WO2002005325A3 - Chuck with heat exchanger and temperature control fluid - Google Patents
Chuck with heat exchanger and temperature control fluid Download PDFInfo
- Publication number
- WO2002005325A3 WO2002005325A3 PCT/US2001/021573 US0121573W WO0205325A3 WO 2002005325 A3 WO2002005325 A3 WO 2002005325A3 US 0121573 W US0121573 W US 0121573W WO 0205325 A3 WO0205325 A3 WO 0205325A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- fluid
- chuck
- circulation system
- temperature control
- gas
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/12—Arrangements for cooling or lubricating parts of the machine
- B23Q11/126—Arrangements for cooling or lubricating parts of the machine for cooling only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/12—Arrangements for cooling or lubricating parts of the machine
- B23Q11/126—Arrangements for cooling or lubricating parts of the machine for cooling only
- B23Q11/127—Arrangements for cooling or lubricating parts of the machine for cooling only for cooling motors or spindles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
- B23Q11/141—Methods or arrangements for maintaining a constant temperature in parts of machine tools using a closed fluid circuit for cooling or heating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/14—Methods or arrangements for maintaining a constant temperature in parts of machine tools
- B23Q11/143—Methods or arrangements for maintaining a constant temperature in parts of machine tools comprising heating means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
- F25B39/028—Evaporators having distributing means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B41/00—Fluid-circulation arrangements
- F25B41/20—Disposition of valves, e.g. of on-off valves or flow control valves
- F25B41/24—Arrangement of shut-off valves for disconnecting a part of the refrigerant cycle, e.g. an outdoor part
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F27/00—Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/02—Header boxes; End plates
- F28F9/026—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits
- F28F9/028—Header boxes; End plates with static flow control means, e.g. with means for uniformly distributing heat exchange media into conduits by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2891—Features relating to contacting the IC under test, e.g. probe heads; chucks related to sensing or controlling of force, position, temperature
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B9/00—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point
- F25B9/002—Compression machines, plants or systems, in which the refrigerant is air or other gas of low boiling point characterised by the refrigerant
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
- F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
- F28D2021/0077—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for tempering, e.g. with cooling or heating circuits for temperature control of elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002509090A JP2004502918A (en) | 2000-07-11 | 2001-07-09 | Chuck with heat exchanger with inclined deflection surface for directing refrigerant and recovering circulating temperature control fluid |
AU2001271920A AU2001271920A1 (en) | 2000-07-11 | 2001-07-09 | Chuck with heat exchanger and temperature control fluid |
EP01950977A EP1309986A2 (en) | 2000-07-11 | 2001-07-09 | Chuck with heat exchanger and temperature control fluid |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/614,488 | 2000-07-11 | ||
US09/614,488 US6505478B1 (en) | 1997-12-31 | 2000-07-11 | Heat exchanger having sloped deflection surface for directing refrigerant |
US09/858,185 US6866094B2 (en) | 1997-12-31 | 2001-05-15 | Temperature-controlled chuck with recovery of circulating temperature control fluid |
US09/858,185 | 2001-05-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2002005325A2 WO2002005325A2 (en) | 2002-01-17 |
WO2002005325A3 true WO2002005325A3 (en) | 2003-02-20 |
Family
ID=27087265
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2001/021573 WO2002005325A2 (en) | 2000-07-11 | 2001-07-09 | Chuck with heat exchanger and temperature control fluid |
Country Status (5)
Country | Link |
---|---|
US (1) | US6866094B2 (en) |
EP (1) | EP1309986A2 (en) |
JP (1) | JP2004502918A (en) |
AU (1) | AU2001271920A1 (en) |
WO (1) | WO2002005325A2 (en) |
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JP4241295B2 (en) * | 2003-09-26 | 2009-03-18 | キヤノン株式会社 | Stage equipment |
US6953082B2 (en) * | 2003-12-16 | 2005-10-11 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
US7055579B2 (en) * | 2003-12-16 | 2006-06-06 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
US7128133B2 (en) * | 2003-12-16 | 2006-10-31 | 3M Innovative Properties Company | Hydrofluoroether as a heat-transfer fluid |
DE102005001163B3 (en) * | 2005-01-10 | 2006-05-18 | Erich Reitinger | Semiconductor wafers` testing method, involves testing wafer by probes, and reducing heating energy with constant cooling efficiency, under consideration of detected increase of temperature of fluids flowing via tempered chuck device |
US20060196653A1 (en) * | 2005-03-04 | 2006-09-07 | Elsdoerfer Norbert W | Apparatus and method for controlling temperature in a chuck system |
JP2006284001A (en) * | 2005-03-31 | 2006-10-19 | Sumitomo Heavy Ind Ltd | Temperature control device |
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US20100116788A1 (en) * | 2008-11-12 | 2010-05-13 | Lam Research Corporation | Substrate temperature control by using liquid controlled multizone substrate support |
US8410393B2 (en) | 2010-05-24 | 2013-04-02 | Lam Research Corporation | Apparatus and method for temperature control of a semiconductor substrate support |
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KR20130031945A (en) * | 2011-09-22 | 2013-04-01 | 삼성전자주식회사 | Apparatus for controlling temperature of loading chuck and method of controlling temperature |
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US9976785B2 (en) * | 2014-05-15 | 2018-05-22 | Lennox Industries Inc. | Liquid line charge compensator |
US10330358B2 (en) * | 2014-05-15 | 2019-06-25 | Lennox Industries Inc. | System for refrigerant pressure relief in HVAC systems |
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-
2001
- 2001-05-15 US US09/858,185 patent/US6866094B2/en not_active Expired - Fee Related
- 2001-07-09 AU AU2001271920A patent/AU2001271920A1/en not_active Abandoned
- 2001-07-09 EP EP01950977A patent/EP1309986A2/en not_active Withdrawn
- 2001-07-09 JP JP2002509090A patent/JP2004502918A/en active Pending
- 2001-07-09 WO PCT/US2001/021573 patent/WO2002005325A2/en active Application Filing
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
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US5192849A (en) * | 1990-08-10 | 1993-03-09 | Texas Instruments Incorporated | Multipurpose low-thermal-mass chuck for semiconductor processing equipment |
US5435379A (en) * | 1992-08-14 | 1995-07-25 | Texas Instruments Incorporated | Method and apparatus for low-temperature semiconductor processing |
US5567267A (en) * | 1992-11-20 | 1996-10-22 | Tokyo Electron Limited | Method of controlling temperature of susceptor |
US5904807A (en) * | 1994-09-27 | 1999-05-18 | Hadwaco Ltd. Oy | Liquid distributor for an evaporator |
US5651268A (en) * | 1995-01-05 | 1997-07-29 | Nippondeso Co., Ltd. | Refrigerant evaporator |
US6068730A (en) * | 1995-08-22 | 2000-05-30 | Hadwaco Ltd Oy | Liquid distributor for evaporator |
EP0827187A2 (en) * | 1996-08-26 | 1998-03-04 | Applied Materials, Inc. | Method and apparatus for cooling a workpiece using an electrostatic chuck |
WO1999034159A1 (en) * | 1997-12-31 | 1999-07-08 | Temptronic Corporation | Temperature control system for a workpiece chuck |
US6073681A (en) * | 1997-12-31 | 2000-06-13 | Temptronic Corporation | Workpiece chuck |
JP2000183142A (en) * | 1998-12-14 | 2000-06-30 | Tokyo Seimitsu Co Ltd | Wafer chuck table |
WO2000074117A1 (en) * | 1999-05-27 | 2000-12-07 | Matrix Integrated Systems, Inc. | Rapid heating and cooling of workpiece chucks |
JP2001244237A (en) * | 2000-02-28 | 2001-09-07 | Hitachi Ltd | Refrigerant purge method and system for semiconductor manufacturing device |
Non-Patent Citations (2)
Title |
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PATENT ABSTRACTS OF JAPAN vol. 2000, no. 09 13 October 2000 (2000-10-13) * |
PATENT ABSTRACTS OF JAPAN vol. 2000, no. 26 1 July 2002 (2002-07-01) * |
Also Published As
Publication number | Publication date |
---|---|
AU2001271920A1 (en) | 2002-01-21 |
WO2002005325A2 (en) | 2002-01-17 |
JP2004502918A (en) | 2004-01-29 |
US6866094B2 (en) | 2005-03-15 |
US20020003037A1 (en) | 2002-01-10 |
EP1309986A2 (en) | 2003-05-14 |
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