WO1997038441A1 - Curing liquid resin encapsulants of microelectronics components with microwave energy - Google Patents
Curing liquid resin encapsulants of microelectronics components with microwave energy Download PDFInfo
- Publication number
- WO1997038441A1 WO1997038441A1 PCT/US1997/005828 US9705828W WO9738441A1 WO 1997038441 A1 WO1997038441 A1 WO 1997038441A1 US 9705828 W US9705828 W US 9705828W WO 9738441 A1 WO9738441 A1 WO 9738441A1
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- temperature
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- resin
- curable resin
- pcb
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01084—Polonium [Po]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Definitions
- FIG. 1 illustrates a typical prior art package for an IC chip.
- Fig. 12 illustrates the temperature differential between an encapsulating resin and a PCB during the application of variable frequency controlled microwave energy to cure the resin.
- an encapsulant is dispensed over an IC chip (COB) or is applied as underfill (flip chip) , it is cured rapidly to a solid form by irradiating it with microwave energy.
- variable frequency microwave energy 40 is applied to cure the encapsulant as shown in Fig. 6 for COB and Fig. 7 for flip chip.
- the glob top encapsulant 14 is shown in exploded view for clarity; however, it shall be understood that the glob top encapsulant, prior to curing with microwave energy 40, is dispensed on top of the microelectronics component 10 and the underlying PCB or substrate 12.
- variable frequency controlled microwave irradiation allows the appropriate frequency or range (s) of frequencies to be selected to rapidly cure the encapsulating resin without causing the IC chip to warp and without reaching the reflow temperature of solder.
- variable frequency microwave energy When heated via variable frequency microwave energy, the temperature of a PCB containing IC chips is high in the area of the IC chips and the encapsulating resin, and low in areas not containing IC chips.
- the variation of the temperature of a PCB may depend on various factors including the thickness of the PCB, thermal conductivity of the PCB material, and the printed circuit geometry on the PCB.
- the variation of the temperature of the PCB when compared to that of the IC chip/encapsulating resin area during a cure process carried out at about 160°C is in the range of about forty percent to eighty percent (40% - 80%) of the encapsulating resin cure temperature.
- Frequency sweeping would involve continuously and/or selectively launching frequencies within this range in any desirable increments, (e.g., sweeping between 2.6 and 3.3 GHz) such as 2.6001 GHz, 2.6002 GHz, 2.6003 GHz ... 3.30
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53644997A JP3414755B2 (en) | 1996-04-08 | 1997-04-04 | System and method for curing liquid resin encapsulants of microelectronic components with microwave energy |
AU26620/97A AU2662097A (en) | 1996-04-08 | 1997-04-04 | Curing liquid resin encapsulants of microelectronics components with microwave energy |
EP97918537A EP0892986A1 (en) | 1996-04-08 | 1997-04-04 | Curing liquid resin encapsulants of microelectronics components with microwave energy |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1500296P | 1996-04-08 | 1996-04-08 | |
US60/015,002 | 1996-04-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1997038441A1 true WO1997038441A1 (en) | 1997-10-16 |
Family
ID=21769026
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/US1997/005828 WO1997038441A1 (en) | 1996-04-08 | 1997-04-04 | Curing liquid resin encapsulants of microelectronics components with microwave energy |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0892986A1 (en) |
AU (1) | AU2662097A (en) |
WO (1) | WO1997038441A1 (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998012000A1 (en) * | 1996-09-19 | 1998-03-26 | Lambda Technologies, Inc. | Curing polymer layers on semiconductor substrates using variable frequency microwave energy |
WO2009030336A1 (en) * | 2007-08-31 | 2009-03-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Circuit arrangement and method for the encapsulation thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2048272A (en) * | 1979-04-26 | 1980-12-10 | Bosch Gmbh Robert | Process for the Hardening of Reactive Resins |
US5313365A (en) * | 1992-06-30 | 1994-05-17 | Motorola, Inc. | Encapsulated electronic package |
EP0598433A2 (en) * | 1992-11-09 | 1994-05-25 | ENICHEM S.p.A. | Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides |
US5450283A (en) * | 1992-11-03 | 1995-09-12 | Motorola, Inc. | Thermally enhanced semiconductor device having exposed backside and method for making the same |
WO1997002725A1 (en) * | 1995-06-30 | 1997-01-23 | Lambda Technologies, Inc. | Process for assembling electronics using microwave irradiation |
-
1997
- 1997-04-04 EP EP97918537A patent/EP0892986A1/en not_active Withdrawn
- 1997-04-04 AU AU26620/97A patent/AU2662097A/en not_active Abandoned
- 1997-04-04 WO PCT/US1997/005828 patent/WO1997038441A1/en not_active Application Discontinuation
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2048272A (en) * | 1979-04-26 | 1980-12-10 | Bosch Gmbh Robert | Process for the Hardening of Reactive Resins |
US5313365A (en) * | 1992-06-30 | 1994-05-17 | Motorola, Inc. | Encapsulated electronic package |
US5450283A (en) * | 1992-11-03 | 1995-09-12 | Motorola, Inc. | Thermally enhanced semiconductor device having exposed backside and method for making the same |
EP0598433A2 (en) * | 1992-11-09 | 1994-05-25 | ENICHEM S.p.A. | Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides |
WO1997002725A1 (en) * | 1995-06-30 | 1997-01-23 | Lambda Technologies, Inc. | Process for assembling electronics using microwave irradiation |
Non-Patent Citations (1)
Title |
---|
J. BILLY WEI AND AL.: "RECENT PROGRESS IN MICROWAVE PROCESSING OF POLYMERS AND COMPOSITES", TRIP, vol. 4, no. 1, January 1996 (1996-01-01), pages 18 - 24, XP002036724 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998012000A1 (en) * | 1996-09-19 | 1998-03-26 | Lambda Technologies, Inc. | Curing polymer layers on semiconductor substrates using variable frequency microwave energy |
WO2009030336A1 (en) * | 2007-08-31 | 2009-03-12 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Circuit arrangement and method for the encapsulation thereof |
Also Published As
Publication number | Publication date |
---|---|
AU2662097A (en) | 1997-10-29 |
EP0892986A1 (en) | 1999-01-27 |
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