WO2000057473A1 - Component and method for producing said component - Google Patents

Component and method for producing said component Download PDF

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Publication number
WO2000057473A1
WO2000057473A1 PCT/DE2000/000804 DE0000804W WO0057473A1 WO 2000057473 A1 WO2000057473 A1 WO 2000057473A1 DE 0000804 W DE0000804 W DE 0000804W WO 0057473 A1 WO0057473 A1 WO 0057473A1
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WO
WIPO (PCT)
Prior art keywords
interposer
electronic circuit
integrated electronic
component
projections
Prior art date
Application number
PCT/DE2000/000804
Other languages
German (de)
French (fr)
Inventor
Johann Winderl
Thomas Münch
Original Assignee
Infineon Technologies Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies Ag filed Critical Infineon Technologies Ag
Publication of WO2000057473A1 publication Critical patent/WO2000057473A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the invention relates to a component with at least one integrated electronic circuit, at least one interposer being located in the area of a main area of the integrated electronic circuit.
  • the invention further relates to a method for producing a component with at least one integrated electronic circuit, at least one interposer being applied to the integrated electronic circuit in the area of a main area of the integrated electronic circuit.
  • interposers are preferably used to make electrical contact with the outside, on the other hand to hermetically seal off the integrated electronic circuit from environmental influences - in particular moisture - and to effectively dissipate any heat that is produced.
  • interposer In order to enable the integrated electronic circuit to be installed as simply as possible, at least one interposer is used in each case.
  • the interposer preferably fulfills the following tasks: rewiring a connection grid of the integrated electronic circuit to a connection grid, picking up solder balls and protecting the surface of the integrated electronic circuit.
  • the invention has for its object to design a component so that heat loss occurring in the integrated electronic circuit is as effective as possible is dissipated.
  • the component should be designed so that it also has the highest possible mechanical strength, in particular flexural strength.
  • this object is achieved in that the interposer has recesses substantially perpendicular to a main plane of the integrated electronic circuit.
  • the component is designed so that the recesses penetrate the interposer.
  • a useful variant of the component is characterized in that the interposer has projections.
  • An advantageous embodiment of the component is characterized in that the recesses surround the protrusions.
  • Another, even more advantageous embodiment of the component is characterized in that the projections are connected to one another. This further increases the mechanical strength. Good thermal conductivity is also achieved.
  • a particularly preferred embodiment of this component is characterized in that the recesses are located between the projections. This achieves a certain elasticity in the lateral direction.
  • the lateral elasticity can be increased in that the projections have a honeycomb shape at least in some areas.
  • the component is expediently designed in such a way that the projections have a shape which essentially corresponds to a cross section of the honeycomb structure.
  • a generic method for producing a component with at least one integrated electronic circuit is also carried out in such a way that the interposer is applied in such a way that recesses contained in the interposer are aligned essentially perpendicular to a main plane of the integrated electronic circuit.
  • 1 is a plan view of an interposer with a honeycomb structure
  • FIG. 2 is a plan view of an integrated electronic circuit and on the interposer shown in FIG. 1,
  • Fig. 3 is a plan view of a composite body from the integrated electronic shown in Fig. 2
  • Fig. 4 is a plan view shown in Fig. 2
  • the interposer 10 is shown in a top view in FIG. 1.
  • the interposer 10 has projections 30, the projections 30 having a shape which essentially corresponds to a cross section of a honeycomb structure.
  • the projections 30 are connected to one another. There are recesses 40 between the projections 30. The recesses 40 penetrate the interposer 10.
  • FIG. 2 shows a further method step in which the interposer is centered above the integrated electronic circuit 20.
  • the interposer 10 is applied to the integrated electronic circuit 20 in such a way that the recesses 40 contained in the interposer 10 are aligned essentially perpendicular to a main plane of the integrated electronic circuit 20.
  • the component is completed by an in
  • solder balls solder balls

Abstract

The invention relates to a component with at least one integrated electronic circuit (20). At least one interposer (10) is located in the area of a main surface of the integrated electronic circuit. According to the invention, the component is characterised in that the interposer (10) is provided with recesses which are essentially vertical in relation to a main surface of the integrated electronic circuit (20).

Description

Beschreibungdescription
Bauelement und Verfahren zur Herstellung des BauelementesComponent and method for producing the component
Die Erfindung betrifft ein Bauelement mit mindestens einer integrierten elektronischen Schaltung, wobei sich im Bereich einer Hauptfläche der integrierten elektronischen Schaltung wenigstens ein Interposer befindet.The invention relates to a component with at least one integrated electronic circuit, at least one interposer being located in the area of a main area of the integrated electronic circuit.
Die Erfindung betrifft ferner ein Verfahren zum Herstellen eines Bauelementes mit mindestens einer integrierten elektronischen Schaltung, wobei im Bereich einer Hauptfläche der integrierten elektronischen Schaltung auf die integrierte elektronische Schaltung wenigstens ein Interposer aufgebracht wird.The invention further relates to a method for producing a component with at least one integrated electronic circuit, at least one interposer being applied to the integrated electronic circuit in the area of a main area of the integrated electronic circuit.
Im Stand der Technik sind vielfältige Einsatzmöglichkeiten für Bauelemente mit Interposern bekannt. Interposer dienen einerseits vorzugsweise dazu, einen elektrischen Kontakt nach außen herzustellen, die integrierte elektronische Schaltung andererseits von Umwelteinflüssen - insbesondere Feuchtigkeit - hermetisch abzuriegeln und entstehende Wärme effektiv abzuführen.A variety of possible uses for components with interposers are known in the prior art. On the one hand, interposers are preferably used to make electrical contact with the outside, on the other hand to hermetically seal off the integrated electronic circuit from environmental influences - in particular moisture - and to effectively dissipate any heat that is produced.
Um einen möglichst einfachen Einbau der integrierten elektronischen Schaltung zu ermöglichen, wird jeweils wenigstens ein Interposer eingesetzt. Der Interposer erfüllt vorzugsweise folgende Aufgaben: Umverdrahtung eines Anschlußrasters der integrierten elektronischen Schaltung auf ein Anschlußraster, Aufnahme von Lötkugeln sowie Schutz der Oberfläche der integrierten elektronischen Schaltung.In order to enable the integrated electronic circuit to be installed as simply as possible, at least one interposer is used in each case. The interposer preferably fulfills the following tasks: rewiring a connection grid of the integrated electronic circuit to a connection grid, picking up solder balls and protecting the surface of the integrated electronic circuit.
Der Erfindung liegt die Aufgabe zugrunde, ein Bauelement so zu gestalten, daß in der integrierten elektronischen Schaltung entstehende Verlustwärme möglichst effektiv abgeführt wird. Insbesondere soll das Bauelement so gestaltet werden, daß es auch eine möglichst hohe mechanische Festigkeit, insbesondere Biegefestigkeit, aufweist.The invention has for its object to design a component so that heat loss occurring in the integrated electronic circuit is as effective as possible is dissipated. In particular, the component should be designed so that it also has the highest possible mechanical strength, in particular flexural strength.
Erfmdungsgemaß wird diese Aufgabe dadurch gelost, daß der Interposer im wesentlichen senkrecht zu einer Hauptebene der integrierten elektronischen Schaltung Ausnehmungen aufweist.According to the invention, this object is achieved in that the interposer has recesses substantially perpendicular to a main plane of the integrated electronic circuit.
Besonders vorteilhaft ist es, daß das Bauelement so gestaltet ist, daß die Ausnehmungen den Interposer durchdringen.It is particularly advantageous that the component is designed so that the recesses penetrate the interposer.
Eine zweckmäßige Variante des Bauelementes zeichnet sich dadurch aus, daß der Interposer Vorsprunge aufweist.A useful variant of the component is characterized in that the interposer has projections.
Eine vorteilhafte Ausfuhrungsform des Bauelementes zeichnet sich dadurch aus, daß die Ausnehmungen die Vorsprunge umgeben .An advantageous embodiment of the component is characterized in that the recesses surround the protrusions.
Eine andere, noch vorteilhaftere Ausfuhrungsform des Bauelementes zeichnet sich dadurch aus, daß die Vorsprunge miteinander verbunden sind. Hierdurch wird die mechanische Festigkeit weiter erhöht. Außerdem wird eine gute Wärmeleitfähigkeit erzielt.Another, even more advantageous embodiment of the component is characterized in that the projections are connected to one another. This further increases the mechanical strength. Good thermal conductivity is also achieved.
Eine besonders bevorzugte Ausfuhrung dieses Bauelementes zeichnet sich dadurch aus, daß die Ausnehmungen sich zwischen den Vorsprungen befinden. Hierdurch wird eine gewisse Elastizität in lateraler Richtung erzielt.A particularly preferred embodiment of this component is characterized in that the recesses are located between the projections. This achieves a certain elasticity in the lateral direction.
Die laterale Elastizität kann dadurch gesteigert werden, daß die Vorsprunge wenigstens bereichsweise eine Wabenform aufweisen.The lateral elasticity can be increased in that the projections have a honeycomb shape at least in some areas.
Zweckmaßigerweise ist hierbei das Bauelement so gestaltet, daß die Vorsprunge eine Form aufweisen, die im wesentlichen einem Querschnitt der Wabenstruktur entspricht.The component is expediently designed in such a way that the projections have a shape which essentially corresponds to a cross section of the honeycomb structure.
Erfindungsgemäß wird ferner ein gattungsgemäßes Verfahren zum Herstellen eines Bauelementes mit mindestens einer integrierten elektronischen Schaltung so durchgeführt, daß der Interposer so aufgebracht wird, daß in dem Interposer enthaltene Ausnehmungen im wesentlichen senkrecht zu einer Hauptebene der integrierten elektronischen Schaltung ausgerichtet werden.According to the invention, a generic method for producing a component with at least one integrated electronic circuit is also carried out in such a way that the interposer is applied in such a way that recesses contained in the interposer are aligned essentially perpendicular to a main plane of the integrated electronic circuit.
Es ist besonders vorteilhaft, daß einzelne Fragmente des Interposers mit einer aushärtenden Abdeckmasse verstärkt werden.It is particularly advantageous that individual fragments of the interposer are reinforced with a hardening masking compound.
Weitere Vorteile, Besonderheiten und zweckmäßigeOther advantages, special features and practical
Weiterbildungen der Erfindung ergeben sich aus den Unteransprüchen und der nachfolgenden Darstellung eines bevorzugten Ausführungsbeispiels anhand der Zeichnungen.Further developments of the invention result from the subclaims and the following illustration of a preferred exemplary embodiment with reference to the drawings.
Von den Zeichnungen zeigtFrom the drawings shows
Fig. 1 eine Aufsicht auf einen Interposer mit Wabenstruktur,1 is a plan view of an interposer with a honeycomb structure,
Fig. 2 eine Aufsicht auf eine integrierte elektronische Schaltung und auf den in Fig. 1 dargestellten Interposer,2 is a plan view of an integrated electronic circuit and on the interposer shown in FIG. 1,
Fig. 3 eine Aufsicht auf einen Verbundkörper aus der in Fig. 2 dargestellten integrierten elektronischenFig. 3 is a plan view of a composite body from the integrated electronic shown in Fig. 2
Schaltung und auf den Interposer,Circuit and on the interposer,
Fig. 4 eine Aufsicht den in Fig. 2 dargestelltenFig. 4 is a plan view shown in Fig. 2
Verbundkörper nach einem Aufbringen von Lötbällen, In den Fig. 1 bis 4 ist ein Verfahren zum Herstellen eines Bauelementes mit einer integrierten elektronischen Schaltung 20 und einem Interposer 10 dargestellt.Composite body after application of solder balls, 1 to 4, a method for producing a component with an integrated electronic circuit 20 and an interposer 10 is shown.
In Fig. 1 ist in einer Aufsicht ein Interposer 10 dargestellt. Der Interposer 10 weist Vorsprünge 30 auf, wobei die Vorsprünge 30 eine Form aufweisen, die im wesentlichen einem Querschnitt einer Wabenstruktur entspricht.An interposer 10 is shown in a top view in FIG. 1. The interposer 10 has projections 30, the projections 30 having a shape which essentially corresponds to a cross section of a honeycomb structure.
Die Vorsprünge 30 sind miteinander verbunden. Zwischen den Vorsprüngen 30 befinden sich Ausnehmungen 40. Die Ausnehmungen 40 durchdringen den Interposer 10.The projections 30 are connected to one another. There are recesses 40 between the projections 30. The recesses 40 penetrate the interposer 10.
In Fig. 2 ist ein weiterer Verfahrensschritt dargestellt, bei dem der Interposer oberhalb der integrierten elektronischen Schaltung 20 zentriert wird.2 shows a further method step in which the interposer is centered above the integrated electronic circuit 20.
In einem weiteren, in Fig. 3 dargestellten, Verfahrensschritt wird der Interposer 10 so auf die integrierte elektronische Schaltung 20 aufgebracht, daß die in dem Interposer 10 enthaltenen Ausnehmungen 40 im wesentlichen senkrecht zu einer Hauptebene der integrierten elektronischen Schaltung 20 ausgerichtet werden.In a further method step, shown in FIG. 3, the interposer 10 is applied to the integrated electronic circuit 20 in such a way that the recesses 40 contained in the interposer 10 are aligned essentially perpendicular to a main plane of the integrated electronic circuit 20.
Eine Komplettierung des Bauelementes erfolgt durch ein inThe component is completed by an in
Fig. 4 dargestelltes Aufbringen von Lötbällen (Solderballs) 50. 4 shown application of solder balls (solder balls) 50.

Claims

Patentansprüche : Claims:
1. Bauelement1. component
- mit mindestens einer integrierten elektronischen Schaltung (20),- With at least one integrated electronic circuit (20),
- wobei sich im Bereich einer Hauptfläche der integrierten elektronischen Schaltung wenigstens ein Interposer (10) befindet, d a d u r c h g e k e n n z e i c h - n e t, daß der Interposer (10) im wesentlichen senkrecht zu einer Hauptebene der integrierten elektronischen Schaltung (20) Ausnehmungen aufweist.- Wherein at least one interposer (10) is located in the area of a main surface of the integrated electronic circuit, so that the interposer (10) has recesses essentially perpendicular to a main plane of the integrated electronic circuit (20).
2. Bauelement nach Anspruch 1, d a d u r c h g e k e n n z e i c h n e t, daß die2. Component according to claim 1, d a d u r c h g e k e n n z e i c h n e t that the
Ausnehmungen den Interposer (10) durchdringen.Penetrations penetrate the interposer (10).
3. Bauelement nach einem der Ansprüche 1 oder 2, d a d u r c h g e k e n n - z e i c h n e t, daß der Interposer (10) Vorsprünge aufweist.3. Component according to one of claims 1 or 2, d a d u r c h g e k e n n - z e i c h n e t that the interposer (10) has projections.
4. Bauelement nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t, daß die Ausnehmungen die Vorsprünge umgeben.4. Component according to claim 3, d a d u r c h g e k e n n z e i c h n e t that the recesses surround the projections.
5. Bauelement nach Anspruch 3, d a d u r c h g e k e n n z e i c h n e t, daß die Vorsprünge miteinander verbunden sind.5. The component according to claim 3, d a d u r c h g e k e n n z e i c h n e t that the projections are interconnected.
6. Bauelement nach Anspruch 5, d a d u r c h g e k e n n z e i c h n e t, daß die Ausnehmungen sich zwischen den Vorsprüngen befinden.6. The component according to claim 5, d a d u r c h g e k e n n z e i c h n e t that the recesses are located between the projections.
7. Bauelement nach einem der Ansprüche 5 oder 6, d a d u r c h g e k e n n z e i c h n e t, daß die Vorsprünge wenigstens bereichsweise eine Wabenform aufweisen.7. Component according to one of claims 5 or 6, characterized in that the projections have a honeycomb shape at least in regions.
8. Bauelement nach Anspruch 7, d a d u r c h g e k e n n z e i c h n e t, daß die Vorsprünge eine Form aufweisen, die im wesentlichen einem Querschnitt der Wabenstruktur entspricht.8. The component according to claim 7, so that the projections have a shape which essentially corresponds to a cross section of the honeycomb structure.
9. Verfahren zum Herstellen eines Bauelementes mit mindestens einer integrierten elektronischen Schaltung (20), wobei im Bereich einer Hauptfläche der integrierten elektronischen Schaltung (20) wenigstens ein Interposer (10) aufgebracht wird, d a d u r c h g e k e n n z e i c h n e t, daß der Interposer (10) so aufgebracht wird, daß in dem Interposer (10) enthaltene Ausnehmungen im wesentlichen senkrecht zu einer Hauptebene der integrierten elektronischen Schaltung (20) ausgerichtet werden.9. A method for producing a component with at least one integrated electronic circuit (20), at least one interposer (10) being applied in the area of a main surface of the integrated electronic circuit (20), characterized in that the interposer (10) is applied in such a way that that recesses contained in the interposer (10) are aligned substantially perpendicular to a main plane of the integrated electronic circuit (20).
10. Verfahren nach Anspruch 9, d a d u r c h g e k e n n z e i c h n e t, daß einzelne Fragmente des Interposers (10) mit einer aushärtenden Abdeckmasse verstärkt werden. 10. The method of claim 9, d a d u r c h g e k e n n z e i c h n e t that individual fragments of the interposer (10) are reinforced with a hardening masking compound.
PCT/DE2000/000804 1999-03-18 2000-03-15 Component and method for producing said component WO2000057473A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE1999112240 DE19912240A1 (en) 1999-03-18 1999-03-18 Component and method for producing the component
DE19912240.7 1999-03-18

Publications (1)

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WO2000057473A1 true WO2000057473A1 (en) 2000-09-28

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
EP0368262A2 (en) * 1988-11-09 1990-05-16 Nitto Denko Corporation Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
US4950843A (en) * 1987-11-25 1990-08-21 Nissan Motor Co., Ltd. Mounting structure for semiconductor device
US4969826A (en) * 1989-12-06 1990-11-13 Amp Incorporated High density connector for an IC chip carrier
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5531022A (en) * 1992-10-19 1996-07-02 International Business Machines Corporation Method of forming a three dimensional high performance interconnection package
JPH0955457A (en) * 1995-08-15 1997-02-25 Mitsubishi Alum Co Ltd Heat sink and its manufacture
US5821624A (en) * 1989-08-28 1998-10-13 Lsi Logic Corporation Semiconductor device assembly techniques using preformed planar structures

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4546405A (en) * 1983-05-25 1985-10-08 International Business Machines Corporation Heat sink for electronic package
US4950843A (en) * 1987-11-25 1990-08-21 Nissan Motor Co., Ltd. Mounting structure for semiconductor device
EP0368262A2 (en) * 1988-11-09 1990-05-16 Nitto Denko Corporation Wiring substrate, film carrier, semiconductor device made by using the film carrier, and mounting structure comprising the semiconductor device
US5821624A (en) * 1989-08-28 1998-10-13 Lsi Logic Corporation Semiconductor device assembly techniques using preformed planar structures
US4969826A (en) * 1989-12-06 1990-11-13 Amp Incorporated High density connector for an IC chip carrier
US5531022A (en) * 1992-10-19 1996-07-02 International Business Machines Corporation Method of forming a three dimensional high performance interconnection package
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
JPH0955457A (en) * 1995-08-15 1997-02-25 Mitsubishi Alum Co Ltd Heat sink and its manufacture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1997, no. 06 30 June 1997 (1997-06-30) *

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