WO2000059682A1 - Method and apparatus for plating and polishing a semiconductor substrate - Google Patents
Method and apparatus for plating and polishing a semiconductor substrate Download PDFInfo
- Publication number
- WO2000059682A1 WO2000059682A1 PCT/US2000/008336 US0008336W WO0059682A1 WO 2000059682 A1 WO2000059682 A1 WO 2000059682A1 US 0008336 W US0008336 W US 0008336W WO 0059682 A1 WO0059682 A1 WO 0059682A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- workpiece
- anode
- plating
- polishing
- pad
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/12—Lapping plates for working plane surfaces
- B24B37/16—Lapping plates for working plane surfaces characterised by the shape of the lapping plate surface, e.g. grooved
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/22—Electroplating combined with mechanical treatment during the deposition
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/615—Microstructure of the layers, e.g. mixed structure
- C25D5/617—Crystalline layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electrodes Of Semiconductors (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU39292/00A AU3929200A (en) | 1999-04-03 | 2000-03-29 | Method and apparatus for plating and polishing a semiconductor substrate |
JP2000609226A JP2002541655A (en) | 1999-04-03 | 2000-03-29 | Method and apparatus for plating and polishing |
EP00918491A EP1169162B1 (en) | 1999-04-03 | 2000-03-29 | Method and apparatus for plating and polishing a semiconductor substrate |
DE60015513T DE60015513T2 (en) | 1999-04-03 | 2000-03-29 | METHOD AND DEVICE FOR PLATING AND POLISHING A SEMICONDUCTOR COMPONENT |
AT00918491T ATE281277T1 (en) | 1999-04-03 | 2000-03-29 | METHOD AND DEVICE FOR PLATING AND POLISHING A SEMICONDUCTOR COMPONENT |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/285,621 | 1999-04-03 | ||
US09/285,621 US6328872B1 (en) | 1999-04-03 | 1999-04-03 | Method and apparatus for plating and polishing a semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000059682A1 true WO2000059682A1 (en) | 2000-10-12 |
Family
ID=23095034
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US2000/008336 WO2000059682A1 (en) | 1999-04-03 | 2000-03-29 | Method and apparatus for plating and polishing a semiconductor substrate |
Country Status (10)
Country | Link |
---|---|
US (3) | US6328872B1 (en) |
EP (1) | EP1169162B1 (en) |
JP (1) | JP2002541655A (en) |
KR (1) | KR100778131B1 (en) |
CN (1) | CN1268470C (en) |
AT (1) | ATE281277T1 (en) |
AU (1) | AU3929200A (en) |
DE (1) | DE60015513T2 (en) |
TW (1) | TW506022B (en) |
WO (1) | WO2000059682A1 (en) |
Cited By (25)
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---|---|---|---|---|
WO2001032362A1 (en) * | 1999-11-04 | 2001-05-10 | Philips Semiconductors Inc. | Method and apparatus for deposition on and polishing of a semiconductor surface |
US6299741B1 (en) | 1999-11-29 | 2001-10-09 | Applied Materials, Inc. | Advanced electrolytic polish (AEP) assisted metal wafer planarization method and apparatus |
JP2002121698A (en) * | 2000-10-13 | 2002-04-26 | Sony Corp | Semiconductor manufacturing apparatus and method of manufacturing semiconductor device |
US6379223B1 (en) | 1999-11-29 | 2002-04-30 | Applied Materials, Inc. | Method and apparatus for electrochemical-mechanical planarization |
WO2002041369A2 (en) * | 2000-11-20 | 2002-05-23 | Rodel Holdings, Inc. | Electropolishing and chemical mechanical planarization |
WO2002050336A2 (en) * | 2000-12-18 | 2002-06-27 | Applied Materials, Inc. | Integrated mutli-step gap fill and all feature planarization for conductive materials |
WO2002077327A2 (en) * | 2001-03-01 | 2002-10-03 | Nutool, Inc. | Mask plate design |
US6537144B1 (en) | 2000-02-17 | 2003-03-25 | Applied Materials, Inc. | Method and apparatus for enhanced CMP using metals having reductive properties |
WO2003030223A2 (en) * | 2001-09-11 | 2003-04-10 | Ebara Corporation | Substrate processing apparatus and method |
US6613200B2 (en) | 2001-01-26 | 2003-09-02 | Applied Materials, Inc. | Electro-chemical plating with reduced thickness and integration with chemical mechanical polisher into a single platform |
US6653242B1 (en) | 2000-06-30 | 2003-11-25 | Applied Materials, Inc. | Solution to metal re-deposition during substrate planarization |
US6838149B2 (en) | 2001-12-13 | 2005-01-04 | 3M Innovative Properties Company | Abrasive article for the deposition and polishing of a conductive material |
US6848970B2 (en) | 2002-09-16 | 2005-02-01 | Applied Materials, Inc. | Process control in electrochemically assisted planarization |
US6867448B1 (en) | 2000-08-31 | 2005-03-15 | Micron Technology, Inc. | Electro-mechanically polished structure |
US6951599B2 (en) | 2002-01-22 | 2005-10-04 | Applied Materials, Inc. | Electropolishing of metallic interconnects |
US7066800B2 (en) | 2000-02-17 | 2006-06-27 | Applied Materials Inc. | Conductive polishing article for electrochemical mechanical polishing |
US7125324B2 (en) | 2004-03-09 | 2006-10-24 | 3M Innovative Properties Company | Insulated pad conditioner and method of using same |
US7527723B2 (en) | 2004-01-16 | 2009-05-05 | Ebara Corporation | Electrolytic processing apparatus and electrolytic processing method |
US7842169B2 (en) | 2003-03-04 | 2010-11-30 | Applied Materials, Inc. | Method and apparatus for local polishing control |
US7972485B2 (en) | 2000-08-30 | 2011-07-05 | Round Rock Research, Llc | Methods and apparatus for electromechanically and/or electrochemically-mechanically removing conductive material from a microelectronic substrate |
US8048756B2 (en) | 2002-08-29 | 2011-11-01 | Micron Technology, Inc. | Method for removing metal layers formed outside an aperture of a BPSG layer utilizing multiple etching processes including electrochemical-mechanical polishing |
US8048287B2 (en) | 2000-08-30 | 2011-11-01 | Round Rock Research, Llc | Method for selectively removing conductive material from a microelectronic substrate |
US8101060B2 (en) | 2004-02-20 | 2012-01-24 | Round Rock Research, Llc | Methods and apparatuses for electrochemical-mechanical polishing |
US8603319B2 (en) | 2004-09-01 | 2013-12-10 | Micron Technology, Inc. | Methods and systems for removing materials from microfeature workpieces with organic and/or non-aqueous electrolytic media |
US9214359B2 (en) | 2000-08-30 | 2015-12-15 | Micron Technology, Inc. | Method and apparatus for simultaneously removing multiple conductive materials from microelectronic substrates |
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US7449098B1 (en) | 1999-10-05 | 2008-11-11 | Novellus Systems, Inc. | Method for planar electroplating |
US7531079B1 (en) | 1998-10-26 | 2009-05-12 | Novellus Systems, Inc. | Method and apparatus for uniform electropolishing of damascene IC structures by selective agitation |
US7686935B2 (en) * | 1998-10-26 | 2010-03-30 | Novellus Systems, Inc. | Pad-assisted electropolishing |
US6719615B1 (en) | 2000-10-10 | 2004-04-13 | Beaver Creek Concepts Inc | Versatile wafer refining |
US7204917B2 (en) | 1998-12-01 | 2007-04-17 | Novellus Systems, Inc. | Workpiece surface influencing device designs for electrochemical mechanical processing and method of using the same |
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JP2001188254A (en) * | 1999-10-21 | 2001-07-10 | Matsushita Electric Ind Co Ltd | Selective electrochemical processor within substrate, selective chemical processor within substrate, and examination and correction method of active substrate |
US6612915B1 (en) * | 1999-12-27 | 2003-09-02 | Nutool Inc. | Work piece carrier head for plating and polishing |
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Also Published As
Publication number | Publication date |
---|---|
AU3929200A (en) | 2000-10-23 |
JP2002541655A (en) | 2002-12-03 |
KR100778131B1 (en) | 2007-11-21 |
EP1169162B1 (en) | 2004-11-03 |
DE60015513T2 (en) | 2006-04-06 |
CN1351531A (en) | 2002-05-29 |
US6328872B1 (en) | 2001-12-11 |
US20050034976A1 (en) | 2005-02-17 |
US6797132B2 (en) | 2004-09-28 |
US7309406B2 (en) | 2007-12-18 |
EP1169162A1 (en) | 2002-01-09 |
ATE281277T1 (en) | 2004-11-15 |
CN1268470C (en) | 2006-08-09 |
DE60015513D1 (en) | 2004-12-09 |
US20020011417A1 (en) | 2002-01-31 |
TW506022B (en) | 2002-10-11 |
KR20010111286A (en) | 2001-12-17 |
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