WO2001082343A3 - Heat management in wafer processing equipment using thermoelectric device - Google Patents

Heat management in wafer processing equipment using thermoelectric device Download PDF

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Publication number
WO2001082343A3
WO2001082343A3 PCT/US2001/012832 US0112832W WO0182343A3 WO 2001082343 A3 WO2001082343 A3 WO 2001082343A3 US 0112832 W US0112832 W US 0112832W WO 0182343 A3 WO0182343 A3 WO 0182343A3
Authority
WO
WIPO (PCT)
Prior art keywords
thermoelectric device
heat
heat management
current
processing equipment
Prior art date
Application number
PCT/US2001/012832
Other languages
French (fr)
Other versions
WO2001082343A2 (en
Inventor
Woo Sik Yoo
Original Assignee
Wafermasters Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wafermasters Inc filed Critical Wafermasters Inc
Priority to KR1020017016633A priority Critical patent/KR20020031346A/en
Priority to EP01927247A priority patent/EP1277228A2/en
Priority to JP2001579338A priority patent/JP2003532288A/en
Publication of WO2001082343A2 publication Critical patent/WO2001082343A2/en
Publication of WO2001082343A3 publication Critical patent/WO2001082343A3/en

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

Abstract

A semiconductor processing system and method, which uses heat energy typically wasted in most common semiconductor processing systems, to generate power. The present invention includes a heat management system, which uses the waste heat and/or the excess heat generated by a thermal-processing chamber, to generate a current from a first thermoelectric device. The current from the first thermoelectric device is then delivered to a second thermoelectric device. The second thermoelectric device, driven by the current from the first thermoelectric device, can be used to remove heat from a cooling chamber or else add heat to another processing chamber.
PCT/US2001/012832 2000-04-26 2001-04-19 Heat management in wafer processing equipment using thermoelectric device WO2001082343A2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020017016633A KR20020031346A (en) 2000-04-26 2001-04-19 Heat management in wafer processing equipment using thermoelectric device
EP01927247A EP1277228A2 (en) 2000-04-26 2001-04-19 Heat management in wafer processing equipment using thermoelectric device
JP2001579338A JP2003532288A (en) 2000-04-26 2001-04-19 Thermal management in wafer processing equipment using thermoelectric devices

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/558,522 2000-04-26
US09/558,522 US6271459B1 (en) 2000-04-26 2000-04-26 Heat management in wafer processing equipment using thermoelectric device

Publications (2)

Publication Number Publication Date
WO2001082343A2 WO2001082343A2 (en) 2001-11-01
WO2001082343A3 true WO2001082343A3 (en) 2002-02-28

Family

ID=24229876

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2001/012832 WO2001082343A2 (en) 2000-04-26 2001-04-19 Heat management in wafer processing equipment using thermoelectric device

Country Status (6)

Country Link
US (1) US6271459B1 (en)
EP (1) EP1277228A2 (en)
JP (1) JP2003532288A (en)
KR (1) KR20020031346A (en)
TW (1) TWI238552B (en)
WO (1) WO2001082343A2 (en)

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US20070028956A1 (en) * 2005-04-12 2007-02-08 Rama Venkatasubramanian Methods of forming thermoelectric devices including superlattice structures of alternating layers with heterogeneous periods and related devices
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US7679203B2 (en) * 2006-03-03 2010-03-16 Nextreme Thermal Solutions, Inc. Methods of forming thermoelectric devices using islands of thermoelectric material and related structures
US20070283709A1 (en) * 2006-06-09 2007-12-13 Veeco Instruments Inc. Apparatus and methods for managing the temperature of a substrate in a high vacuum processing system
US8637794B2 (en) * 2009-10-21 2014-01-28 Lam Research Corporation Heating plate with planar heating zones for semiconductor processing
US8642480B2 (en) * 2009-12-15 2014-02-04 Lam Research Corporation Adjusting substrate temperature to improve CD uniformity
US9601677B2 (en) * 2010-03-15 2017-03-21 Laird Durham, Inc. Thermoelectric (TE) devices/structures including thermoelectric elements with exposed major surfaces
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CN101976987B (en) * 2010-10-20 2012-07-04 王海波 Industrial afterheat semiconductor power generation method and device using heat carrier as heating medium
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US8546732B2 (en) 2010-11-10 2013-10-01 Lam Research Corporation Heating plate with planar heater zones for semiconductor processing
US9307578B2 (en) 2011-08-17 2016-04-05 Lam Research Corporation System and method for monitoring temperatures of and controlling multiplexed heater array
US10388493B2 (en) 2011-09-16 2019-08-20 Lam Research Corporation Component of a substrate support assembly producing localized magnetic fields
US8624168B2 (en) 2011-09-20 2014-01-07 Lam Research Corporation Heating plate with diode planar heater zones for semiconductor processing
US8461674B2 (en) 2011-09-21 2013-06-11 Lam Research Corporation Thermal plate with planar thermal zones for semiconductor processing
US9324589B2 (en) 2012-02-28 2016-04-26 Lam Research Corporation Multiplexed heater array using AC drive for semiconductor processing
US20130239591A1 (en) * 2012-03-16 2013-09-19 Raytheon Company Thermal electric cooler and method
US8809747B2 (en) 2012-04-13 2014-08-19 Lam Research Corporation Current peak spreading schemes for multiplexed heated array
US10049948B2 (en) 2012-11-30 2018-08-14 Lam Research Corporation Power switching system for ESC with array of thermal control elements
US11024789B2 (en) 2013-12-06 2021-06-01 Sridhar Kasichainula Flexible encapsulation of a flexible thin-film based thermoelectric device with sputter deposited layer of N-type and P-type thermoelectric legs
US10566515B2 (en) 2013-12-06 2020-02-18 Sridhar Kasichainula Extended area of sputter deposited N-type and P-type thermoelectric legs in a flexible thin-film based thermoelectric device
US10290794B2 (en) 2016-12-05 2019-05-14 Sridhar Kasichainula Pin coupling based thermoelectric device
US10141492B2 (en) 2015-05-14 2018-11-27 Nimbus Materials Inc. Energy harvesting for wearable technology through a thin flexible thermoelectric device
US10367131B2 (en) 2013-12-06 2019-07-30 Sridhar Kasichainula Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device
US20180090660A1 (en) 2013-12-06 2018-03-29 Sridhar Kasichainula Flexible thin-film based thermoelectric device with sputter deposited layer of n-type and p-type thermoelectric legs
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Also Published As

Publication number Publication date
EP1277228A2 (en) 2003-01-22
US6271459B1 (en) 2001-08-07
WO2001082343A2 (en) 2001-11-01
JP2003532288A (en) 2003-10-28
TWI238552B (en) 2005-08-21
KR20020031346A (en) 2002-05-01

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