportional-integral-derivative (pid) controller tuning for rapid thermal processing (rtp) - Google Patents

Run-to-run control method for proportional-integral-derivative (pid) controller tuning for rapid thermal processing (rtp) Download PDF

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Publication number
WO2002067297A3
WO2002067297A3 PCT/US2001/043415 US0143415W WO02067297A3 WO 2002067297 A3 WO2002067297 A3 WO 2002067297A3 US 0143415 W US0143415 W US 0143415W WO 02067297 A3 WO02067297 A3 WO 02067297A3
Authority
WO
WIPO (PCT)
Prior art keywords
run
rapid thermal
thermal processing
rtp
pid
Prior art date
Application number
PCT/US2001/043415
Other languages
French (fr)
Other versions
WO2002067297A2 (en
Inventor
Terrence J Riley
William Jarrett Campbell
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of WO2002067297A2 publication Critical patent/WO2002067297A2/en
Publication of WO2002067297A3 publication Critical patent/WO2002067297A3/en

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Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/042—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators in which a parameter or coefficient is automatically adjusted to optimise the performance
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B11/00—Automatic controllers
    • G05B11/01—Automatic controllers electric
    • G05B11/36—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential
    • G05B11/42—Automatic controllers electric with provision for obtaining particular characteristics, e.g. proportional, integral, differential for obtaining a characteristic which is both proportional and time-dependent, e.g. P.I., P.I.D.

Abstract

A method is provided, the method comprising measuring at least one parameter characteristic of rapid thermal processing performed on a workpiece in a rapid thermal processing step, and modeling the at least one characteristic parameter measured using a first-principles radiation model. The method also comprises applying the first-principles radiation model to modify the rapid thermal processing performed in the rapid thermal processing step.
PCT/US2001/043415 2000-12-06 2001-11-06 Run-to-run control method for proportional-integral-derivative (pid) controller tuning for rapid thermal processing (rtp) WO2002067297A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/732,187 US6819963B2 (en) 2000-12-06 2000-12-06 Run-to-run control method for proportional-integral-derivative (PID) controller tuning for rapid thermal processing (RTP)
US09/732,187 2000-12-06

Publications (2)

Publication Number Publication Date
WO2002067297A2 WO2002067297A2 (en) 2002-08-29
WO2002067297A3 true WO2002067297A3 (en) 2003-03-27

Family

ID=24942526

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/043415 WO2002067297A2 (en) 2000-12-06 2001-11-06 Run-to-run control method for proportional-integral-derivative (pid) controller tuning for rapid thermal processing (rtp)

Country Status (2)

Country Link
US (1) US6819963B2 (en)
WO (1) WO2002067297A2 (en)

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US6708074B1 (en) 2000-08-11 2004-03-16 Applied Materials, Inc. Generic interface builder
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US7962482B2 (en) 2001-05-16 2011-06-14 Pandora Media, Inc. Methods and systems for utilizing contextual feedback to generate and modify playlists
US7698012B2 (en) 2001-06-19 2010-04-13 Applied Materials, Inc. Dynamic metrology schemes and sampling schemes for advanced process control in semiconductor processing
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
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US6915172B2 (en) * 2001-11-21 2005-07-05 General Electric Method, system and storage medium for enhancing process control
US7225047B2 (en) * 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US20030199112A1 (en) 2002-03-22 2003-10-23 Applied Materials, Inc. Copper wiring module control
US6783080B2 (en) * 2002-05-16 2004-08-31 Advanced Thermal Sciences Corp. Systems and methods for controlling temperatures of process tools
JP4694843B2 (en) * 2002-09-30 2011-06-08 東京エレクトロン株式会社 Equipment for semiconductor manufacturing process monitoring and control
CN1720490B (en) 2002-11-15 2010-12-08 应用材料有限公司 Method and system for controlling manufacture process having multivariate input parameters
DE10329107B4 (en) * 2002-12-23 2015-05-28 Mattson Thermal Products Gmbh Method for determining at least one state variable from a model of an RTP system
AU2003292147A1 (en) 2002-12-23 2004-07-22 Mattson Thermal Products Gmbh Method for determining the temperature of a semiconductor wafer in a rapid thermal processing system
US7426420B2 (en) * 2003-09-15 2008-09-16 International Business Machines Corporation System for dispatching semiconductors lots
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8032348B2 (en) * 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8036869B2 (en) * 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8050900B2 (en) * 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
DE102004009126A1 (en) * 2004-02-25 2005-09-22 Bego Medical Ag Method and device for generating control data sets for the production of products by free-form sintering or melting and device for this production
US7729789B2 (en) * 2004-05-04 2010-06-01 Fisher-Rosemount Systems, Inc. Process plant monitoring based on multivariate statistical analysis and on-line process simulation
US7751908B2 (en) * 2004-12-02 2010-07-06 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for thermal process control
US7877154B2 (en) * 2005-09-30 2011-01-25 Fisher-Rosemount Systems, Inc. Method and system for controlling a batch process
US7580768B2 (en) * 2006-09-22 2009-08-25 Texas Instruments Deutschland Gmbh Method of adjusting process variables in a processing flow
JP5242906B2 (en) * 2006-10-17 2013-07-24 東京エレクトロン株式会社 Substrate processing apparatus control device, control method, and storage medium storing control program
JP5547472B2 (en) * 2009-12-28 2014-07-16 株式会社荏原製作所 Substrate polishing apparatus, substrate polishing method, and polishing pad surface temperature control apparatus for substrate polishing apparatus
CN103824789A (en) * 2013-11-26 2014-05-28 上海华力微电子有限公司 Wafer electrical test method
US20160282886A1 (en) * 2015-03-27 2016-09-29 Applied Materials, Inc. Upper dome temperature closed loop control
US10253997B2 (en) * 2017-06-16 2019-04-09 Johnson Controls Technology Company Building climate control system with decoupler for independent control of interacting feedback loops
CN107861387B (en) * 2017-11-13 2019-11-26 浙江大学 A kind of internal thermally coupled air separation column control device based on concentration curve optimization algorithm
JP7091221B2 (en) * 2018-10-23 2022-06-27 株式会社Ｓｃｒｅｅｎホールディングス Heat treatment method and heat treatment equipment

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US5442727A (en) * 1993-04-02 1995-08-15 At&T Corp. Semiconductor processing technique, including pyrometric measurement of radiantly heated bodies
US5446825A (en) * 1991-04-24 1995-08-29 Texas Instruments Incorporated High performance multi-zone illuminator module for semiconductor wafer processing
US5583780A (en) * 1994-12-30 1996-12-10 Kee; Robert J. Method and device for predicting wavelength dependent radiation influences in thermal systems
US5895596A (en) * 1997-01-27 1999-04-20 Semitool Thermal Model based temperature controller for semiconductor thermal processors
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Patent Citations (5)

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US5446825A (en) * 1991-04-24 1995-08-29 Texas Instruments Incorporated High performance multi-zone illuminator module for semiconductor wafer processing
US5442727A (en) * 1993-04-02 1995-08-15 At&T Corp. Semiconductor processing technique, including pyrometric measurement of radiantly heated bodies
US5583780A (en) * 1994-12-30 1996-12-10 Kee; Robert J. Method and device for predicting wavelength dependent radiation influences in thermal systems
US5895596A (en) * 1997-01-27 1999-04-20 Semitool Thermal Model based temperature controller for semiconductor thermal processors
US6110289A (en) * 1997-02-25 2000-08-29 Moore Epitaxial, Inc. Rapid thermal processing barrel reactor for processing substrates

Also Published As

Publication number Publication date
WO2002067297A2 (en) 2002-08-29
US20020107604A1 (en) 2002-08-08
US6819963B2 (en) 2004-11-16

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