WO2000026850A1 - Electronics assembly apparatus with stereo vision linescan sensor - Google Patents
Electronics assembly apparatus with stereo vision linescan sensor Download PDFInfo
- Publication number
- WO2000026850A1 WO2000026850A1 PCT/US1999/026162 US9926162W WO0026850A1 WO 2000026850 A1 WO2000026850 A1 WO 2000026850A1 US 9926162 W US9926162 W US 9926162W WO 0026850 A1 WO0026850 A1 WO 0026850A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- feature
- detector
- image
- images
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
- G01B11/024—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness by means of diode-array scanning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
- H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Operations Research (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Image Processing (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Closed-Circuit Television Systems (AREA)
- Wire Bonding (AREA)
- Stereoscopic And Panoramic Photography (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19982450T DE19982450T1 (en) | 1998-11-05 | 1999-11-05 | Electronics mounting device with stereo vision line scan sensor |
GB0014172A GB2346970A (en) | 1998-11-05 | 1999-11-05 | Electronics assembly apparatus with stereo vision linescan sensor |
KR1020007007475A KR20010033900A (en) | 1998-11-05 | 1999-11-05 | Electronics assembly apparatus with stereo vision linescan sensor |
JP2000580156A JP2002529711A (en) | 1998-11-05 | 1999-11-05 | Electronic component assembling apparatus having stereo image line scanning sensor |
Applications Claiming Priority (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10718898P | 1998-11-05 | 1998-11-05 | |
US60/107,188 | 1998-11-05 | ||
US10750598P | 1998-11-06 | 1998-11-06 | |
US60/107,505 | 1998-11-06 | ||
US13199699P | 1999-04-30 | 1999-04-30 | |
US60/131,996 | 1999-04-30 | ||
US14461699P | 1999-07-20 | 1999-07-20 | |
US14461499P | 1999-07-20 | 1999-07-20 | |
US60/144,616 | 1999-07-20 | ||
US60/144,614 | 1999-07-20 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2000026850A1 true WO2000026850A1 (en) | 2000-05-11 |
Family
ID=27537179
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/026186 WO2000026640A1 (en) | 1998-11-05 | 1999-11-04 | Electronics assembly apparatus with improved imaging system |
PCT/US1999/026076 WO2000028278A1 (en) | 1998-11-05 | 1999-11-05 | Electronics assembly apparatus with height sensing sensor |
PCT/US1999/026162 WO2000026850A1 (en) | 1998-11-05 | 1999-11-05 | Electronics assembly apparatus with stereo vision linescan sensor |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1999/026186 WO2000026640A1 (en) | 1998-11-05 | 1999-11-04 | Electronics assembly apparatus with improved imaging system |
PCT/US1999/026076 WO2000028278A1 (en) | 1998-11-05 | 1999-11-05 | Electronics assembly apparatus with height sensing sensor |
Country Status (6)
Country | Link |
---|---|
US (2) | US6610991B1 (en) |
JP (3) | JP2002529907A (en) |
KR (3) | KR20010040321A (en) |
DE (3) | DE19982498T1 (en) |
GB (3) | GB2347741A (en) |
WO (3) | WO2000026640A1 (en) |
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WO2010090605A1 (en) * | 2009-02-06 | 2010-08-12 | Agency For Science, Technology And Research | Methods for examining a bonding structure of a substrate and bonding structure inspection devices |
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US7559134B2 (en) | 2003-11-04 | 2009-07-14 | Cyberoptics Corporation | Pick and place machine with improved component placement inspection |
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US20050125993A1 (en) * | 2003-11-07 | 2005-06-16 | Madsen David D. | Pick and place machine with improved setup and operation procedure |
DE102004052884B4 (en) * | 2004-11-02 | 2010-05-20 | Siemens Electronics Assembly Systems Gmbh & Co. Kg | Illumination arrangement and optical measuring system for detecting objects |
US7359068B2 (en) * | 2004-11-12 | 2008-04-15 | Rvsi Inspection Llc | Laser triangulation method for measurement of highly reflective solder balls |
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DE102009016288B4 (en) | 2009-01-02 | 2013-11-21 | Singulus Technologies Ag | Method and device for aligning substrates |
US8144973B2 (en) * | 2009-03-24 | 2012-03-27 | Orbotech Ltd. | Multi-modal imaging |
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US20100295935A1 (en) * | 2009-05-06 | 2010-11-25 | Case Steven K | On-head component alignment using multiple area array image detectors |
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Also Published As
Publication number | Publication date |
---|---|
KR20010033888A (en) | 2001-04-25 |
GB0014172D0 (en) | 2000-08-02 |
DE19982450T1 (en) | 2001-05-17 |
DE19982498T1 (en) | 2001-02-22 |
GB0015002D0 (en) | 2000-08-09 |
JP2002529722A (en) | 2002-09-10 |
GB2346693A (en) | 2000-08-16 |
US6608320B1 (en) | 2003-08-19 |
DE19982497T1 (en) | 2001-02-01 |
KR20010040321A (en) | 2001-05-15 |
US6610991B1 (en) | 2003-08-26 |
GB2347741A (en) | 2000-09-13 |
WO2000026640A1 (en) | 2000-05-11 |
WO2000028278A1 (en) | 2000-05-18 |
WO2000028278A9 (en) | 2002-08-22 |
KR20010033900A (en) | 2001-04-25 |
GB2346970A (en) | 2000-08-23 |
JP2002529907A (en) | 2002-09-10 |
GB0014999D0 (en) | 2000-08-09 |
JP2002529711A (en) | 2002-09-10 |
KR100615912B1 (en) | 2006-08-28 |
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